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Product Information

Micron’s MCPs are optimized for automotive quality with high performance, high quality, power efficiency, wide density ranges, small package sizes, and industrial temperature ranges.

Product Information

Get the critical features and functions for your design—including high performance, high quality, power efficiency, wide density ranges, small package sizes, and industrial temperature ranges—from our broad portfolio of industry-standard multichip packages (MCPs).

Software Documentation

Micron's NANDcode™ suite of software for NAND Flash-based MCPs and PoPs gives you the key to optimized performance.

Product Information

Whether you’re trying to minimize power consumption, maximize density, increase speed, or do everything at once, Micron’s NAND MCPs can drive your design no matter the application.

Next generation, autonomous communication modules require a small memory footprint, fast speeds and low power consumption. To meet these needs, Micron is investing in the next generation of SLC NAND based MCPs that will be stacked with LPDDR4 versus the current mainstream...

  • Publication Date: 09/25/2017
  • Author: Amanda Henderson
Blog

MCP’s or Multi Chip Packages as they are commonly referred to in the memory industry, are single packages with multiple memory devices inside. While the traditional definition of an MCP could include packages with multiple die of the same technology (like DRAM, NOR or NAND),...

  • Publication Date: 06/28/2016
  • Author: Jim Cooke

In late August, we announced our first ever mobile 3D NAND memory products, enabling our smartphone customers to pack in a lot more storage capacity into a smaller footprint. While bringing this new 3D architecture to mobile is significant, perhaps even more exciting was our...

  • Publication Date: 11/10/2016
  • Author: Dan Bingham

For most people, a wearable is synonymous with a smartwatch or a fitness monitor, devices that have grown over the years into mature products. While there continues to be room for innovation in each of these device categories, both have “crossed the chasm” – a marketing...

  • Publication Date: 02/11/2016
  • Author: Harsha Nagaraju

Micron's FBGA & Component Marking Decoder makes it easy to lookup the five-digit FBGA code or part number. Just plug in the code and click search.

Customer Service Note

Provides several well-established guidelines for package-on-package (PoP) semiconductor package design and assembly, which requires unique considerations in both the up-front design and the manufacturing process.

  • Last Updated: 05/16/2016
  • File Type: PDF