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MT46H32M32LFJG-5

Data Sheets (2)

Data Sheet
  • File Type: PDF
  • Updated: 05/2010

Specs

Orderable Parts for: MT46H32M32LFJG-5
Status Media FBGA Code SPD Data Chipset
Validation
PLP Start Date Alternative Part
MT46H32M32LFJG-5:A Obsolete N/A D9KFD N/A N/A No N/A
Detailed Specifications
Technology LPDDR Density 1Gb Part Status Obsolete RoHS Yes
Depth 32Mb Width x32 Voltage 1.8V Package POP
Pin Count 168-ball Clock Rate 200 MHz Data Rate LPDDR400 Cycle Time 5ns
Op. Temp. 0C to +70C Brand Micron

Sim Models & Software

Sim Models
IBIS

2.4 (Die Rev. A)

  • File Type: ZIP
  • Updated: 01/15/2009

RoHS Certificates

RoHS Certificates
RoHS Certificate of Compliance (PDF)

Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2011/65/EU and 2015/863/EU, a.k.a. Restriction of Hazardous Substances (RoHS) Directive (Recast) without exemptions.

  • File Type: (PDF)
  • Updated: 11/2018
RoHS Certificates
China RoHS Certificate (PDF)

Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products.

  • File Type: (PDF)
  • Updated: 11/2018

Documentation & Support

See All LPDRAM Documentation
Technical Notes
Search (9) LPDRAM Technical Notes
Technical Notes


(TN-00-01) This technical note describes shipping procedures for preventing memory devices from absorbing moisture and recommendations for baking devices exposed to excessive moisture.

  • File Type: PDF
  • Updated: 10/15/2018
Technical Notes


(E0598E21) This technical note describes Deep Power Down (DPD), one of the low-power functions that have been adapted to Mobile DRAM.

  • File Type: PDF
  • Updated: 02/26/2014
Customer Service Notes
SEE ALL CUSTOMER SERVICE NOTES
Customer Service Note


(CSN-11) The first section of this customer service note describes the product marks and labels we place on our devices. The second section describes the labels used on and in our packaging.

  • File Type: PDF
  • Updated: 11/15/2018
Customer Service Note


(CSN-33) Provides information to enable customers to easily integrate both leading-edge and legacy Micron's ball grid array (BGA) packages into their manufacturing processes. It is intended as a set of high-level guidelines and a reference manual describing typical package-related and...

  • File Type: PDF
  • Updated: 12/10/2014

Parts with the same Data Sheet (3)

MT46H32M32LFJG-5 ( Current ) MT46H32M32LFCG-5 MT46H64M32L2JG-5 IT MT46H64M32L2KQ-6 IT
Part Status Obsolete Obsolete Obsolete Obsolete
Technology LPDDR LPDDR LPDDR LPDDR
Density 1Gb 1Gb 2Gb 2Gb
RoHS Yes Yes Yes Yes
Depth 32Mb 32Mb 64Mb 64Mb
Width x32 x32 x32 x32
Voltage 1.8V 1.8V 1.8V 1.8V
Package POP POP POP POP
Pin Count 168-ball 152-ball 168-ball 168-ball
Clock Rate 200 MHz 200 MHz 200 MHz 167 MHz
Data Rate LPDDR400 LPDDR400 LPDDR400 LPDDR333
Cycle Time 5ns 5ns 5ns 6ns
Op. Temp. 0C to +70C 0C to +70C -40C to +85C -40C to +85C
Brand Micron Micron Micron Micron

Where to Buy

Orderable Parts
Status Media FBGA Code SPD Data Chipset
Validation
PLP Start Date Alternative Part
MT46H32M32LFJG-5:A Obsolete N/A D9KFD N/A N/A No N/A
Contact Your Sales Rep
Contact A Rep
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Check with Distributors
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