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Product Information

Whether you’re trying to minimize power consumption, maximize density, increase speed, or do everything at once, Micron’s NAND MCPs can drive your design no matter the application.

HSpice

REV 1.0

  • Last Updated: 01/10/2011
  • File Type: ZIP
IBIS

REV 1.0

  • Last Updated: 01/10/2011
  • File Type: ZIP
IBIS

REV 1.1

  • Last Updated: 01/10/2011
  • File Type: ZIP

MT29C2DCMF-DC; Daisy chain products are constructed as fit- and form compatible packages to “live” products and are typically used for solder joint reliability (SJR) testing, board interconnect verification, and characterization of assembly processes.

  • Last Updated: 05/25/2016
  • File Type: PDF

4Gbit NAND and 4Gbit LPDDR2 168-Ball MCP

  • Last Updated: 08/01/2016
  • File Type: ZIP

4Gbit NAND and 4Gbit/8Gbit LPDDR2 240-Ball MCP

  • Last Updated: 07/22/2016
  • File Type: ZIP

MT29RZ2B2CZZNGSP-25W.4E1, 2Gb NAND x8 34nm + 2Gb Elpida LPDDR2 x16 30nm 162-Balls

  • Last Updated: 08/04/2014
  • File Type: ZIP

J80C; IBIS MT29RZ4B4DZZMGWD-18 I.80C

  • Last Updated: 09/26/2016
  • File Type: ZIP

J85G; MT29RZ1C1CZZHGTN-18I.85G

  • Last Updated: 07/11/2016
  • File Type: ZIP