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Knights Landing, Intel’s next-generation Xeon Phi™ CPU architecture, leverages the fundamental DRAM and stacking technologies found in our high-performance, on-package memory, the Hybrid Memory Cube (HMC).

Product Information

The Hybrid Memory Cube (HMC) is a small, high-speed logic layer that sits below vertical stacks of DRAM die that are connected using through-silicon-via (TSV) interconnects. HMC represents a fundamental change in how memory is used in the system.

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Short-Reach Hybrid Memory Cube (HMC) Part Catalog

Short-Reach Hybrid Memory Cube (HMC) Obsolete Part Catalog

At Micron, we’re always excited by the rise of a new 3D semiconductor architecture. So much so that on December 11, I gave an overview and outlook of 3D memory solutions to a full house at the 11th annual 3D Architectures for Semiconductor Integration and Packing (3D ASIP)...

  • Publication Date: 12/22/2014
  • Author: Rob Sturgill

Altera Corporation is the first to create a development board that demonstrates interoperability between our Hybrid Memory Cube (HMC) and Altera’s Stratix® V field programmable gate arrays (FPGAs).

After much industry anticipation, we’re shipping the world’s first 2GB Hybrid Memory Cube (HMC) engineering samples. Customers can now harness the revolutionary power of HMC in their designs to deliver unprecedented levels of bandwidth and power efficiency to their systems.

Frequently Asked Questions

Frequently asked questions (FAQs) about Micron's Short-Reach Hybrid Memory Cube (HMC) technology.

Micron's FBGA & Component Marking Decoder makes it easy to lookup the five-digit FBGA code or part number. Just plug in the code and click search.

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与DDR3模块相比,HMC移动数据加快15倍、能耗降低70%,占用面积比现有存储器技术减少90%。HMC的抽象接口以及先进的可靠性、可用性和可维护性(RAS)可降低复杂性和提供更高的可靠性——前所未有地支持您的创新和降低总拥有成本。