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Memory for Automotive

Memory for Automotive

Technology is reshaping the concept of driving. Automakers are developing countless new driver-assistance features and systems. See how Micron’s memory solutions are helping to enable these new supercomputing capabilities.

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Memory for Automotive

Memory for Automotive

Technology is reshaping the concept of driving. Automakers are developing countless new driver-assistance features and systems. See how Micron’s memory solutions are helping to enable these new supercomputing capabilities.

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Micron's Power in Progress

We engineer the innovations that make computing faster, travel safer, healthcare more effective, energy greener and much more.

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Where there's memory, there's Micron

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For more than 30 years Micron has redefined innovation by designing, developing, and manufacturing some of the world’s most advanced technologies.

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Micron Chip Camp

Micron Chip Camp

See how the Micron Foundation and volunteers team up for a science and engineering camp for junior high students.

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Serial Solutions for Today and Beyond

 

See how PCM's non-volatile, high endurance, fast program performance and overwrite capability can consolidate multiple memory types in a digital video camera application.

 

Is there a single memory technology that can fit all your embedded application needs, with the design simplicity and drop-in convenience of a serial interface? Yes.

The P5Q PCM is purpose-built to meet the memory requirements of embedded systems, delivering multiple I/O capability and compatibility via familiar SPI NOR interfaces. P5Q improves overall performance and enables software simplification using byte-alterability (overwrite capability). It also increases system-level reliability by delivering 1 million write-cycle endurance (compared to 100,000 for NOR flash).

  • Supports growing high density embedded serial market
  • High performance to match leading-edge serial NOR
  • Standard SPI package
  • Improves system performance by eliminating the need for erase operations
  • Reduces system and software management
  • Ideal for write-intensive applications
  • Supports full 3.3V voltage range
  • Supports industrial or commercial temperature for a wide variety of embedded applications

Featured Article

PCM Evaluation Boards

PCM Eval Board

Micron phase change memory (PCM) has been enabled on evaluation boards with our ecosystem partners. This facilitates PCM adoption for customers who are looking to base their design on existing evaluation kits.

