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MT47H512M4THN-3

Data Sheets (3)

Data Sheet
  • File Type: PDF
  • Updated: 09/2018
Addendum
  • File Type: PDF
  • Updated: 09/2014
Twin Die Data Sheet
  • File Type: PDF
  • Updated: 07/2010

Specs

Orderable Parts for: MT47H512M4THN-3
Status Media FBGA Code SPD Data Chipset
Validation
PLP Start Date Alternative Part
MT47H512M4THN-3:H Obsolete N/A D9LKQ N/A N/A No View

Compare

Compare MT47H512M4THN-25E
(Recommended Part)
MT47H512M4THN-3:H
Part Status Obsolete End of Life Obsolete
Density 2Gb 2Gb 2Gb
RoHS Yes Yes Yes
Depth 512Mb 512Mb 512Mb
Width x4 x4 x4
Voltage 1.8V 1.8V 1.8V
Package FBGA FBGA FBGA
Pin Count 63-ball 63-ball 63-ball
Clock Rate 333 MHz 400 MHz 333 MHz
Cycle Time 3ns 2.5ns 3ns
Op. Temp. 0C to +85C 0C to +85C 0C to +85C
CL CL = 5 CL = 5 CL = 5
Data Rate DDR2-667 DDR2-800 DDR2-667
Detailed Specifications
Density 2Gb Part Status Obsolete RoHS Yes Depth 512Mb
Width x4 Voltage 1.8V Package FBGA Pin Count 63-ball
Clock Rate 333 MHz Cycle Time 3ns Op. Temp. 0C to +85C CL CL = 5
Data Rate DDR2-667

Sim Models & Software

Sim Models
IBIS
IBIS (ZIP)

2.3 (Die Rev. H)

  • File Type: ZIP
  • Updated: 03/01/2011
HSpice
HSpice (ZIP)

2.3 (Die Rev. H)

  • File Type: ZIP
  • Updated: 03/01/2011
Verilog
  • File Type: ZIP
  • Updated: 04/29/2010

RoHS Certificates

RoHS Certificates
RoHS Certificate of Compliance (PDF)

Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2011/65/EU and 2015/863/EU, a.k.a. Restriction of Hazardous Substances (RoHS) Directive (Recast) without exemptions.

  • File Type: (PDF)
  • Updated: 11/2018
RoHS Certificates
China RoHS Certificate (PDF)

Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products.

  • File Type: (PDF)
  • Updated: 11/2018

Documentation & Support

See All DDR2 SDRAM Documentation
Technical Notes
Search (17) DDR2 SDRAM Technical Notes
Technical Notes


(TN-00-01) This technical note describes shipping procedures for preventing memory devices from absorbing moisture and recommendations for baking devices exposed to excessive moisture.

  • File Type: PDF
  • Updated: 10/15/2018
Technical Notes


(TN-47-04) This technical note details how DDR2 SDRAM consumes power and provides tools to estimate power consumption in a given system.

  • File Type: PDF
  • Updated: 03/18/2011
Customer Service Notes
SEE ALL CUSTOMER SERVICE NOTES
Customer Service Note


(CSN-11) The first section of this customer service note describes the product marks and labels we place on our devices. The second section describes the labels used on and in our packaging.

  • File Type: PDF
  • Updated: 08/24/2018
Customer Service Note


(CSN-33) Provides information to enable customers to easily integrate both leading-edge and legacy Micron's ball grid array (BGA) packages into their manufacturing processes. It is intended as a set of high-level guidelines and a reference manual describing typical package-related and...

  • File Type: PDF
  • Updated: 12/10/2014

Parts with the same Data Sheet (3)

MT47H512M4THN-3 ( Current ) MT47H256M8THN-3 MT47H512M4THN-25E MT47H256M8THN-25E
Part Status Obsolete Obsolete End of Life Contact Factory
Density 2Gb 2Gb 2Gb 2Gb
RoHS Yes Yes Yes Yes
Depth 512Mb 256Mb 512Mb 256Mb
Width x4 x8 x4 x8
Voltage 1.8V 1.8V 1.8V 1.8V
Package FBGA FBGA FBGA FBGA
Pin Count 63-ball 63-ball 63-ball 63-ball
Clock Rate 333 MHz 333 MHz 400 MHz 400 MHz
Cycle Time 3ns 3ns 2.5ns 2.5ns
Op. Temp. 0C to +85C 0C to +85C 0C to +85C 0C to +85C
CL CL = 5 CL = 5 CL = 5 CL = 5
Data Rate DDR2-667 DDR2-667 DDR2-800 DDR2-800

Where to Buy

Orderable Parts
Status Media FBGA Code SPD Data Chipset
Validation
PLP Start Date Alternative Part
MT47H512M4THN-3:H Obsolete N/A D9LKQ N/A N/A No View

Compare

Compare MT47H512M4THN-25E
(Recommended Part)
MT47H512M4THN-3:H
Part Status Obsolete End of Life Obsolete
Density 2Gb 2Gb 2Gb
RoHS Yes Yes Yes
Depth 512Mb 512Mb 512Mb
Width x4 x4 x4
Voltage 1.8V 1.8V 1.8V
Package FBGA FBGA FBGA
Pin Count 63-ball 63-ball 63-ball
Clock Rate 333 MHz 400 MHz 333 MHz
Cycle Time 3ns 2.5ns 3ns
Op. Temp. 0C to +85C 0C to +85C 0C to +85C
CL CL = 5 CL = 5 CL = 5
Data Rate DDR2-667 DDR2-800 DDR2-667
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