The Little Package That Could

By Jim Cooke - 2015-10-20

We have a great way to help you develop a common hardware platform that can support several Flash memory performance and density options with a single 6 x 8 mm PCB footprint.

Legacy: The 24-ball TBGA package has been around for many years. This space-efficient, 6 x 8 mm package option for traditional serial peripheral interface (SPI) Flash memories supports densities from 8 Mb to 2 Gb. Using as few as six signals, the quad SPI (QSPI) interface enables designers to achieve up to 80 MB/s of read bandwidth, leaving the majority of the package connections for future expansion.

Emerging: Late last year, we announced the addition of our twin-quad SPI Flash in the same 24-ball TBGA package. The twin-quad device is an evolutionary migration of QSPI that adds a second die in the same package, enabling designers to save board space by replacing two QSPI devices with one twin-quad. With only four extra signals, designers are able to achieve as much as 160 MB/s of read performance.  Controller support for twin-quad is very straightforward; the second die simply connects to a second QSPI controller.  To simplify implementation, we offer two twin-quad package options and either a common clock common chip select or a separate clock and chip select.

Future: For even higher performance, we are continuing the evolution and supporting the same 24-ball TBGA package with the announcement of a true octal SPI Flash, called Xccela™ Flash memory. By adding a strobe signal (DQS), Xccela Flash memory is able to achieve up to 400 MB/s.  What’s more, Xccela Flash memory offers new commands that allow true octal transfers of both READ and WRITE operations.

Micron’s Flash devices are offered in a range of densities, different temperature ranges, and either 1.8V or 3.3V.  We also offer these devices for automotive markets where stricter environmental and quality specifications are required.  While the 24-ball BGA PCB footprint provides the most flexibility, Micron also offers several other packages.

For more details on how to design your next product with the flexibility to support various Flash memory technologies with different densities, features, and performance levels, see our technical note TN-25-08.

Jim Cooke

Jim Cooke