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Designers are increasingly turning to multichip package (MCP) solutions to achieve the smallest possible footprint while providing more density and better performance for embedded IoT designs.

  • Last Updated: 04/09/2018
  • File Type: PDF

Designers are increasingly turning to multichip package (MCP) solutions to achieve the smallest possible footprint while providing more density and better performance for embedded IoT designs.

  • Last Updated: 04/09/2018
  • File Type: PDF

Our extensive and stable portfolio of IMM-focused memory solutions empower technology developments in automotive, industrial, medical, manufacturing, and other multimarket segments.

  • Last Updated: 03/27/2018
  • File Type: PDF