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Product Information

LPDDR3 Obsolete Part Catalog

Product Information

LPDRAM Part Catalog

On June 18th, 2014, Micron’s Daniel Skinner was honored with JEDEC’s Award of Excellence. The award is the highest honor given by JEDEC—the leading global standards organization for the microelectronics industry. It recognizes just one out of its more than 3,000 members for...

  • Publication Date: 06/19/2014
  • Author: Corporate Communication

I just attended the Linley Mobile Conference in Santa Clara, CA. The event gave me and some of my fellow colleagues in Micron’s Mobile group a great opportunity to see firsthand what is resonating with mobile device, chip, and software designers—along with other contributors...

  • Publication Date: 05/19/2014
  • Author: Ken Steck

LPDDR3 System Power Calculations

  • Last Updated: 03/24/2015
  • File Type: XLSM

Daisy chain products are constructed as fit and form compatible packages to “live” products and are typically used for solder joint reliability (SJR) testing, board interconnect verification, and characterization of assembly processes. This daisy chain package consists of a...

  • Last Updated: 03/18/2016
  • File Type: PDF

HSPICE for V9AM

  • Last Updated: 08/29/2017
  • File Type: ZIP

Verilog simulation model for 8Gb Mobile LPDDR3

  • Last Updated: 09/15/2016
  • File Type: ZIP

Verilog simulation model for 4Gb Mobile LPDDR3

  • Last Updated: 08/28/2014
  • File Type: ZIP

Rev. 2.0

  • Last Updated: 03/18/2013
  • File Type: ZIP