logo-micron

Add Bookmark(s)


To:

Email


Bookmark(s) shared successfully!

Please provide at least one email address.

MT41J256M8HX-125 IT

Data Sheets (1)

Data Sheet
  • File Type: PDF
  • Updated: 02/2016

Specs

Orderable Parts for: MT41J256M8HX-125 IT
Status Media FBGA Code SPD Data Chipset
Validation
PLP Start Date Alternative Part
MT41J256M8HX-125 IT:D Obsolete N/A D9PTX N/A N/A No View

Compare

Compare MT41K256M8DA-125 IT
(Recommended Part)
MT41J256M8HX-125 IT:D
Part Status Obsolete Obsolete
Density 2Gb 2Gb
RoHS Yes Yes
Depth 256Mb 256Mb
Width x8 x8
Voltage 1.5V 1.5V
Package FBGA FBGA
Pin Count 78-ball 78-ball
Clock Rate 800 MHz 800 MHz
Cycle Time 1.25ns 1.25ns
Op. Temp. -40C to +95C -40C to +95C
CL CL = 11 CL = 11
Data Rate DDR3-1600 DDR3-1600
Features
Detailed Specifications
Density 2Gb Part Status Obsolete RoHS Yes Depth 256Mb
Width x8 Voltage 1.5V Package FBGA Pin Count 78-ball
Clock Rate 800 MHz Cycle Time 1.25ns Op. Temp. -40C to +95C CL CL = 11
Data Rate DDR3-1600 Features

Sim Models & Software

Sim Models
Verilog
  • File Type: ZIP
  • Updated: 09/10/2015

RoHS Certificates

RoHS Certificates
RoHS Certificate of Compliance (PDF)

Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2011/65/EU and 2015/863/EU, a.k.a. Restriction of Hazardous Substances (RoHS) Directive (Recast) without exemptions.

  • File Type: (PDF)
  • Updated: 11/2018
RoHS Certificates
China RoHS Certificate (PDF)

Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products.

  • File Type: (PDF)
  • Updated: 11/2018

Documentation & Support

See All DDR3 SDRAM Documentation
Technical Notes
Search (16) DDR3 SDRAM Technical Notes
Technical Notes


(TN-41-17) This technical note explains how to migrate a PCB design that uses a Micron 8Gb DDR3L product from a 90 series single-die 96-ball package to a 100 series dual-die 96- ball package.

  • File Type: PDF
  • Updated: 10/31/2018
Technical Notes


(TN-00-01) This technical note describes shipping procedures for preventing memory devices from absorbing moisture and recommendations for baking devices exposed to excessive moisture.

  • File Type: PDF
  • Updated: 10/15/2018
Customer Service Notes
SEE ALL CUSTOMER SERVICE NOTES
Customer Service Note


(CSN-11) The first section of this customer service note describes the product marks and labels we place on our devices. The second section describes the labels used on and in our packaging.

  • File Type: PDF
  • Updated: 11/15/2018

Parts with the same Data Sheet (2)

MT41J256M8HX-125 IT ( Current ) MT41J128M16JT-093 J MT41J128M16JT-125
Part Status Obsolete Obsolete Production
Density 2Gb 2Gb 2Gb
RoHS Yes Yes Yes
Depth 256Mb 128Mb 128Mb
Width x8 x16 x16
Voltage 1.5V 1.5V 1.5V
Package FBGA FBGA FBGA
Pin Count 78-ball 96-ball 96-ball
Clock Rate 800 MHz 1066 MHz 800 MHz
Cycle Time 1.25ns 938ps 1.25ns
Op. Temp. -40C to +95C 0C to +95C 0C to +95C
CL CL = 11 CL = 14 CL = 11
Data Rate DDR3-1600 DDR3-2133 DDR3-1600
Features Reduced tFAW

Where to Buy

Orderable Parts
Status Media FBGA Code SPD Data Chipset
Validation
PLP Start Date Alternative Part
MT41J256M8HX-125 IT:D Obsolete N/A D9PTX N/A N/A No View

Compare

Compare MT41K256M8DA-125 IT
(Recommended Part)
MT41J256M8HX-125 IT:D
Part Status Obsolete Obsolete
Density 2Gb 2Gb
RoHS Yes Yes
Depth 256Mb 256Mb
Width x8 x8
Voltage 1.5V 1.5V
Package FBGA FBGA
Pin Count 78-ball 78-ball
Clock Rate 800 MHz 800 MHz
Cycle Time 1.25ns 1.25ns
Op. Temp. -40C to +95C -40C to +95C
CL CL = 11 CL = 11
Data Rate DDR3-1600 DDR3-1600
Features
Contact Your Sales Rep
Contact A Rep
- OR -
Check with Distributors
See All Distributors