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EDB2432B4MA-1DIT-F

Data Sheets (1)

Data Sheet
EDB1316BD (1Gb/2KB - single die, x16), EDB1332BD (1Gb/2KB - single die, x32), EDB2432B4 (2Gb/2KB - dual die, x32), EDB4064B4 (4Gb/2KB - quad die, x64)
  • File Type: PDF
  • Updated: 11/2016

Specs

Orderable Parts for: EDB2432B4MA-1DIT-F
Status Media FBGA Code SPD Data Chipset
Validation
PLP Start Date Alternative Part
EDB2432B4MA-1DIT-F-D Production Dry Pack N/A N/A N/A No N/A
EDB2432B4MA-1DIT-F-R Production Tape & Reel N/A N/A N/A No N/A
Detailed Specifications
Technology LPDDR2 Density 2Gb Part Status Production RoHS Yes
Depth 64Mb Width x32 Voltage 1.2V Package VFBGA
Pin Count 134-ball Clock Rate 533 MHz Data Rate LPDDR2-1066 Cycle Time 1.875ns
Op. Temp. -40C to +85C Brand Micron

Sim Models & Software

Sim Models
HSpice

HSPICE for U98M AT, IT, UT, WT

  • File Type: ZIP
  • Updated: 06/20/2016
IBIS

Rev 1.1; Temp ranges supported= AT, IT, UT, WT, XT

  • File Type: ZIP
  • Updated: 06/12/2016

RoHS Certificates

RoHS Certificates
RoHS Certificate of Compliance (PDF)

Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2002/95/EC, a.k.a. Restriction of Hazardous Substances (RoHS) Directive.

  • File Type: (PDF)
  • Updated: 09/2017
RoHS Certificates
China RoHS Certificate (PDF)

Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products.

  • File Type: (PDF)
  • Updated: 09/2017

Documentation & Support

See All LPDRAM Documentation
Technical Notes
Search (3) LPDRAM Technical Notes
Technical Notes


(TN-00-01) This technical note describes shipping procedures for preventing memory devices from absorbing moisture and recommendations for baking devices exposed to excessive moisture.

  • File Type: PDF
  • Updated: 02/14/2013
Technical Notes


(TN-00-19) This technical note provides information on optimal wafer-thinning processes to meet specific customer requirements.

  • File Type: PDF
  • Updated: 10/15/2009
Technical Notes


(TN-46-12) This technical note addresses the power-saving features and power calculations of low-power Mobile LPDRAM memory.

  • File Type: PDF
  • Updated: 05/16/2009
Search (3) LPDRAM Technical Notes

Parts with the same Data Sheet (4)

EDB2432B4MA-1DIT-F ( Current ) EDB1332BDBH-1DIT-F EDB4064B4PB-1D-F EDB1316BDBH-1DIT-F EDB4064B4PB-1DIT-F
Part Status Production Production Obsolete Production Production
Technology LPDDR2 LPDDR2 LPDDR2 LPDDR2 LPDDR2
Density 2Gb 1Gb 4Gb 1Gb 4Gb
RoHS Yes Yes Yes Yes Yes
Depth 64Mb 32Mb 64Mb 64Mb 64Mb
Width x32 x32 x64 x16 x64
Voltage 1.2V 1.2V 1.2V 1.8V 1.2V
Package VFBGA FBGA WFBGA FBGA WFBGA
Pin Count 134-ball 134-ball 216-ball 134-ball 216-ball
Clock Rate 533 MHz 533 MHz 533 MHz 533 MHz
Data Rate LPDDR2-1066 LPDDR2-1066 LPDDR2-1066 LPDDR2-1066 LPDDR2-1066
Cycle Time 1.875ns 1.875ns 1.875ns 1.875ns
Op. Temp. -40C to +85C -40C to +85C -30C to +85C -40C to +85C -40C to +85C
Brand Micron Micron Micron Micron Micron

Where to Buy

Orderable Parts
Status Media FBGA Code SPD Data Chipset
Validation
PLP Start Date Alternative Part
EDB2432B4MA-1DIT-F-D Production Dry Pack N/A N/A N/A No N/A
EDB2432B4MA-1DIT-F-R Production Tape & Reel N/A N/A N/A No N/A
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