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Milestone Timeline & Awards


Growth Over the Years

Over the course of our business history, we’ve grown through technology innovations, key partnerships and strategic acquisitions. These milestones have made us who we are today — a global leader in memory and storage solutions.


  • Micron opens new clean-room facility for research and development in Boise
  • Micron won the auction for Cando Corporation assets, to create a back-end site adjacent to Micron's existing Taichung fab – establishing its Center of Excellence for DRAM in Taiwan.
  • Micron announces Sanjay Mehrotra as President and CEO
  • Micron CEO Mark Durcan announces his retirement


  • Micron acquires Inotera Memories
  • Micron named one of the most popular Fortune 500 companies to work for according to employees (Business Insider, Indeed.com)
  • Micron received an award from Ericsson as its Supplier of the Year for Core Technology


  • Boise State University receives $25M gift from the Micron Foundation to create Materials Research Center
  • Micron ranked No. 1 on Top 50 Employers in Electronic Design magazine
  • ITC Hall of Fame –Recognized as the 2015 inductee to the Idaho Technology Council Hall of Fame
  • Micron and Intel unveil breakthrough memory 3D XPoint™ technology
  • CEO Mark Durcan named as Tech CEO Council Chair
  • Micron acquires Tidal Systems
  • Micron and Intel reveal new 3D NAND Flash Memory extending Moore's Law for flash storage
  • Micron acquires Convey Computer
  • Micron and Seagate announce strategic alliance for storage solutions
  • Micron acquires Pico Computing


