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Your Innovation, Our Memory

Your Innovation, Our Memory

Emerging technologies require innovation on a whole new scale. See how we partner closely with our customers to gain unique insights about how we can optimize our memory solutions to enable your innovations—and help you change the world.

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Memory for Automotive

Memory for Automotive

Technology is reshaping the concept of driving. Automakers are developing countless new driver-assistance features and systems. See how Micron’s memory solutions are helping to enable these new supercomputing capabilities.

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About Micron

Where there's memory, there's Micron

Engineered for Innovation

For more than 30 years Micron has redefined innovation by designing, developing, and manufacturing some of the world’s most advanced technologies.

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Elpida is Now Micron

Elpida Is Now Micron

With the combined strength of our products, technology, and team members—our customers now have access to the broadest portfolio of best-in-class technology.

About the acquisition

Welcome to My Workspace!

Create an account to access these benefits:

  • Save part pages
  • Save Data Sheets and other files
  • Create folders to organize your projects
  • Share folders with colleagues
  • Organize secure documents for easy access
  • "Follow" parts to see alerts and updates

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My Folders

Your workspace is your area to organize and save part pages, data sheets, and links for easy access in the future. You can even start by saving some of the pages you've recently accessed below:

Customer Service Notes Standard Page Save
My Workspace
Title/Description Secure ID Updated
Add Shipping Quantities:
Provides standard part quantities for shipping.
CSN-04 03/2014
Add Electronic Data Interchange:
Describes EDI transmission sets, protocol, and contacts.
CSN-06 11/2012
Add RMA Procedures for Packaged Product and Bare Die Devices:
Outlines standard returned material authorization (RMA) procedures, as well as the differences associated with bare die RMAs.
CSN-07 01/2014
Add Product Marks/Product and Packaging Labels:
Explains product part marking, and product and packaging labels.
CSN-11 10/2014
Add PCN/EOL Systems:
Explains Micron's product change notification and end-of-life systems.
CSN-12 04/2012
Add Micron Component and Module Packaging:
Explanation of Micron packaging labels and procedures.
CSN-16 11/2014
Add Bare Die SiPs and MCMs:
Describes design considerations for bare die SiPs and MCMs.
CSN-18 04/2009
Add Wafer Packaging and Packaging Materials:
Provides complete shipping and recycling information about each of the materials used for shipping Micron's products.
CSN-20 11/2013
Add Micron KGD Definitions:
Describes the testing specifications and parameters for Micron's KGD-C1 and KGD-C2 DRAM die.
CSN-22 07/2009
Add Proper Handling Procedures for Modules and SSDs:
Includes procedures for how to properly handle modules and SSDs.
CSN-23 05/2013
Add ESD Precautions for Die/Wafer Handling and Assembly:
Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs.
CSN-24 08/2010
Add 300mm Back Side Wafer ID:
This document describes the back side scribe used on 300mm wafers and Micron's procedure for reading and storing that identification.
CSN-27 11/2008
Add Lead Frame Package User Guidelines:
Discusses Micron's lead-frame package options
CSN-30 05/2011
Add Micron BGA Manufacturer's User Guide:
Provides information to enable customers to easily integrate both leading-edge and legacy Micron's ball grid array (BGA) packages into their manufacturing processes. It is intended as a set of high-level guidelines and a reference manual describing typical package-related and manufacturing process-flow practices.
CSN-33 12/2012
Add PoP User Guide:
Provides several well-established guidelines for package-on-package (PoP) semiconductor package design and assembly, which requires unique considerations in both the up-front design and the manufacturing process.
CSN-34 08/2011