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Product Comparison

Offering designers a basic understanding of the features and benefits of each type of NAND Flash in order to select the proper device.

Product Comparison

While technically under the DDR SDRAM umbrella, Graphics DRAM is in a category by itself. It is specifically designed to handle very large bandwidth requirements and, unlike standard DRAM, graphics DRAM is typically soldered down on the same PCB as the SoC and always supports...

Product Comparison

DDR3 SDRAM to DDR4 SDRAM comparison chart

Product Information

Micron's broad portfolio of high-performance technologies and products—including DRAM, NAND and NOR Flash—is the basis for solid state drives, modules, multichip packages and other system solutions.

Product Information

Our fully managed devices like eMMC, UFS and SSDs help make technology transitions nearly seamless by handling media management and error correction code (ECC) internally.

Product Information

We build our modules from start to finish—designing, manufacturing, and testing all of the DRAM ourselves before assembling the modules and testing again. So, from high-performance SODIMMs to high-density LRDIMMs, you can depend on the quality and reliability of our devices.

Product Information

Micron does more than design and manufacture NAND Flash memory. We strive to solve design challenges through better engineering—by raising the bar on NAND products that cover everything from mobile to embedded, to enterprise storage applications.

Product Information

Get the critical features and functions for your design—including high performance, high quality, power efficiency, wide density ranges, small package sizes, and industrial temperature ranges—from our broad portfolio of industry-standard multichip packages (MCPs).

Product Information

Manufacturers around the world must protect their intellectual property (IP) in everything from consumer electronics to wired and wireless communications equipment.

Product Information

Requirements for smaller form factors and higher memory densities are fueling the need for bare die memory solutions due to their superior flexibility. Wafer-level products can be used in packaging technologies such as systems-in-a-package (SIPs) and multi-chip packages (MCPs)...