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Product Information

Short-Reach Hybrid Memory Cube (HMC) Part Catalog

Knights Landing, Intel’s next-generation Xeon Phi™ CPU architecture, leverages the fundamental DRAM and stacking technologies found in our high-performance, on-package memory, the Hybrid Memory Cube (HMC).

Product Information

The Hybrid Memory Cube (HMC) is a small, high-speed logic layer that sits below vertical stacks of DRAM die that are connected using through-silicon-via (TSV) interconnects. HMC represents a fundamental change in how memory is used in the system.

Short-Reach Hybrid Memory Cube (HMC) Obsolete Part Catalog

This user guide discusses various requirements and best practices for designing an end product using HMC Gen2.

  • Last Updated: 07/28/2016
  • File Type: PDF

HMC Gen2 data sheet

  • Last Updated: 04/17/2017
  • File Type: PDF
Product Information

Micron's broad portfolio of high-performance technologies and products—including DRAM, NAND and NOR Flash—is the basis for solid state drives, modules, multichip packages and other system solutions.

Frequently Asked Questions

Frequently asked questions (FAQs) about Micron's Hybrid Memory Cube (HMC).

Altera Corporation is the first to create a development board that demonstrates interoperability between our Hybrid Memory Cube (HMC) and Altera’s Stratix® V field programmable gate arrays (FPGAs).

After much industry anticipation, we’re shipping the world’s first 2GB Hybrid Memory Cube (HMC) engineering samples. Customers can now harness the revolutionary power of HMC in their designs to deliver unprecedented levels of bandwidth and power efficiency to their systems.