512Mb DDR2 SDRAM Component : MT47H64M8B6-3

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Illustration only. See data sheet for product specifications.

Density:: 512Mb

Part Status:: End of Life

RohS:: Yes

Depth:: 64Mb

Width:: x8

Voltage:: 1.8V

Package:: FBGA

Pin Count:: 60-ball

Clock Rate:: 333 MHz

Cycle Time:: 3ns

Op. Temp.:: 0C to +85C

CL:: CL = 5

Data Rate:: DDR2-667

This part is not recommended for new designs.

DDR2 SDRAM is a high-speed dynamic random-access memory that uses a 4n-prefetch architecture with an interface designed to transfer two data words per clock cycle at the I/O bond pads.

RoHS-Compliant: This part meets internationally recognized Pb-free standards, including RoHS.

RoHS Certificate of Compliance

China RoHS Certificate

Orderable Part	Part Status	Buy Samples	Distributor Stock
MT47H64M8B6-3:D	EOL	Contact Rep	Contact Rep
	Micron recommends MT47H64M8CF-3:F . Compare Parts

Please note: Distributor inventory is an estimate and may not reflect actual available inventory.

Some links on this page will take you from the Micron Web site. Micron does not control the content on these Web sites.

File	Title and Description	ID Number	Last Update

RoHS Certificate of Compliance - Provides EU-RoHS certification information for Micron products		Apr 2008
Micron RoHS, Green, and Pb-free Products - Presentation describing Micron's compliance to RoHS and other environmental directives		May 2006
CSN-11: Product Marks/Product and Packaging Labels - Explains product part marking, and product and packaging labels	CSN-11	Jan 2010
CSN-20: Whole Wafer Packaging	CSN-20	Jun 2009
CSN-04: Shipping Quantities and Weights - Provides tables of shipping weight per part quantity	CSN-04	Jan 2009
CSN-12: Product Change Notification (PCN) System	CSN-12	Oct 2008
CSN-23: Proper Handling Procedures for Micron DRAM Modules - Includes procedures for how to properly handle modules	CSN-23	Dec 2007
CSN-16: Micron® Packaging - Explanation of Micron packaging labels and procedures	CSN-16	Aug 2007
CSN-17: Packaging Materials - Packaging specifications and materials descriptions	CSN-17	Jun 2006
CSN-15: Tape-and-Reel Procedures - Specifications for Micron’s tape-and-reel offerings	CSN-15	Mar 2006
CSN-06: Electronic Data Interchange - EDI transmission sets, protocol, and contacts	CSN-06	Sep 2004
CSN-07: Returned Material Authorization (RMA) Procedures - Outlines standard returned material authorization (RMA) procedures, as well as the differences associated with bare die RMAs	CSN-07	Aug 2004
CSN-21: Pin 1 Orientation for Tray, Tube, and Tape-and-Reel Packaging	CSN-21	May 2004
CSN-08: ISO System Management Standards	CSN-08	Apr 2004
Accelerate Design Cycles with SIM Models	TN-00-09	Feb 2010
FBDIMM – Channel Utilization (Bandwidth and Power) - Newly introduced FBDIMMs offer virtually unlimited scalability of density, a significantly reduced number of routed motherboard signals, and high bandwidth solutions, all with an extremely reliable channel protocol.	TN-47-21	Jan 2010
Understanding Signal Integrity - Describes how memory design, test, and verification tools can be used to the greatest advantage, from conception of a new product through end of life	TN-00-20	Dec 2009
Designing for High-Density DDR2 Memory - Focuses on designing for high-density memory—addressing schemes of each density, configurations, and the subtle differences between the 4-bank and new 8-bank DDR2 devices	TN-47-16	Dec 2009
Bypass Capacitor Selection for High-Speed Designs	TN-00-06	Dec 2009
IBIS Behavioral Models	TN-00-07	Nov 2009
Understanding the Quality and Reliability Requirements for Bare Die Applications	TN-00-14	Oct 2009
Designing for 1.5V, Low-Power FBDIMMs - Discusses memory power trends and identifies new low-voltage solutions for high-density DDR2 memory designs	TN-47-22	Sep 2008
Uprating of Semiconductors for High-Temperature Applications - Describes the issues associated with temperature uprating and the risks involved in using components and/or systems outside the manufacturer’s environmental specifications	TN-00-18	May 2008
Thermal Applications - Defines a general method and criteria for measuring and ensuring that Micron components and modules do not exceed the maximum allowable temperature.	TN-00-08	May 2008
High speed DRAM controller design - Identifies and discusses five key areas of DRAM controller design	TN-45-54	Apr 2008
Advantages of DDR2 Differential DQS Signaling - Focuses on the benefits the differential DQS signaling feature provides and explains how to design with it	TN-47-23	Mar 2008
Recommended Soldering Parameters	TN-00-15	Mar 2007
Moisture Absorption in Plastic Packages - Describes the shipping procedures that ensure Micron’s customers receive memory devices that do not exhibit the popcorn effect	TN-00-01	Mar 2007
Calculating Memory System Power for DDR2 - Details how DDR2 SDRAM consumes power and provides tools to estimate power consumption in a given system.	TN-47-04	Jun 2006
DDR2 SDRAM Offers New Features and Functionality - Discusses the various changes in DDR2 technology and the resulting features and benefits	TN-47-02	Jun 2006
DDR2 (Point-to-Point) Package Sizes and Layout Basics - General guidelines for developing the PCB floor plan.	TN-47-20	May 2006
DDR2 (Point-to-Point) Features and Functionality - Focuses on the unique memory requirements of point-to-point design layouts and describes DDR2 features and functionality.	TN-47-19	Apr 2006
DDR2 Package Sizes and Layout Requirements - Covers DDR2 package sizes and layout requirements	TN-47-08	Nov 2005
DDR2 tCKE Power-Down Requirement - Describes the tCKE timing parameter of DDR2 SDRAM	TN-47-14	Dec 2004
DDR2 Simulation Support - Covers DDR2 simulation, adding to Micron's extensive array of design support tools for system designers	TN-47-07	Aug 2004

File	Title and Description	ID Number	Last Update

	S-Parameters Tutorial - An introduction to a new frequency domain technique that will meet the needs of the future’s ever-increasing frequencies		Apr 2004
	The Power Demands of Data Centers Require Memory Innovations		Apr 2007
	DDR2: The New DRAM Standard - Explains progression of DRAM architectures, noting advantages of DDR2 over its predecessors		Aug 2006

File	Title and Description	ID Number	Last Update

	Module/Motherboard Testing - Micron qualification test results for various OEM motherboards		Jun 2008
	FBGA Part Marking Decoder - Conversion tool for FBGA part markings		Jun 2008
	DRAM Component Part Numbering Guide - Part numbering chart for DDR2/DDR/SDR SDRAM, Mobile DRAM, and RLDRAM components		Aug 2009
	FBGA Date Codes - Date codes for FBGA-packaged components		Jan 2005

512Mb: x4, x8, x16 DDR2 SDRAM
Date:07/09
Size:9249Kb
Type:Data Sheet (PDF)

Verilog
Date:12/09
Size:36Kb
Version:5.81
IBIS
Date:06/08
Size:224Kb
Version:2.5 (Die Rev. D)
HSpice
Date:12/08
Size:475Kb
Version:2.6 (Die Rev. D)

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