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Mobile 3D NAND Media Kit

Mobile Multimedia and Streaming Devices Get a Boost From 3D NAND

Some of the smallest applications on the planet can now benefit from one of the world’s smallest 3D NAND die. Micron’s first mobile 3D NAND products — along with our first products based on the Universal Flash Storage (UFS) 2.1 standard — are set to enable unparalleled user experiences. From faster boot-up times and file loads to seamless high-definition video streaming, higher-bandwidth gameplay and better camera performance — mobile applications can be accelerated by our innovative 3D NAND and UFS products.

How Our 3D NAND Is Different

Unlike the charge gate technology used by competitors, Micron’s 3D NAND mobile products are built on floating gate technology, which is a proven cell technology that enables better performance, quality and reliability. It stacks layers vertically to allow more storage cells (and 3X the capacity of planar NAND) in a much smaller die area — freeing up space for bigger batteries and/or smaller end devices.

Why UFS for Mobile

We’re making UFS 2.1 technology available in multichip packages (MCPs) with our breakthrough 3D NAND and new low-power LPDDR4X  to provide a higher-performance, more energy-efficient mobile solution. UFS is the next-generation interface to e.MMC 5.1 and enables best-in-class sequential read performance that is ideal for the mobile market. 

Now Sampling

Micron’s 3D NAND solutions for mobile are now sampling with mobile customers and partners and are expected to be widely available in 2Q17.