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MT40A8G4CLU-075H

Data Sheets (1)

Data Sheet
16Gb, 32Gb: x4, x8 3DS DDR4 SDRAM
  • File Type: PDF
  • Updated: 07/2017

Specs

Orderable Parts for: MT40A8G4CLU-075H
Status Media FBGA Code SPD Data Chipset
Validation
PLP Start Date Alternative Part
MT40A8G4CLU-075H:E Sampling N/A D9VQN N/A N/A No N/A
Detailed Specifications
Density 32Gb Part Status Production RoHS Yes Depth 8Gb
Width x4 Voltage 1.2V Package TFBGA Pin Count 78-ball
Clock Rate 1333 MHz Cycle Time Op. Temp. 0C to +95C CL CL = 22
Data Rate DDR4-2666 Brand Micron

Sim Models & Software

Sim Models
IBIS

Rev. 2.0 (Die Rev. E)

  • File Type: ZIP
  • Updated: 09/14/2018

RoHS Certificates

RoHS Certificates
RoHS Certificate of Compliance (PDF)

Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2011/65/EU and 2015/863/EU, a.k.a. Restriction of Hazardous Substances (RoHS) Directive (Recast) without exemptions.

  • File Type: (PDF)
  • Updated: 11/2018
RoHS Certificates
China RoHS Certificate (PDF)

Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products.

  • File Type: (PDF)
  • Updated: 11/2018

Documentation & Support

See All DDR4 SDRAM Documentation
Technical Notes
Search (6) DDR4 SDRAM Technical Notes
Technical Notes


(TN-00-01) This technical note describes shipping procedures for preventing memory devices from absorbing moisture and recommendations for baking devices exposed to excessive moisture.

  • File Type: PDF
  • Updated: 10/15/2018
Technical Notes


(TN-40-41) Adding ECC With DDR4 x16 Components

  • File Type: PDF
  • Updated: 08/29/2018
Customer Service Notes
SEE ALL CUSTOMER SERVICE NOTES
Customer Service Note


(CSN-11) The first section of this customer service note describes the product marks and labels we place on our devices. The second section describes the labels used on and in our packaging.

  • File Type: PDF
  • Updated: 08/24/2018
Customer Service Note


(CSN-33) Provides information to enable customers to easily integrate both leading-edge and legacy Micron's ball grid array (BGA) packages into their manufacturing processes. It is intended as a set of high-level guidelines and a reference manual describing typical package-related and...

  • File Type: PDF
  • Updated: 12/10/2014

Parts with the same Data Sheet (5)

MT40A8G4CLU-075H ( Current ) MT40A4G4DVN-062H MT40A4G4DVN-068H MT40A8G4CLU-062H MT40A8G4CLU-068H MT40A4G4DVN-075H
Part Status Production Sampling Production Production Production Production
Density 32Gb 16Gb 16Gb 32Gb 32Gb 16Gb
RoHS Yes Yes Yes Yes Yes Yes
Depth 8Gb 4Gb 4Gb 8Gb 8Gb 4Gb
Width x4 x4 x4 x4 x4 x4
Voltage 1.2V 1.2V 1.2V 1.2V 1.2V 1.2V
Package TFBGA TFBGA TFBGA TFBGA TFBGA TFBGA
Pin Count 78-ball 78-ball 78-ball 78-ball 78-ball 78-ball
Clock Rate 1333 MHz 1600 MHz 1466 MHz 1600 MHz 1866 MHz 1333 MHz
Cycle Time 0.625ns 0.682ns 0.750ns
Op. Temp. 0C to +95C 0C to +95C 0C to +95C 0C to +95C 0C to +95C 0C to +95C
CL CL = 22 CL = 26 CL = 24 CL = 26 CL = 24 CL = 22
Data Rate DDR4-2666 DDR4-3200 DDR4-2933 DDR4-3200 DDR4-2933 DDR4-2666
Brand Micron Micron Micron Micron Micron Micron

Where to Buy

Orderable Parts
Status Media FBGA Code SPD Data Chipset
Validation
PLP Start Date Alternative Part
MT40A8G4CLU-075H:E Sampling N/A D9VQN N/A N/A No N/A
Contact Your Sales Rep
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Check with Distributors
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