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Next generation, autonomous communication modules require a small memory footprint, fast speeds and low power consumption. To meet these needs, Micron is investing in the next generation of SLC NAND based MCPs that will be stacked with LPDDR4 versus the current mainstream...

  • Publication Date: 09/25/2017
  • Author: Amanda Henderson
Blog

MCP’s or Multi Chip Packages as they are commonly referred to in the memory industry, are single packages with multiple memory devices inside. While the traditional definition of an MCP could include packages with multiple die of the same technology (like DRAM, NOR or NAND),...

  • Publication Date: 06/28/2016
  • Author: Jim Cooke

In late August, we announced our first ever mobile 3D NAND memory products, enabling our smartphone customers to pack in a lot more storage capacity into a smaller footprint. While bringing this new 3D architecture to mobile is significant, perhaps even more exciting was our...

  • Publication Date: 11/10/2016
  • Author: Dan Bingham

For most people, a wearable is synonymous with a smartwatch or a fitness monitor, devices that have grown over the years into mature products. While there continues to be room for innovation in each of these device categories, both have “crossed the chasm” – a marketing...

  • Publication Date: 02/11/2016
  • Author: Harsha Nagaraju