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Your computing and mobile devices require the ever-increasing high performance and energy efficiency that the Universal Flash Storage (UFS) interface was designed for. Our UFS 2.1 products — the next-generation successor to the e.MMC 5.1 interface options — are set to enable...

Product Information

Our UFS-based multichip packages (uMCPs) take advantage of the ultra-fast Universal Flash Storage (UFS) 2.1 controller to provide big performance and power savings in a small footprint for slim designs.

Product Information

With 3X the capacity of existing planar NAND solutions, our 3D NAND solutions bring the kind of high performance and reliability required for numerous applications.

Mobile devices are the remote control for the connected life. Give your customers the rich, immersive mobile experience they’re looking for by leveraging our low-power, high-performance memory products and system solutions, deep technical expertise, and dedication to...

I spoke Friday at the IEEE Workshop on Microelectronics and Electron Devices (WMED) in Boise about a memory-centric vision for the future of computing. This was my first time at this workshop, and I was very impressed by two things: the high caliber of the talks and the fact...

  • Publication Date: 04/30/2013
  • Author: Richard Murphy

With the proliferation of mobile devices, gaming has broken its tether to the living room and is now enjoyed everywhere. In fact, according to the latest study from the NPD market research group, 59% of total game play is done on a mobile device. Market research firm Mintel...

  • Publication Date: 12/27/2012
  • Author: Bill Randolph

PCM (PCM) in the mobile handset market is a game-changer because of its performance, software simplification, and reliability. Cell phones today have enabled NAND-Based MCP solutions for read operations and random access capabilities; however, Micron’s PCM-based MCP solution...

  • Publication Date: 07/27/2012
  • Author: Brian Bradford
Product Information

If you’re designing a next-generation mobile user experience, Micron’s innovative 64-layer triple-level cell (TLC) 3D NAND technology solves the storage performance challenge. It delivers the speed and features you require — with higher capacity than previous generation NAND...

MWC18 may be over, but the excitement continues. Hear what company insiders from Qualcomm, Essential, LG and Micron had to say about mobile innovations.

  • Publication Date: 03/20/2018
  • Author: Dan Bingham

2017 was the year artificial intelligence finally arrived in our smartphones. Because the AI chips in these phones must be able to deliver speedy, accurate decisions from local data, they are reliant upon faster and more innovative system memory and storage.

  • Publication Date: 03/06/2018
  • Author: Dan Bingham