The Internet of Things (IoT) has created new requirements for memory in space- and resource-constrained applications that are adding connectivity where little to none existed before. In particular, the advent of the IoT is driving the use of multichip package (MCP) memory solutions in vertical markets like automotive.
Find out how Micron’s expanded portfolio of multichip packages (MCPs) enable important advanced driver assistance systems (ADAS) and in-vehicle infotainment systems by downloading James Malatesta’s recent article, Multichip Package Memory Enabling Next-Generation Internet of Things Connectivity in Automotive, which was written for Embedded Computing Design.
About Our Blogger
James is an Automotive Strategic Marketing Manager for Micron's Embedded Business Unit.