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Micron’s returned material authorization (RMA) procedures are similar for both packaged devices and bare die devices. However, some differences are required because die can be damaged very easily if they are not handled and stored properly. This customer service note outlines...

Customer Service Note

Provides several well-established guidelines for package-on-package (PoP) semiconductor package design and assembly, which requires unique considerations in both the up-front design and the manufacturing process.

  • Last Updated: 05/16/2016
  • File Type: PDF
Customer Service Note

Discusses Micron's lead-frame package options

  • Last Updated: 05/27/2011
  • File Type: PDF
Customer Service Note

Explains Micron's product change notification and end-of-life systems.

  • Last Updated: 12/02/2015
  • File Type: PDF
Customer Service Note

Provides information to enable customers to easily integrate both leading-edge and legacy Micron's ball grid array (BGA) packages into their manufacturing processes. It is intended as a set of high-level guidelines and a reference manual describing typical package-related and...

  • Last Updated: 12/10/2014
  • File Type: PDF

Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs.

  • Last Updated: 08/05/2010
  • File Type: PDF

Outlines standard returned material authorization (RMA) procedures, as well as the differences associated with bare die RMAs.

  • Last Updated: 01/21/2014
  • File Type: PDF

The first section of this customer service note describes the product marks and labels we place on our devices. The second section describes the labels used on and in our packaging.

  • Last Updated: 10/11/2017
  • File Type: PDF
Customer Service Note

Describes the testing specifications and parameters for Micron's KGD-C1 and KGD-C2 DRAM die.

  • Last Updated: 07/30/2008
  • File Type: PDF

Includes procedures for how to properly handle modules and SSDs.

  • Last Updated: 05/31/2013
  • File Type: PDF