logo-micron
Products
  • Memory
  • Storage
Solutions
  • By Industry
  • By Application
Content Types
  • Most Popular
  • All Content Types (A-Z)
    • Data Sheet
Part Catalog

NVDIMM Part Catalog

The mobility revolution continues to drive the exploding demand for networking bandwidth. We’re addressing this challenge with new memory solutions that deliver equally revolutionary results for your networking design.

The Linley processor conference historically has been around processor development. This year's conference was the same but with a twist. Many of the processor developments were framed around, or had something to do with Machine Learning.

  • Publication Date: 10/09/2017
  • Author: Jay Walstrum

This week at the Linley Processor Conference Micron announced our new GDDR6N technology – the latest high-performance GDDR technology for networking. This follows our automotive announcement at Mobile World Congress Americas a few weeks ago.

  • Publication Date: 10/04/2017
  • Author: Jay Walstrum

Join us to discover the latest update regarding high performance memory products! Graphics memory presents the most compelling cost-to-performance memory solution to address the aggressive bandwidth requirements of high-end networking applications. The upcoming release of the...

  • Publication Date: 09/27/2017
  • Author: Jay Walstrum

Today we announced a solution for an intrinsic DDR3 timing constraint that has been impacting our customers’ system performance. This is great news for networking apps, where tRRD and tFAW timing specifications can restrict much-needed data throughput.

  • Publication Date: 12/17/2013
  • Author: Troy Quick

Our latest DRAM product rounds out our DDR3 offering in a big way for high-end networking and graphics customers. These new 1066 MHz, 2133 MT/s data rate DDR3 devices can boost your bandwidth by as much as 33%, without significantly increasing power consumption.

  • Publication Date: 06/11/2012
  • Author: Steven King

Today, Micron and Xilinx jointly announced our hardware demonstration of an FPGA interfacing to RLDRAM® 3 memory. For us, this announcement is exciting because it's a great example of what’s possible when industry leaders collaborate.

  • Publication Date: 03/13/2012
  • Author: Troy Quick

You can always spot the early adopters of new technologies; like pioneers, they’re the ones with the arrows in their backs. But like the pioneers, they brave technology’s new frontiers for the very same reasons—tremendous opportunity and huge competitive advantage. And also...

  • Publication Date: 07/16/2015
  • Author: Susan Platt

As the hybrid memory cube architecture matures and the enabling ecosystem develops, it follows that the form factors incorporating HMC will proliferate—and they have, thanks to the development efforts of innovative organizations like Pico Computing.

  • Publication Date: 07/15/2015
  • Author: Susan Platt