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Memory for Automotive

Memory for Automotive

Technology is reshaping the concept of driving. Automakers are developing countless new driver-assistance features and systems. See how Micron’s memory solutions are helping to enable these new supercomputing capabilities.

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Overview

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Memory for Automotive

Memory for Automotive

Technology is reshaping the concept of driving. Automakers are developing countless new driver-assistance features and systems. See how Micron’s memory solutions are helping to enable these new supercomputing capabilities.

View video
micron innovations

Micron's Power in Progress

We engineer the innovations that make computing faster, travel safer, healthcare more effective, energy greener and much more.

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About Micron

Where there's memory, there's Micron

Engineered for Innovation

For more than 30 years Micron has redefined innovation by designing, developing, and manufacturing some of the world’s most advanced technologies.

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Micron Chip Camp

Micron Chip Camp

See how the Micron Foundation and volunteers team up for a science and engineering camp for junior high students.

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Welcome to My Workspace!

Create an account to access these benefits:

  • Save part pages
  • Save Data Sheets and other files
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  • Share folders with colleagues
  • Organize secure documents for easy access
  • "Follow" parts to see alerts and updates

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My Folders

Your workspace is your area to organize and save part pages, data sheets, and links for easy access in the future. You can even start by saving some of the pages you've recently accessed below:

Customer Service Notes Standard Page Save
My Workspace
Title/Description Secure ID Updated
Shipping Quantities:
Provides tables of part quantity. 		CSN-04 05/2013
Electronic Data Interchange:
Describes EDI transmission sets, protocol, and contacts. 		CSN-06 11/2012
RMA Procedures for Packaged Product and Bare Die Devices:
Outlines standard returned material authorization (RMA) procedures, as well as the differences associated with bare die RMAs. 		CSN-07 10/2010
ISO System Management Standards:
Describes ISO system management standards. 		CSN-08 04/2004
Product Marks/Product and Packaging Labels:
Explains product part marking, and product and packaging labels. 		CSN-11 03/2013
PCN/EOL Systems:
Explains Micron's product change notification and end-of-life systems. 		CSN-12 04/2012
Micron Component and Module Packaging:
Explanation of Micron packaging labels and procedures. 		CSN-16 01/2013
Bare Die SiPs and MCMs:
Describes design considerations for bare die SiPs and MCMs. 		CSN-18 04/2009
Wafer Packaging and Packaging Materials:
Provides complete shipping and recycling information about each of the materials used for shipping Micron's products. 		CSN-20 10/2012
Micron KGD Definitions:
Describes the testing specifications and parameters for Micron's KGD-C1 and KGD-C2 DRAM die. 		CSN-22 07/2009
Proper Handling Procedures for Modules:
Includes procedures for how to properly handle modules. 		CSN-23 12/2007
ESD Precautions for Die/Wafer Handling and Assembly:
Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs. 		CSN-24 08/2010
300mm Back Side Wafer ID:
This document describes the back side scribe used on 300mm wafers and Micron's procedure for reading and storing that identification. 		CSN-27 11/2008
Lead Frame Package User Guidelines:
Discusses Micron's lead-frame package options 		CSN-30 05/2011
Micron BGA Manufacturer's User Guide:
Provides information to enable customers to easily integrate both leading-edge and legacy Micron's ball grid array (BGA) packages into their manufacturing processes. It is intended as a set of high-level guidelines and a reference manual describing typical package-related and manufacturing process-flow practices. 		CSN-33 12/2012
PoP User Guide:
Provides several well-established guidelines for package-on-package (PoP) semiconductor package design and assembly, which requires unique considerations in both the up-front design and the manufacturing process. 		CSN-34 08/2011