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MT41K64M16TW-107 AAT

Data Sheets (2)

Data Sheet
MT41K128M8 – 16 Meg x 8 x 8 banks, MT41K64M16 – 8 Meg x 16 x 8 banks
  • File Type: PDF
  • Updated: 05/2018
Addendum
MT41K128M8 – 16 Meg x 8 x 8 banks, MT41K64M16 – 8 Meg x 16 x 8 banks
  • File Type: PDF
  • Updated: 05/2018

Specs

Orderable Parts for: MT41K64M16TW-107 AAT
Status Media FBGA Code SPD Data Chipset
Validation
PLP Start Date Alternative Part
MT41K64M16TW-107 AAT:J Production N/A D9SGH N/A N/A Yes 05/04/2011 N/A
Detailed Specifications
Density 1Gb Part Status Production RoHS Yes Depth 64Mb
Width x16 Voltage 1.35V Package FBGA Pin Count 96-ball
Clock Rate 933 MHz Cycle Time 1.071ns Op. Temp. -40C to +105C CL CL = 13
Data Rate DDR3-1866 Features

Sim Models & Software

Sim Models
IBIS
IBIS (ZIP)

Version 2.1 (for die rev. J); V88A; MT41K64M16TW-107 AUT:J

  • File Type: ZIP
  • Updated: 08/30/2018
HSpice
HSpice (ZIP)

Version 2.3 (for die rev. J); V88A; MT41K64M16TW-107 AUT:J

  • File Type: ZIP
  • Updated: 09/12/2016
Verilog
  • File Type: ZIP
  • Updated: 09/10/2015

RoHS Certificates

RoHS Certificates
RoHS Certificate of Compliance (PDF)

Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2011/65/EU and 2015/863/EU, a.k.a. Restriction of Hazardous Substances (RoHS) Directive (Recast) without exemptions.

  • File Type: (PDF)
  • Updated: 11/2018
RoHS Certificates
China RoHS Certificate (PDF)

Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products.

  • File Type: (PDF)
  • Updated: 11/2018

Documentation & Support

See All DDR3 SDRAM Documentation
Technical Notes
Search (16) DDR3 SDRAM Technical Notes
Technical Notes


(TN-41-17) This technical note explains how to migrate a PCB design that uses a Micron 8Gb DDR3L product from a 90 series single-die 96-ball package to a 100 series dual-die 96- ball package.

  • File Type: PDF
  • Updated: 10/31/2018
Technical Notes


(TN-00-01) This technical note describes shipping procedures for preventing memory devices from absorbing moisture and recommendations for baking devices exposed to excessive moisture.

  • File Type: PDF
  • Updated: 10/15/2018
Customer Service Notes
SEE ALL CUSTOMER SERVICE NOTES
Customer Service Note


(CSN-11) The first section of this customer service note describes the product marks and labels we place on our devices. The second section describes the labels used on and in our packaging.

  • File Type: PDF
  • Updated: 11/15/2018

Parts with the same Data Sheet (3)

MT41K64M16TW-107 AAT ( Current ) MT41K128M8DA-107 AIT MT41K64M16TW-107 AIT MT41K64M16TW-107 XIT
Part Status Production Contact Factory Production Production
Density 1Gb 1Gb 1Gb 1Gb
RoHS Yes Yes Yes Yes
Depth 64Mb 128Mb 64Mb 64Mb
Width x16 x8 x16 x16
Voltage 1.35V 1.35V 1.35V 1.35V
Package FBGA FBGA FBGA FBGA
Pin Count 96-ball 78-ball 96-ball 96-ball
Clock Rate 933 MHz 933 MHz 933 MHz 933 MHz
Cycle Time 1.071ns 1.071ns 1.071ns 1.071ns
Op. Temp. -40C to +105C -40C to +95C -40C to +95C -40C to +95C
CL CL = 13 CL = 13 CL = 13 CL = 13
Data Rate DDR3-1866 DDR3-1866 DDR3-1866 DDR3-1866
Features

Where to Buy

Orderable Parts
Status Media FBGA Code SPD Data Chipset
Validation
PLP Start Date Alternative Part
MT41K64M16TW-107 AAT:J Production N/A D9SGH N/A N/A Yes 05/04/2011 N/A
Contact Your Sales Rep
Contact A Rep
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Check with Distributors
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