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MT47H32M16NF-25E IT

Data Sheets (1)

Data Sheet
  • File Type: PDF
  • Updated: 06/2017

Specs

Orderable Parts for: MT47H32M16NF-25E IT
Status Media FBGA Code SPD Data Chipset
Validation
PLP Start Date Alternative Part
MT47H32M16NF-25E IT:H Production N/A D9SBV N/A N/A No N/A
Detailed Specifications
Density 512Mb Part Status Production RoHS Yes Depth 32Mb
Width x16 Voltage 1.8V Package FBGA Pin Count 84-ball
Clock Rate 400 MHz Cycle Time 2.5ns Op. Temp. -40C to +95C CL CL = 5
Data Rate DDR2-800

Sim Models & Software

Sim Models
HSpice
  • File Type: ZIP
  • Updated: 02/05/2016
IBIS
  • File Type: ZIP
  • Updated: 02/05/2016
Verilog
  • File Type: ZIP
  • Updated: 04/29/2010

RoHS Certificates

RoHS Certificates
RoHS Certificate of Compliance (PDF)

Part-specific certification of how this product meets the requirements of the current DIRECTIVE 2002/95/EC, a.k.a. Restriction of Hazardous Substances (RoHS) Directive.

  • File Type: (PDF)
  • Updated: 08/2018
RoHS Certificates
China RoHS Certificate (PDF)

Part-specific certification as required by China's Management Methods for Controlling Pollution by Electronic Information Products.

  • File Type: (PDF)
  • Updated: 08/2018

Documentation & Support

See All DDR2 SDRAM Documentation
Technical Notes
Search (17) DDR2 SDRAM Technical Notes
Technical Notes


(TN-00-01) This technical note describes shipping procedures for preventing memory devices from absorbing moisture and recommendations for baking devices exposed to excessive moisture.

  • File Type: PDF
  • Updated: 02/14/2013
Technical Notes


(TN-47-04) This technical note details how DDR2 SDRAM consumes power and provides tools to estimate power consumption in a given system.

  • File Type: PDF
  • Updated: 03/18/2011
Customer Service Notes
SEE ALL CUSTOMER SERVICE NOTES
Customer Service Note


(CSN-11) The first section of this customer service note describes the product marks and labels we place on our devices. The second section describes the labels used on and in our packaging.

  • File Type: PDF
  • Updated: 03/08/2018
Customer Service Note


(CSN-33) Provides information to enable customers to easily integrate both leading-edge and legacy Micron's ball grid array (BGA) packages into their manufacturing processes. It is intended as a set of high-level guidelines and a reference manual describing typical package-related and...

  • File Type: PDF
  • Updated: 12/10/2014

Parts with the same Data Sheet (3)

MT47H32M16NF-25E IT ( Current ) MT47H64M8SH-25E MT47H32M16NF-25E MT47H32M16NF-187E
Part Status Production Production Production Obsolete
Density 512Mb 512Mb 512Mb 512Mb
RoHS Yes Yes Yes Yes
Depth 32Mb 64Mb 32Mb 32Mb
Width x16 x8 x16 x16
Voltage 1.8V 1.8V 1.8V 1.8V
Package FBGA FBGA FBGA FBGA
Pin Count 84-ball 60-ball 84-ball 84-ball
Clock Rate 400 MHz 400 MHz 400 MHz 533 MHz
Cycle Time 2.5ns 2.5ns 2.5ns 1.875ns
Op. Temp. -40C to +95C 0C to +85C 0C to +85C 0C to +85C
CL CL = 5 CL = 5 CL = 5 CL = 7
Data Rate DDR2-800 DDR2-800 DDR2-800 DDR2-1066

Where to Buy

Orderable Parts
Status Media FBGA Code SPD Data Chipset
Validation
PLP Start Date Alternative Part
MT47H32M16NF-25E IT:H Production N/A D9SBV N/A N/A No N/A
Contact Your Sales Rep
Contact A Rep
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Check with Distributors
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