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Micron Blog

Micron Innovation Highlighted in Semiconductor International

  • December 05, 2008

Micron innovations in through-silicon integration technologies have been highlighted on two occasions recently by Semiconductor International. Micron technologist Gurtej Sandhu's discussion of TSV innovation is featured in a Nov. 29 blog post and Micron technologist Kyle Kirby is quoted in the November issue of Semiconductor International on the topic of TSV.

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