Parallel PCM for Performance and Endurance
See how PCM's non-volatile, high endurance, fast program performance and overwrite capability can consolidate multiple memory types in a digital video camera application.
Our P8P phase change memory (PCM) combines the best traits of traditional memory technologies into a single, nonvolatile device with a performance-boosting parallel interface. Ideal for high-end high performance embedded applications, second-generation P8P products increase performance, improve endurance, and simplify software management.
And PCM products are backed by 30 years of Micron’s industry-leading expertise and innovation in semiconductor design and manufacturing. You’ll get the stability, flexibility, support, and availability that you need in a long-term memory solution and in a long-term memory provider—the Micron quality and capability you’ve come to expect.
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Advanced technology for a broad range of embedded applications
- Improves system performance by eliminating the need for erase operations
- Reduces system and software management
- Ideal for write-intensive applications
- Command set and hardware compatible with today’s parallel NOR solutions
- Ideal for a wide variety of traditional embedded applications
- Fits into existing parallel NOR sockets
- Supports industrial and commercial temperature for a wide variety of embedded applications
Featured Article
PCM In-System Programming
Onboard programming of firmware onto Flash memory during PCB manufacture is a common practice. It allows customers to integrate programming and testing into a single step.
Learn more about in-system programming solutions
For Parallel PCM (7)
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Industrial and Multi-Market Applications Flyer: (PDF 454.13 KB)Our extensive and stable portfolio of IMM-focused memory solutions empower technology developments in automotive, industrial, medical, manufacturing, and other multimarket segments.
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02/2013
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Product Flyer |
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Unleash Your Groundbreaking Designs: Micron Phase Change Memory (PCM): (PDF 223.71 KB)Memory architecture can be a challenge—density, performance, packaging, and interfaces all affect system-level performance. Our revolutionary phase change memory (PCM) blends the best attributes of NOR, NAND, and RAM, offering unprecedented capability in a single, nonvolatile memory chip that allows you to consolidate multiple memory types within an application.
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10/2012
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Product Flyer |
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Comparing P8P Parallel PCM and Parallel NOR Flash Memory: (PDF 229.34 KB)Comparing the features of the 128Mb P8P parallel PCM and parallel NOR Flash memory devices enables users to migrate applications from NOR Flash to P8P parallel PCM.
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AN310053
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11/2011
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Technical Note |
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Extending 90nm PCM Endurance from 1 Million WRITE Cycles Up to 1 Billion Cycles: (PDF 441.71 KB)This technical note outlines a software solution called the parameter manager, which is used to increase the WRITE cycles for Micron's phase change memory (PCM) well beyond its standard endurance specifications.
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TN-13-09
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11/2011
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Technical Note |
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Flash Data Integrator (FDI) File System Flyer: (PDF 673.02 KB)Running on Micron's latest NOR Flash and phase change memory (PCM), our Flash Data Integrator (FDI) file system provides dependable storage to create a compelling, low-cost solution. In addition, FDI delivers a true eXecute-in-Place (XiP) advantage in an open architecture to manage code and data in NOR and PCM memory devices.
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09/2011
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Product Flyer |
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Extending PCM Temperature and Data Retention Ranges: Software Refresh Procedure: (PDF 540.15 KB)This technical note describes a software procedure for refreshing data in Micron® P5Q serial phase change memory (PCM) and P8P parallel PCM devices to enable usage beyond current data sheet specifications.
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TN-13-07
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06/2011
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Technical Note |
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Software Device Drivers for the Micron P8P Parallel PCM Device: (PDF 238.6 KB)This technical note describes C library source code for the Micron P8P phase change memory (PCM) device using the P8P software device driver.
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TN-13-06
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03/2011
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Technical Note |
For Phase Change Memory (8)
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Compatibility Guide for Micron Software Device Drivers Available on micron.com: (PDF 240.38 KB)This document lists the compatible NOR, NAND, and PCM devices for the software device drivers available for download from micron.com.
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01/2013
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Product Flyer |
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Micron Phase Change Memory for Embedded Applications: (PDF 2.19 MB)PCM is revolutionary memory that merges the best attributes of NOR, NAND, and RAM, offering unprecedented capability in a single, nonvolatile memory chip.
