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MT42L32M32D2AC-25 AIT

Specs

Orderable Parts for: MT42L32M32D2AC-25 AIT
Status Media FBGA Code SPD Data Chipset
Validation
PLP Start Date Alternative Part
MT42L32M32D2AC-25 AIT:A Obsolete N/A D9RBZ N/A N/A No N/A
Detailed Specifications
Technology LPDDR2 Density 1Gb Part Status Obsolete RoHS Yes
Depth 32Mb Width x32 Voltage 1.2V Package VFBGA
Pin Count 134-ball Clock Rate 400 MHz Data Rate LPDDR2-800 Cycle Time 2.5ns
Op. Temp. -40C to +85C Brand Micron

Sim Models & Software

Sim Models
HSpice
  • File Type: ZIP
  • Updated: 04/15/2015
IBIS
  • File Type: ZIP
  • Updated: 04/15/2015
Verilog

Version 0.96

  • File Type: ZIP
  • Updated: 02/27/2013

RoHS Certificates

RoHS Certificates
RoHS Certificate of Compliance (PDF)

Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2011/65/EU and 2015/863/EU, a.k.a. Restriction of Hazardous Substances (RoHS) Directive (Recast) without exemptions.

  • File Type: (PDF)
  • Updated: 09/2018
RoHS Certificates
China RoHS Certificate (PDF)

Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products.

  • File Type: (PDF)
  • Updated: 09/2018

Documentation & Support

See All LPDRAM Documentation
Technical Notes
Search (9) LPDRAM Technical Notes
Technical Notes


(E0598E21) This technical note describes Deep Power Down (DPD), one of the low-power functions that have been adapted to Mobile DRAM.

  • File Type: PDF
  • Updated: 02/26/2014
Technical Notes


(E0597E10) This technical note describes Partial Array Self Refresh (PASR), one of the low-power functions that have been adapted to Mobile DRAM.

  • File Type: PDF
  • Updated: 02/26/2014
Customer Service Notes
SEE ALL CUSTOMER SERVICE NOTES
Customer Service Note


(CSN-11) The first section of this customer service note describes the product marks and labels we place on our devices. The second section describes the labels used on and in our packaging.

  • File Type: PDF
  • Updated: 08/24/2018
Customer Service Note


(CSN-33) Provides information to enable customers to easily integrate both leading-edge and legacy Micron's ball grid array (BGA) packages into their manufacturing processes. It is intended as a set of high-level guidelines and a reference manual describing typical package-related and...

  • File Type: PDF
  • Updated: 12/10/2014

Where to Buy

Orderable Parts
Status Media FBGA Code SPD Data Chipset
Validation
PLP Start Date Alternative Part
MT42L32M32D2AC-25 AIT:A Obsolete N/A D9RBZ N/A N/A No N/A
Contact Your Sales Rep
Contact A Rep
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Check with Distributors
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