logo-micron
Products
  • Memory
      • e.MMC-Based MCP
  • Storage
Solutions
  • By Industry
  • By Application
Content Types
  • Most Popular
  • All Content Types (A-Z)

Describes bypass capacitor selection for high-speed designs.

  • Last Updated: 03/23/2011
  • File Type: PDF

This technical note describes how serial presence-detect (SPD) is essential in helping to standardize the configuration, timing, and manufacturing information of memory modules.

  • Last Updated: 12/16/2009
  • File Type: PDF

This technical note compares module parameters at different densities.

  • Last Updated: 03/16/2003
  • File Type: PDF

This technical note describes shipping procedures for preventing memory devices from absorbing moisture and recommendations for baking devices exposed to excessive moisture.

  • Last Updated: 02/14/2013
  • File Type: PDF

This technical note explains why DDR3 Mini-UDIMMs are the best choice for systems that don't actually require registered DIMMs.

  • Last Updated: 04/07/2010
  • File Type: PDF

This technical note compares the most common DRAM module form factors.

  • Last Updated: 09/16/2009
  • File Type: PDF

This technical note identifies and discusses five key areas of DRAM controller design.

  • Last Updated: 04/16/2008
  • File Type: PDF

This technical note compares GDDR5 and GDDR5X and discusses the evolution of GDDR5X.

  • Last Updated: 05/31/2016
  • File Type: PDF

This technical note covers DDR2 simulation, adding to Micron's extensive array of design support tools for system designers.

  • Last Updated: 05/16/2005
  • File Type: PDF

This technical note provides guidance on wire bonding techniques for both nickel-palladium (NiPd) and aluminum (Al) bond pads on Micron products.

  • Last Updated: 11/23/2010
  • File Type: PDF