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01/2012
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Product Flyer |
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PCM: A New Memory Technology to Enable New Memory Usage Models: (PDF 297.2 KB)Describes how PCM blends together the best attributes of NOR Flash, NAND Flash, EEPROM, and RAM to deliver a new category of memory for new usage models
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06/2011
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White Paper |
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Micron PCM Innovates System Designs for Smart Grid Products: (PDF 1.17 MB)A Micron/Singhang case study highlighting the memory system design challenges Singhang had with their smart grid product and how they worked with Micron to implement a superior, single-chip memory solution.
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05/2011
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Case Study |
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The Evolution of Phase Change Memory: (PDF 591.74 KB)Describes how PCM has evolved and is the next generation of nonvolatile memory.
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03/2011
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White Paper |
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Accelerate Design Cycles with Simulation Models: (PDF 206.91 KB)Micron supplies the tools and guidelines necessary to verify new designs prior to layout. This technical note discusses software model support, signal integrity optimization, and logic circuit design.
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TN-00-09
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02/2010
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Technical Note |
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Software Spotlight:
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: (PDF 246.99 KB)
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White Paper |
For Products and Support (14)
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Product Marks/Product and Packaging Labels: (PDF 1.15 MB)Explains product part marking, and product and packaging labels.
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CSN-11
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05/2013
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Customer Service Note |
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Shipping Quantities: (PDF 1.31 MB)Provides tables of part quantity.
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CSN-04
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05/2013
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Customer Service Note |
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Thermal Applications: (PDF 253.94 KB)Describes some considerations in thermal applications for Micron memory devices
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TN-00-08
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04/2013
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Technical Note |
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Moisture Absorption in Plastic Packages: (PDF 97.08 KB)Describes shipping procedures for preventing memory devices from absorbing moisture and recommendations for baking devices exposed to excessive moisture
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TN-00-01
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02/2013
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Technical Note |
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Micron Component and Module Packaging: (PDF 1.41 MB)Explanation of Micron packaging labels and procedures.
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CSN-16
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01/2013
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Customer Service Note |
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Micron BGA Manufacturer's User Guide: (PDF 388.76 KB)Provides information to enable customers to easily integrate both leading-edge and legacy Micron's ball grid array (BGA) packages into their manufacturing processes. It is intended as a set of high-level guidelines and a reference manual describing typical package-related and manufacturing process-flow practices.
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CSN-33
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12/2012
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Customer Service Note |
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Electronic Data Interchange: (PDF 52.45 KB)Describes EDI transmission sets, protocol, and contacts.
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CSN-06
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11/2012
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Customer Service Note |
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Wafer Packaging and Packaging Materials: (PDF 591.29 KB)Provides complete shipping and recycling information about each of the materials used for shipping Micron's products.
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CSN-20
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10/2012
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Customer Service Note |
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PCN/EOL Systems: (PDF 79.21 KB)Explains Micron's product change notification and end-of-life systems.
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CSN-12
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04/2012
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Customer Service Note |
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Lead Frame Package User Guidelines: (PDF 245.66 KB)Discusses Micron's lead-frame package options
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CSN-30
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05/2011
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Customer Service Note |
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RMA Procedures for Packaged Product and Bare Die Devices: (PDF 82.64 KB)Outlines standard returned material authorization (RMA) procedures, as well as the differences associated with bare die RMAs.
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CSN-07
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10/2010
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Customer Service Note |
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ESD Precautions for Die/Wafer Handling and Assembly: (PDF 119.08 KB)Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs.
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CSN-24
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08/2010
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Customer Service Note |
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Micron KGD Definitions: (PDF 65.52 KB)Describes the testing specifications and parameters for Micron's KGD-C1 and KGD-C2 DRAM die.
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CSN-22
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07/2009
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Customer Service Note |
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Bare Die SiPs and MCMs: (PDF 151.06 KB)Describes design considerations for bare die SiPs and MCMs.
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CSN-18
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04/2009
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Customer Service Note |
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For Parallel PCM (1)
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P8P (128Mb): (ZIP 21.48 KB)Download the technical note for this driver here.
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02/2010
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PCM Software |
For Phase Change Memory (0)
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“I commend Micron for being able to put silicon down and show volume production of PCM. This blows naysayers away—of which I was one—and shows that the technology can work. It also drives home the lesson that you must pay your dues in terms of development and production time—including the ability to work around a variety of issues like thermal disturb—to achieve a good, production-ready, innovative design.”
- Alan Niebel, CEO of Web-Feet Research ...Read More
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