Add Bookmark(s)



Bookmark(s) shared successfully!

Please provide at least one email address.

Micron Blog

Micron Innovation Highlighted in Semiconductor International

  • December 05, 2008

Micron innovations in through-silicon integration technologies have been highlighted on two occasions recently by Semiconductor International. Micron technologist Gurtej Sandhu's discussion of TSV innovation is featured in a Nov. 29 blog post and Micron technologist Kyle Kirby is quoted in the November issue of Semiconductor International on the topic of TSV.

Login or Sign Up Now for an account to leave a comment.