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The new Advance Driving Assist Systems (ADAS) being rolled out in the higher end automobiles are one of the first interactions the public will have with Artificial Intelligence (AI).

  • Publication Date: 01/03/2018
  • Author: Aaron Boehm

As we discussed previously at Mobile World Congress Americas and at the Linley Processor Conference, we see tremendous opportunity for GDDR6. As the only DRAM vendor to design, test and volume manufacture market-leading GDDR5X DRAM, Micron has been able to leverage that...

  • Publication Date: 01/23/2018
  • Author: Craig McGowan

Standby power savings are becoming increasingly important as computing devices continue to shrink leaving less room for large batteries, and come loaded with advanced features such as instant-on and Microsoft’s Connected Standby. DDR3L-RS (formerly referred to as DDR3Lm) is...

  • Publication Date: 01/08/2013
  • Author: Kris Kido

At Supercomputing 13 (SC13), I participated in a discussion panel on the topic of reconfigurable computing. One recurring theme expressed by the audience was disappointment that the industry is not moving more quickly toward exascale-class performance despite the fact that we...

  • Publication Date: 12/19/2013
  • Author: Paul Dlugosch

Today we announced a solution for an intrinsic DDR3 timing constraint that has been impacting our customers’ system performance. This is great news for networking apps, where tRRD and tFAW timing specifications can restrict much-needed data throughput.

  • Publication Date: 12/17/2013
  • Author: Troy Quick

Optimizing High-speed, Embedded Memory Interface Designs. Designers of energy-efficient, high-speed memory subsystems for small form factor or power-sensitive embedded and wireless products are often making the shift from traditional DDR2/DDR3 to low power (LP) DDR2/DDR3...

  • Publication Date: 03/08/2013
  • Author: Steve Durnal

At Micron we’re always working on new memory device designs that improve performance. Right now we’re involved in a project with our JEDEC partners to standardize a new DRAM interface and die-stacking technology called three-dimensional stacking, or 3DS.

  • Publication Date: 12/13/2011
  • Author: Dr. Aftab Farooqi

A new STEM-focused event in Boise is receiving a boost from Process Engineer Tristan Andreas, DRAM Designer and Senior Member Technical Staff Wen Li and the Micron Foundation.

  • Publication Date: 03/21/2014
  • Author: Micron Foundation

Micron Technology and Inotera Memories announced last December that the companies signed an agreement for Micron to acquire the remaining interest in Inotera Memories of Taiwan, and now the two companies have reached a definitive agreement as the acquisition moves forward...

  • Publication Date: 02/03/2016
  • Author: Dan Francisco

Exciting things are happening in the graphics market: the development of next-generation gaming products, increased availability and adoption of UHD/4K (both hardware and content), and advancements in professional design tools, to name a few. To help enable these advancements,...

  • Publication Date: 09/01/2015
  • Author: Kris Kido