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MT40A1G16KNR-075

Data Sheets (1)

Twin Die Data Sheet
16Gb: x16 1.2V TwinDie Single Rank DDR4 SDRAM
  • File Type: PDF
  • Updated: 06/2018

Specs

Orderable Parts for: MT40A1G16KNR-075
Status Media FBGA Code SPD Data Chipset
Validation
PLP Start Date Alternative Part
MT40A1G16KNR-075:E Production N/A D9WFR N/A N/A No N/A
Detailed Specifications
Density 16Gb Part Status Production RoHS Yes Depth 1Gb
Width x16 Voltage 1.2V Package TFBGA Pin Count 96-ball
Clock Rate 1333 MHz Cycle Time 0.750ns Op. Temp. 0C to +95C CL CL = 19
Data Rate DDR4-2666 Brand Micron

Sim Models & Software

Sim Models
IBIS

Rev. 1.2 (Die Rev. E)

  • File Type: ZIP
  • Updated: 07/30/2018
HSpice

Rev. 1.2 (Die Rev. E)

  • File Type: ZIP
  • Updated: 07/30/2018

RoHS Certificates

RoHS Certificates
RoHS Certificate of Compliance (PDF)

Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2002/95/EC, a.k.a. Restriction of Hazardous Substances (RoHS) Directive.

  • File Type: (PDF)
  • Updated: 08/2018
RoHS Certificates
China RoHS Certificate (PDF)

Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products.

  • File Type: (PDF)
  • Updated: 08/2018

Documentation & Support

See All DDR4 SDRAM Documentation
Technical Notes
Search (6) DDR4 SDRAM Technical Notes
Technical Notes


(TN-40-40) DDR4 Point-to-Point Design Guide

  • File Type: PDF
  • Updated: 08/20/2018
Technical Notes


(TN-40-07) Details of how DDR4 SDRAM consumes power and provides the tools that system designers can use to estimate power consumption.

  • File Type: PDF
  • Updated: 08/14/2018
Customer Service Notes
SEE ALL CUSTOMER SERVICE NOTES
Customer Service Note


(CSN-11) The first section of this customer service note describes the product marks and labels we place on our devices. The second section describes the labels used on and in our packaging.

  • File Type: PDF
  • Updated: 03/08/2018
Customer Service Note


(CSN-33) Provides information to enable customers to easily integrate both leading-edge and legacy Micron's ball grid array (BGA) packages into their manufacturing processes. It is intended as a set of high-level guidelines and a reference manual describing typical package-related and...

  • File Type: PDF
  • Updated: 12/10/2014

Parts with the same Data Sheet (3)

MT40A1G16KNR-075 ( Current ) MT40A1G16HBA-083E MT40A1G16WBU-075E MT40A1G16KNR-062E
Part Status Production End of Life End of Life Production
Density 16Gb 16Gb 16Gb 16Gb
RoHS Yes Yes Yes Yes
Depth 1Gb 1Gb 1Gb 1Gb
Width x16 x16 x16 x16
Voltage 1.2V 1.2V 1.2V 1.2V
Package TFBGA FBGA FBGA TFBGA
Pin Count 96-ball 96-ball 96-ball 96-ball
Clock Rate 1333 MHz 1200 MHz 1333 MHz 1600 MHz
Cycle Time 0.750ns 0.833ns 0.750ns 0.625ns
Op. Temp. 0C to +95C 0C to +95C 0C to +95C 0C to +95C
CL CL = 19 CL = 16 CL = 18 CL = 22
Data Rate DDR4-2666 DDR4-2400 DDR4-2666 DDR4-3200
Brand Micron Micron Micron Micron

Where to Buy

Orderable Parts
Status Media FBGA Code SPD Data Chipset
Validation
PLP Start Date Alternative Part
MT40A1G16KNR-075:E Production N/A D9WFR N/A N/A No N/A
Contact Your Sales Rep
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Check with Distributors
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