  • Micron Announces Industry's First Monolithic 8Gb DDR3 SDRAM
  • Micron and Powertech Technology enter agreement for assembly and packaging services in China
  • Micron and Altera Named Design Team of the Year at Prestigious UBM Tech’s ACE Awards
  • Micron 16nm NAND Flash Memory Awarded TechInsights’ Most Innovative Memory Device and Semiconductor of the Year
  • Micron 16-nanometer NAND technology wins Flash Memory Summit 2013 Best of Show Award
  • Micron acquires Elpida Memory Inc. and Rexchip Electronics Corporation
  • Micron Unveils 16-Nanometer Flash Memory Technology
  • Micron's Hybrid Memory Cube Named Memory Product of the Year by EE Times and EDN
  • LFoundry Agrees to Acquire Micron Technology Wafer Manufacturing Plant in Italy
  • Micron Introduces Industry's Smallest 128-Gigabit NAND Flash Device
  • Micron Amends Inotera Memories Joint Venture With Nanya Technology Corporation; Micron acquires rights to 100% of Inotera’s output
  • Micron unveils new PCIe I/O accelerator
  • Micron, TE unveil reduced-height, single-sided DDR3 modules
  • EE Times 40th Anniversary Edition – Hybrid Memory Cube – Top 10 Technologies
  • Micron’s C400 SSD receives Storage Vision’s Enabling Consumer Storage Technology Award
  • Intel, Micron Update NAND Flash Memory Joint Venture
  • Micron Board of Directors Appoints D. Mark Durcan as Chief Executive Officer, Director
  • Micron sadly announces Chairman and CEO Steve Appleton passed away in a small plane accident
  • Micron Announces Agreement to Acquire Virtensys
  • Micron adds 512Mb PCM product to mobile portfolio
  • Micron and AgigA to develop nonvolatile DIMM technology
  • Micron announces 30nm DDR3L-RS memory
  • Hybrid Memory Cube Consortium announces draft spec
  • Micron announces availability of 45nm, 1Gb PCM for mobile devices
  • Micron announces 1 GHz, 2Gb and 4Gb DDR3 for high-performance networking and graphics segments
  • Micron launches C400 mSATA SSDs for ultrathin laptops
  • Micron, Xilinx demonstrate first working RLDRAM 3 prototypes
  • Micron introduces first 2.5-inch PCIe enterprise SSD
  • Micron launches low-standby-power DDR3Lm SODIMM for ultrathin and tablet markets
  • Micron Prevails in California Antitrust Trial Against Rambus
  • CEO and President Steve Appleton Receives SIA’s highest honor, the Robert N. Noyce Award
  • Micron Ranks First in Science Strength Category of Patent Board Semiconductor Industry Scorecard
  • Intel and Micron announce first 128GB 20nm NAND Flash.
  • Micron announces 20nm NAND process technology.
  • Micron launches Product Longevity Program (PLP).
  • Micron debuts Hybrid Memory Cube technology.
  • Micron Donates $13 million for Advance Materials Science Studies at Boise State University
  • Intel and Micron Open Singapore NAND Flash Memory Operation
  • Micron Technology Expands China Manufacturing Operations
  • TowerJazz Acquires Micron’s Wafer Manufacturing Plant in Japan
  • IBM to make Micron’s Hybrid Memory Cube using its 3D chipmaking process
  • Micron adds self encryption to C400 SSD
  • Micron debuts first 1Gb SPI NOR flash memory
  • Micron announces P320h PCIe SSD card
  • Micron introduces C400 SSDs for personal computing
  • Origin and Micron Establish Joint Venture to Develop Photovoltaic Technology.
  • Intel and Micron Introduce 25-nanometer NAND.
  • Micron and Nanya introduce 42-nanometer DRAM.
  • Micron increases scale and broadens its product portfolio with the acquisition of Numonyx B.V. from Intel, STMicroelectronics, N.V. and Francisco Partners.
  • Micron Foundation celebrates 10th anniversary of summer Chip Camp for junior high school students.
  • Intel and Micron first to sample 3-bit-per-cell NAND Flash memory on industry-leading 25-nanometer silicon process technology.
  • Micron introduces RealSSD P300 solid-state drive (SSD).
  • U.S. technology leaders, including Micron’s Chairman and CEO Steve Appleton, meet with President Obama in support of an Economic Recovery Package.
  • Micron phases out 200mm wafer manufacturing operations in Boise, closing the longest running memory fab in the world (1981-2009).
  • Micron wins prestigious Semiconductor Insight Awards for DRAM and NAND Flash technology innovations.
  • Micron acquires Displaytech, Inc., and introduces a new single-chip microdisplay panel.
  • Micron sells Aptina Imaging Corporation to Riverwood Capital and TPG Capital.
  • Intel and Micron develop a new 3-bit-per-cell (3bpc) multi-level cell (MLC) NAND technology
  • Micron delivers RealSSD™ C300 Solid-State Drives.
  • Micron transfers its stock exchange listing from the NYSE to the NASDAQ Global Select Market (NASDAQ: MU), effective Dec. 30, 2009.
  • Micron launches Aptina Imaging: a CMOS image sensor division.
  • Micron continues leadership in energy-efficient memory designs with new low-voltage DDR3 and higher-density DDR2 parts.
  • Micron and Nanya sign an agreement to create MeiYa Technology Corporation, a new DRAM joint venture.
  • Intel and Micron are the first to deliver a sub-40 nanometer NAND Flash memory device.
  • Micron introduces next-generation RealSSD™ solid state drives for enterprise server and notebook applications.
  • Micron expands partnership with Nanya by acquiring Qimonda AG's stake in Inotera Memories, Inc.
  • Micron collaborates with Sun Microsystems to extend lifespan of flash-based storage and achieves one million write cycles.
  • Intel and Micron move into mass production with 34nm NAND Flash.
  • Infineon and Micron develop next-generation data storage solution for HD-SIM cards and collaborate to push HD-SIM card capacity beyond 128MB.
  • U.S. President Bush recognizes Micron Technology for helping grow the economy through continued investment.
  • Micron opens a new manufacturing facility in China.
  • Micron reduces data center power consumption with new Aspen Memory family of energy-efficient products.
  • Micron Technology is named 2007 Best-in-Class Supplier by Sun.
  • CMP's Semiconductor Insights recognizes Micron's 78 nanometer 1 gigabit DDR3 as the Most Innovative DRAM.
  • Micron introduces RealSSD™ family of solid state drives.
  • Micron introduces the industry's first NAND Flash memory device built on 50 nanometer process technology.
  • Micron introduces the world's first 8-megapixel image sensor on a 1/2.5-inch optical format (based on a 1.75-micron pixel design).
  • Micron introduces the world's densest server memory module (16-gigabyte).
