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Knights Landing, Intel’s next-generation Xeon Phi™ CPU architecture, leverages the fundamental DRAM and stacking technologies found in our high-performance, on-package memory, the Hybrid Memory Cube (HMC).

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The Hybrid Memory Cube (HMC) is a small, high-speed logic layer that sits below vertical stacks of DRAM die that are connected using through-silicon-via (TSV) interconnects. HMC represents a fundamental change in how memory is used in the system.

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Short-Reach Hybrid Memory Cube (HMC) Part Catalog

Short-Reach Hybrid Memory Cube (HMC) Obsolete Part Catalog

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Micron's broad portfolio of high-performance technologies and products—including DRAM, NAND and NOR Flash—is the basis for solid state drives, modules, multichip packages and other system solutions.

At Micron, we’re always excited by the rise of a new 3D semiconductor architecture. So much so that on December 11, I gave an overview and outlook of 3D memory solutions to a full house at the 11th annual 3D Architectures for Semiconductor Integration and Packing (3D ASIP)...

  • Publication Date: 12/22/2014
  • Author: Rob Sturgill

After much industry anticipation, we’re shipping the world’s first 2GB Hybrid Memory Cube (HMC) engineering samples. Customers can now harness the revolutionary power of HMC in their designs to deliver unprecedented levels of bandwidth and power efficiency to their systems.

Altera Corporation is the first to create a development board that demonstrates interoperability between our Hybrid Memory Cube (HMC) and Altera’s Stratix® V field programmable gate arrays (FPGAs).

Last Wednesday, March 11, Juniper Networks unveiled their new core routing platform, the Converged Supercore®, which includes innovative custom silicon advancements along with expanded software-defined networking (SDN) capabilities. As stated in the press release, “these new...

  • Publication Date: 03/19/2015
  • Author: Rob Sturgill

You can always spot the early adopters of new technologies; like pioneers, they’re the ones with the arrows in their backs. But like the pioneers, they brave technology’s new frontiers for the very same reasons—tremendous opportunity and huge competitive advantage. And also...

  • Publication Date: 07/16/2015
  • Author: Susan Platt