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Customer Service Note

Provides several well-established guidelines for package-on-package (PoP) semiconductor package design and assembly, which requires unique considerations in both the up-front design and the manufacturing process.

  • Last Updated: 05/16/2016
  • File Type: PDF

Explanation of Micron packaging labels and procedures.

  • Last Updated: 03/20/2018
  • File Type: PDF
Customer Service Note

Provides information to enable customers to easily integrate both leading-edge and legacy Micron's ball grid array (BGA) packages into their manufacturing processes. It is intended as a set of high-level guidelines and a reference manual describing typical package-related and...

  • Last Updated: 12/10/2014
  • File Type: PDF

The first section of this customer service note describes the product marks and labels we place on our devices. The second section describes the labels used on and in our packaging.

  • Last Updated: 08/24/2018
  • File Type: PDF