  • Micron announces development of a 1.4-micron pixel image sensor design.
  • Micron begins shipping 8-gigabit and 4-gigabit NAND Flash devices, ideal for MP3, USB drive, and Flash card applications.
  • Micron secures the leadership position in digital image sensor products with 40 percent market share.
  • Micron acquires Lexar Media to expand NAND Flash memory portfolio.
  • Micron expands assembly and test facility in Singapore and effectively doubles its capacity.
  • Micron introduces Osmium™ packaging technology.
  • Micron receives #1 ranking in the semiconductor industry in iplQ's 2006 Patent Scorecard for the fifth consecutive year.
  • Micron partners with Photronics on a leading-edge MP Mask Technology Center to supply photomasks for high-density, low-power chips.
  • Micron introduces the industry's fastest 1.8V flash memory for mobile applications.
  • Micron introduces a family of Mobile LPDRAM devices that provide low standby power and improved stackability.
  • Micron introduces Endur-IC™ technology, which delivers low power consumption, increased reliability, and an overall robustness required for mobile applications.
  • Micron emerges as the number one provider of CMOS image sensors for camera phones, capturing more than 30 percent of the market share.
  • Micron and Intel announce their agreement to form a new company—IM Flash Technologies—to manufacture NAND Flash memory.
  • Micron's Boise manufacturing facility earns an award from the Pacific Northwest section of the American Water Works Association for "Innovation and Commitment to Water Conservation."
  • Micron’s DDR2 memory wins the prestigious AnandTech Editor’s Choice Award for providing the best performance and value.
  • Semiconductor Insights, the leader in technical and patent analyses of ICs, awards Micron’s 6F2 cell architecture the 2004 INSIGHT Award for Most Innovative DRAM.
  • Micron ships its first production 90nm, 2-gigabit NAND Flash memory products.
  • Micron delivers the industry's first 4-gigabyte DDR SDRAM registered dual in-line memory module (DIMM) to Intel using the Company's 1-gigabyte DDR SDRAM manufactured on the 0.11µm process.
  • Micron introduces the 1.3-megapixel CMOS image sensor, which achieves image quality comparable to CCD while taking advantage of the benefits of CMOS technology.
  • Micron acquires Toshiba's commodity DRAM operations at Dominion Semiconductor, LLC, a subsidiary of Toshiba Corporation of Japan, located in Manassas, Virginia.
  • Micron demonstrates the industry’s first 1-gigabit double data rate (DDR) SDRAM components manufactured on 0.11µm process technology.
  • KMT Semiconductor, Ltd., in Nishiwaki City, Japan, becomes a wholly-owned subsidiary with Micron’s purchase of Kobe Steel, Ltd.’s, interest in the joint-venture operation.
  • Micron is ranked #1 in the semiconductor industry by the Massachusetts Institute of Technology's Technology Review magazine in its Patent Scorecard 2001.
  • Micron establishes test operations in Lehi, Utah, and opens a module assembly and testing operation in the United Kingdom.
  • A 2-for-1 stock split is announced.
  • The Micron Technology Foundation, Inc., is established to advance science and technology education and support community organizations.
  • Crucial Technology launches its direct memory upgrade business in the United Kingdom.
  • Micron opens the UK Design Centre to support Micron’s research and development efforts, including the development of embedded products.
  • Micron becomes one of the largest memory producers in the world with the purchase of Texas Instruments' worldwide memory operations.
  • Intel invests $500 million in Micron to support the development and supply of next-generation memory products.
  • Micron becomes one of the first companies in the U.S. to attain ISO 14001 certification.
  • Micron receives the EPA’s Evergreen Award for environmental responsibility.
  • Dell Computer announces it has received 256-megabit DRAM samples from Micron.
  • Micron creates Crucial Technology, a division to market and sell memory upgrades to end-users.
  • ZEOS International, Ltd., Micron Computer, Inc., and Micron Custom Manufacturing Services, Inc. (MCMS) merge to become Micron Electronics, Inc.
  • A site near Lehi, Utah, is selected for the new manufacturing complex.
  • A 2-for-1 stock split is announced.
  • A 5-for-2 stock split is announced.
  • Micron is listed on the Fortune 500 for the first time.
  • Steve Appleton is named President, Chairman, and CEO.
  • Micron’s Fab III is named "Top U.S. Fab of 1993" by Semiconductor International magazine.
  • Micron begins a $60 million expansion project.
  • Sampling begins for the 16-megabit DRAM.
  • A new test facility is completed.
  • Micron begins the transition to the 4-megabit DRAM.
  • Micron creates Edge Technology, Inc., (a precursor to Micron Electronics) to manufacture memory-intensive personal computers at competitive prices.
  • A second assembly facility is completed.
  • On November 30, Micron lists its common stock on the New York Stock Exchange, under the symbol MU.
  • Major portions of a $250 million expansion project, including a third fabrication facility, are completed.
  • Micron introduces the 256K video RAM, 16K, 64K, and 256K fast static RAM, and add-in memory products assembled by Micron's Memory Applications Group (MAG).
  • Micron introduces the 1-megabit DRAM.
  • The U.S. and Japan enter into a semiconductor trade agreement intended to establish fair market value prices for DRAM.
  • Seven of America's leading semiconductor makers exit the DRAM business due to a drastic decline in prices for memory.
  • Micron is reincorporated under the laws of the state of Delaware and becomes a publicly held company (NASDAQ: DRAM) in June 1984 with the sale of 2.1 million shares of common stock at an initial price of $14 per share.
  • Micron's 256K DRAM is introduced.
  • A second fabrication plant, central utilities plant, and an assembly and test facility are constructed.
  • First "shrink" of Micron’s 64K DRAM die is completed.
  • First assembly and test facility is completed.
  • First fabrication facility is completed.
  • First 64K DRAM product is shipped.
  • Ground is broken for a 50,000-square-foot wafer fabrication plant on 200 acres in Boise.
  • Engineers finalize design for a 64K DRAM.
  • Micron Technology, Inc., is headquartered in Boise, Idaho, and incorporated under the laws of the State of Idaho.
  • Micron was founded on Oct. 5, 1978.