Engineering the Future for University Students
Today’s university students are already tomorrow’s innovators. Micron partners with universities around the world to provide hands-on research opportunities for undergraduate and graduate students in semiconductor-related fields. This may include fellowships, support for student competitions and participation in research symposiums.
By providing these opportunities, the students have the knowledge and background to be ready when they step off campus to begin their careers, furthering the advancement of semiconductor materials, devices and processes.
Science and engineering students at Micron’s partner universities should contact their engineering faculty to learn how they can participate in these programs.
Our University Relations programs are active all over the world with relationships and projects at each of the following universities:
- Boise State University
- Brigham Young University
- George Mason University
- Iowa State University
- Rochester Institute of Technology
- Stanford University
- University of California, Berkeley
- University of Idaho
- University of Utah
- University of Virginia
- University of Washington
- Utah State University
- Virginia Commonwealth
- Virginia Tech
- Nanyang Technological University
- National University of Singapore
- Politecnico di Milano
- University of Catania
- University of L'Aquila
- University of Milano Bicocca
- University of Napoli “Federico II”
- University of Napoli “Parthenope”
- University of Napoli “Seconda Università degli Studi”
- University of Padova
- University of Pavia
- University of Roma "La Sapienza"
- University of Napoli Salerno
- University of Napoli Sannio
- Fudan University
- University of Bristol
Engineering the future: Micron supports college of engineering programs for students
Engineering students at Boise State University’s college of engineering have opportunities for real-time, hands-on learning. Related research in Boise State’s Material Science Engineering department ranges from using DNA as nanoscale scaffolding for groundbreaking biomedical devices to developing new materials to withstand environmental conditions such as extreme heat, corrosive gas and radiation. An undergraduate degree program and two master’s degree programs bridge the pure and applied sciences and produce graduates with interdisciplinary skills that are in demand, and the addition of a doctoral program promises direct benefits for the university and many areas of industry, including Micron’s semiconductor industry.
“We continue to be impressed with the trajectory of Boise State’s Materials Science and Engineering Department. Micron’s contribution to this program is a great investment in the future of our Company, community and the State of Idaho,” said former Micron CEO Steve Appleton. “A doctorate program focused on materials science and engineering will strengthen Boise State’s ability to develop breakthrough technologies and help create the associated broad-based economic and societal benefits.”
“By investing in Boise State, Micron is investing in the future of the high-tech workforce and the proud tradition of American creativity,” said Boise State President Bob Kustra. “Innovative materials drive the creation of critical new technologies, industries and ways of life. This landmark gift will position Boise State’s materials science program as one of the top research engines in the region and we are grateful for Micron’s continued support.”