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A world of ideas, memories, and knowledge - accessed, managed, and connected in ways never imagined. Memory makes it all possible.
Provides several well-established guidelines for package-on-package (PoP) semiconductor package design and assembly, which requires unique considerations in both the up-front design and the manufacturing process.
Explanation of Micron packaging labels and procedures.
This customer service note describes the standard shipping quantity, box quantity, and types such as tape and reel for Micron's products.
This customer service note discusses Micron's conversion of JEDEC customer device-qualification documents to reporting CDM data per JS-002.