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Featured PCM Videos

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For Serial PCM (8)
Title & Description Secure ID# Updated Type
Industrial and Multi-Market Applications Flyer: (PDF 442.84 KB)Our extensive and stable portfolio of IMM-focused memory solutions empower technology developments in automotive, industrial, medical, manufacturing, and other multimarket segments. 02/2013 Product Flyer
Unleash Your Groundbreaking Designs: Micron Phase Change Memory (PCM): (PDF 223.71 KB)Memory architecture can be a challenge—density, performance, packaging, and interfaces all affect system-level performance. Our revolutionary phase change memory (PCM) blends the best attributes of NOR, NAND, and RAM, offering unprecedented capability in a single, nonvolatile memory chip that allows you to consolidate multiple memory types within an application. 10/2012 Product Flyer
Comparing P5Q Serial PCM and NOR Flash SPI Memory: (PDF 146.41 KB)Comparing the features of the 128Mb P5Q serial PCM and NOR Flash SPI memory devices enables users to migrate applications from NOR Flash memory to P5Q serial PCM memory. AN310052 11/2011 Technical Note
Extending 90nm PCM Endurance from 1 Million WRITE Cycles Up to 1 Billion Cycles: (PDF 441.71 KB)This technical note outlines a software solution called the parameter manager, which is used to increase the WRITE cycles for Micron's phase change memory (PCM) well beyond its standard endurance specifications. TN-13-09 11/2011 Technical Note
Flash Data Integrator (FDI) File System Flyer: (PDF 673.02 KB)Running on Micron's latest NOR Flash and phase change memory (PCM), our Flash Data Integrator (FDI) file system provides dependable storage to create a compelling, low-cost solution. In addition, FDI delivers a true eXecute-in-Place (XiP) advantage in an open architecture to manage code and data in NOR and PCM memory devices. 09/2011 Product Flyer
Extending PCM Temperature and Data Retention Ranges: Software Refresh Procedure: (PDF 540.15 KB)This technical note describes a software procedure for refreshing data in Micron® P5Q serial phase change memory (PCM) and P8P parallel PCM devices to enable usage beyond current data sheet specifications. TN-13-07 06/2011 Technical Note
Micron PCM Innovates System Designs for Smart Grid Products: (PDF 1.17 MB)A Micron/Singhang case study highlighting the memory system design challenges Singhang had with their smart grid product and how they worked with Micron to implement a superior, single-chip memory solution. 05/2011 Case Study
Software Device Drivers for the Micron P5Q PCM Device: (PDF 302.12 KB)This technical note describes the C library source code for the Micron P5Q phase change memory (PCM) device using the Micron software device driver. Download the low-level driver described in this document here. TN-13-04 03/2011 Technical Note
For Phase Change Memory (7)
Title & Description Secure ID# Updated Type
Compatibility Guide for Micron Software Device Drivers Available on micron.com: (PDF 240.38 KB)This document lists the compatible NOR, NAND, and PCM devices for the software device drivers available for download from micron.com. 01/2013 Product Flyer
Micron Phase Change Memory for Embedded Applications: (PDF 2.19 MB)PCM is revolutionary memory that merges the best attributes of NOR, NAND, and RAM, offering unprecedented capability in a single, nonvolatile memory chip. 01/2012 Product Flyer
PCM: A New Memory Technology to Enable New Memory Usage Models: (PDF 297.2 KB)Describes how PCM blends together the best attributes of NOR Flash, NAND Flash, EEPROM, and RAM to deliver a new category of memory for new usage models 06/2011 White Paper
The Evolution of Phase Change Memory: (PDF 591.74 KB)Describes how PCM has evolved and is the next generation of nonvolatile memory. 03/2011 White Paper
Accelerate Design Cycles with Simulation Models: (PDF 206.91 KB)Micron supplies the tools and guidelines necessary to verify new designs prior to layout. This technical note discusses software model support, signal integrity optimization, and logic circuit design. TN-00-09 02/2010 Technical Note
Software Spotlight: Tool
: (PDF 246.99 KB) White Paper
For Products and Support (14)
Title & Description Secure ID# Updated Type
Product Marks/Product and Packaging Labels: (PDF 1.15 MB)Explains product part marking, and product and packaging labels. CSN-11 05/2013 Customer Service Note
Shipping Quantities: (PDF 1.31 MB)Provides tables of part quantity. CSN-04 05/2013 Customer Service Note
Thermal Applications: (PDF 253.94 KB)Describes some considerations in thermal applications for Micron memory devices TN-00-08 04/2013 Technical Note
Moisture Absorption in Plastic Packages: (PDF 97.08 KB)Describes shipping procedures for preventing memory devices from absorbing moisture and recommendations for baking devices exposed to excessive moisture TN-00-01 02/2013 Technical Note
Micron Component and Module Packaging: (PDF 1.41 MB)Explanation of Micron packaging labels and procedures. CSN-16 01/2013 Customer Service Note
Micron BGA Manufacturer's User Guide: (PDF 388.76 KB)Provides information to enable customers to easily integrate both leading-edge and legacy Micron's ball grid array (BGA) packages into their manufacturing processes. It is intended as a set of high-level guidelines and a reference manual describing typical package-related and manufacturing process-flow practices. CSN-33 12/2012 Customer Service Note
Electronic Data Interchange: (PDF 52.45 KB)Describes EDI transmission sets, protocol, and contacts. CSN-06 11/2012 Customer Service Note
Wafer Packaging and Packaging Materials: (PDF 591.29 KB)Provides complete shipping and recycling information about each of the materials used for shipping Micron's products. CSN-20 10/2012 Customer Service Note
PCN/EOL Systems: (PDF 79.21 KB)Explains Micron's product change notification and end-of-life systems. CSN-12 04/2012 Customer Service Note
Lead Frame Package User Guidelines: (PDF 245.66 KB)Discusses Micron's lead-frame package options CSN-30 05/2011 Customer Service Note
RMA Procedures for Packaged Product and Bare Die Devices: (PDF 82.64 KB)Outlines standard returned material authorization (RMA) procedures, as well as the differences associated with bare die RMAs. CSN-07 10/2010 Customer Service Note
ESD Precautions for Die/Wafer Handling and Assembly: (PDF 119.08 KB)Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs. CSN-24 08/2010 Customer Service Note
Micron KGD Definitions: (PDF 65.52 KB)Describes the testing specifications and parameters for Micron's KGD-C1 and KGD-C2 DRAM die. CSN-22 07/2009 Customer Service Note
Bare Die SiPs and MCMs: (PDF 151.06 KB)Describes design considerations for bare die SiPs and MCMs. CSN-18 04/2009 Customer Service Note

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For Serial PCM (2)
Title & Description Secure ID# Updated Type
P5Q (32Mb-128Mb): (ZIP 14.34 KB)Download the technical note for this driver here. 06/2012 PCM Software
Serialize Function for the SPI Controller: (ZIP 5.55 KB)Provides the serialize function for the serial peripheral interface (SPI) controller for Micron’s serial Flash devices (NAND, NOR, and PCM). 12/2011 PCM Software
For Phase Change Memory (0)
Title & Description Secure ID# Updated Type
For Products and Support (0)
Title & Description Secure ID# Updated Type

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"Paying Our Dues" Paid off with PCM

January 21, 2013 by Paolo Cappelletti

"Paying Our Dues" Paid off with PCM

“I commend Micron for being able to put silicon down and show volume production of PCM. This blows naysayers away—of which I was one—and shows that the technology can work. It also drives home the lesson that you must pay your dues in terms of development and production time—including the ability to work around a variety of issues like thermal disturb—to achieve a good, production-ready, innovative design.”  - Alan Niebel, CEO of Web-Feet Research ...Read More

See all posts on PCM, NAND, NOR

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Tame the Boot Storm

May 14, 2013 by Janene Ellefson

If you manage a network of virtual machines, you’ve probably experienced the negative effects of a boot storm too many times. These virtual storms can occur when a large number of users log in t...Read More

Why Latency Matters

April 30, 2013 by Janene Ellefson

When you think about system performance, you have to think latency. In an IT environment, latency affects everything—from efficiency and throughput, to customer satisfaction and operating costs....Read More