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This week I am attending International Supercomputing (ISC) 2016 in Frankfurt, Germany. ISC is considered "the event" for High Performance Computing (HPC), Networking, and Storage. The world's leaders in HPC get together to show off innovations and exciting new advances in...

  • Publication Date: 06/23/2016
  • Author: Dean Klein

This week I am attending International Supercomputing (ISC) 2016 in Frankfurt, Germany. ISC is considered "the event" for High Performance Computing (HPC), Networking, and Storage. Today I will share some findings and trends from the show floor. There is a lot of talk here...

  • Publication Date: 06/24/2016
  • Author: Dean Klein

This year was a first for me—the first year I attended Electronica China and the third year that Micron participated. From March 17–19, Micron participated at Electronica Shanghai with individual sections covering the embedded applications supported by Micron memory.

  • Publication Date: 04/13/2015
  • Author: James Hawley

Standby power savings are becoming increasingly important as computing devices continue to shrink leaving less room for large batteries, and come loaded with advanced features such as instant-on and Microsoft’s Connected Standby. DDR3L-RS (formerly referred to as DDR3Lm) is...

  • Publication Date: 01/08/2013
  • Author: Kris Kido

I attended this year’s Supercomputing Conference (SC13) a few weeks ago and have finally had a chance to sift through all the news announcements, technical sessions, and meeting notes to provide you with a few highlights.

  • Publication Date: 12/13/2013
  • Author: Richard Murphy

Today we announced a solution for an intrinsic DDR3 timing constraint that has been impacting our customers’ system performance. This is great news for networking apps, where tRRD and tFAW timing specifications can restrict much-needed data throughput.

  • Publication Date: 12/17/2013
  • Author: Troy Quick

Today’s ultrathins are all about being the sleekest, lightest, and highest-performance devices available—and we have the DRAM solutions to help you get there. Let’s look at how Micron’s new DRAM form factors reduce system height and saves valuable board space.

  • Publication Date: 02/07/2013
  • Author: Kris Kido

Optimizing High-speed, Embedded Memory Interface Designs. Designers of energy-efficient, high-speed memory subsystems for small form factor or power-sensitive embedded and wireless products are often making the shift from traditional DDR2/DDR3 to low power (LP) DDR2/DDR3...

  • Publication Date: 03/08/2013
  • Author: Steve Durnal

Our latest DRAM product rounds out our DDR3 offering in a big way for high-end networking and graphics customers. These new 1066 MHz, 2133 MT/s data rate DDR3 devices can boost your bandwidth by as much as 33%, without significantly increasing power consumption.

  • Publication Date: 06/11/2012
  • Author: Steven King

In 2013, I was fortunate enough to help develop Avnet’s MicroZed system-on-module (SOM) board based on Xilinx’s Zynq™-7000 all-programmable system on a chip (SOC).

  • Publication Date: 09/23/2014
  • Author: Bryan Fletcher