While Mobile trends continue to drive the industries’ eMCP (Multichip Package) roadmaps to higher densities quickly on two to three year roadmaps, Micron’s Embedded Business Unit (EBU) has created the first five year eMCP roadmap in the market that includes a recently released 8GB e.MMC + 8Gb LPDDR3 eMCP and is aligned with both Intel’s SoFIA 3GR (See Picture 1) and NXP’s i.MX 7 (See Picture 2) processors targeting a broad range of IoT applications. Micron EBU is also exploring an eMCP/ePoP (eMCP in a Package on Package configuration) extended temperature product line that specifically supports Industrial IoT applications requiring performance at -40°C to 105°C.
Picture 1: Intel’s SoFIA 3GR application processor using Micron’s 8GB e.MMC + 8Gb LPDDR3 eMCP
Picture 2: Module by Embedded Artists featuring NXP’s i.MX7 and Micron's 8GB e.MMC + 8Gb LPDDR3 eMCP
The eMCP technology combination of e.MMC and LPDRAM in a single multichip package is not new, but using them in Embedded memory applications such as drones, cameras, AR/VR (Augmented and Virtual Reality), and many other IoT applications is on the rise. As shown in Chart 1, Micron is predicting a 117% CAGR in Embedded Application Unit Sales of eMCP/ePoP products over the next five years. At the same time Micron’s Mobile Business Unit (MBU) is quickly adopting newer technologies into its eMCP/uMCP (UFS based e.MMC and LPDRAM) portfolio and has an established steadier growth rate, as illustrated in Chart 2. In other words, while MBU follows Mobile trends, EBU will continue to steadily support eMCP3 over the next five years.
Chart 1: Micron Embedded eMCP/ePoP Unit Sales by Technology (ex: eMCP3 includes e.MMC and LPDDR3) 2016 through 2020 (source: Micron Marketing)
Chart 2: Micron Mobile eMCP/uMCP Unit Sales by Technology (ex: uMCP4 includes UFS based e.MMC and LPDDR4) 2015 through 2019 (source: Micron Marketing)
So what is driving the need for eMCP/ePoP in Embedded applications?
As medium to high end Embedded systems become smaller and require higher densities with better performance at lower power levels they naturally shift to eMCP and even ePoP solutions in the exceptionally space constrained applications. Check out this MCP 101 blog for more information on the differences and benefits of eMCP and ePoP. Based on Micron data, Consumer applications are especially attracted to the cost benefits of eMCP over purchasing the underlying e.MMC and LPDRAM components separately. Micron’s Consumer Segment Manager Harsha Nagaraju writes in detail about Wearables use of eMCP and ePoP in the Micron’s Small Form Factor Memory Enabling New Wearable Product Categories blog. The newest segment to adopt eMCP are Industrial applications moving into the IoT world of connectivity.
To find out more about Micron’s Embedded eMCP and ePoP product line, see below for other related information: