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All Blog Posts by Jim Cooke

Recent Posts

MCP 101

MCP’s or Multi Chip Packages as they are commonly referred to in the memory industry, are single packages with multiple memory devices inside. While the traditional definition of an MCP could...

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The Little Package That Could

We have a great way to help you develop a common hardware platform that can support several Flash memory performance and density options with a single 6 x 8 mm PCB footprint.

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Micron Enables the Shrinking System with Freescale

The single chip module (SCM) solution spans across many applications that are looking to reduce physical size and complexity. By using the SCM, most of the design work is done for you and it...

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The Mobile Package Just Got Smaller

Mobility is now becoming pervasive. As the global population strives to achieve constant connectivity, the trend that began with cellular phones and was quickly replicated across consumer...

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Enabling the Evolution of Wearable Devices

I recently attended the Wearable Tech Conference, July 23−24, at the Javitz Center in New York City.

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Freescale Forum Attendees Score Free Micron TWRPI Modules

Earlier this month, I attended the Freescale Technology Forum (FTF) at the Gaylord Conference Center in Dallas, TX. FTF is a unique networking and learning opportunity for embedded designers.

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