256Mb DDR SDRAM Component : MT46V16M16BG-6

Overview
Resources & Support

RSS part feed:

Illustration only. See data sheet for product specifications.

Density:: 256Mb

Part Status:: End of Life

RohS:: Yes

Depth:: 16Mb

Width:: x16

Voltage:: 2.5V

Package:: FBGA

Pin Count:: 60-ball

Clock Rate:: 167 MHz

Cycle Time:: 6ns

Op. Temp.:: 0C to +70C

CL:: CL = 2.5

Data Rate:: DDR333

This part is not recommended for new designs.

DDR SDRAM is a high-speed dynamic random-access memory that uses a 2n-prefetch architecture with an interface designed to transfer two data words per clock cycle at the I/O bond pads.

RoHS-Compliant: This part meets internationally recognized Pb-free standards, including RoHS.

RoHS Certificate of Compliance

China RoHS Certificate

Orderable Part	Part Status	Buy Samples	Distributor Stock
MT46V16M16BG-6:F	EOL	Contact Rep	Contact Rep
	Micron recommends MT46V16M16CY-5B:K . Compare Parts

Please note: Distributor inventory is an estimate and may not reflect actual available inventory.

Some links on this page will take you from the Micron Web site. Micron does not control the content on these Web sites.

File	Title and Description	ID Number	Last Update

RoHS Certificate of Compliance - Provides EU-RoHS certification information for Micron products		Apr 2008
Micron RoHS, Green, and Pb-free Products - Presentation describing Micron's compliance to RoHS and other environmental directives		May 2006
CSN-11: Product Marks/Product and Packaging Labels - Explains product part marking, and product and packaging labels	CSN-11	Jan 2010
CSN-20: Whole Wafer Packaging	CSN-20	Jun 2009
CSN-04: Shipping Quantities and Weights - Provides tables of shipping weight per part quantity	CSN-04	Jan 2009
CSN-12: Product Change Notification (PCN) System	CSN-12	Oct 2008
CSN-23: Proper Handling Procedures for Micron DRAM Modules - Includes procedures for how to properly handle modules	CSN-23	Dec 2007
CSN-16: Micron® Packaging - Explanation of Micron packaging labels and procedures	CSN-16	Aug 2007
CSN-17: Packaging Materials - Packaging specifications and materials descriptions	CSN-17	Jun 2006
CSN-15: Tape-and-Reel Procedures - Specifications for Micron’s tape-and-reel offerings	CSN-15	Mar 2006
CSN-06: Electronic Data Interchange - EDI transmission sets, protocol, and contacts	CSN-06	Sep 2004
CSN-07: Returned Material Authorization (RMA) Procedures - Outlines standard returned material authorization (RMA) procedures, as well as the differences associated with bare die RMAs	CSN-07	Aug 2004
CSN-21: Pin 1 Orientation for Tray, Tube, and Tape-and-Reel Packaging	CSN-21	May 2004
CSN-08: ISO System Management Standards	CSN-08	Apr 2004
Accelerate Design Cycles with SIM Models	TN-00-09	Feb 2010
Mobile LPDDR Versus Standard DDR SDRAM - An overview of the functional and mechanical differences between low-power and standard DDR and a description of exclusive features of LPDDR.	TN-46-15	Jan 2010
Understanding Signal Integrity - Describes how memory design, test, and verification tools can be used to the greatest advantage, from conception of a new product through end of life	TN-00-20	Dec 2009
Bypass Capacitor Selection for High-Speed Designs	TN-00-06	Dec 2009
IBIS Behavioral Models	TN-00-07	Nov 2009
Understanding the Quality and Reliability Requirements for Bare Die Applications	TN-00-14	Oct 2009
Hardware Tips for Point-to-Point System Design - Proven techniques for termination, layout, and routing.	TN-46-14	Jun 2008
Uprating of Semiconductors for High-Temperature Applications - Describes the issues associated with temperature uprating and the risks involved in using components and/or systems outside the manufacturer’s environmental specifications	TN-00-18	May 2008
Thermal Applications - Defines a general method and criteria for measuring and ensuring that Micron components and modules do not exceed the maximum allowable temperature.	TN-00-08	May 2008
High speed DRAM controller design - Identifies and discusses five key areas of DRAM controller design	TN-45-54	Apr 2008
Recommended Soldering Parameters	TN-00-15	Mar 2007
Moisture Absorption in Plastic Packages - Describes the shipping procedures that ensure Micron’s customers receive memory devices that do not exhibit the popcorn effect	TN-00-01	Mar 2007
DDR SDRAM Point-to-Point Simulation Process - Covers rarely addressed areas of the DDR SDRAM point-to-point simulation process	TN-46-11	Jul 2005
Calculating DDR Memory System Power	TN-46-03	Mar 2005
Decoupling Capacitor Calculation for a DDR Memory Channel	TN-46-02	Jul 2004
Termination for Point-to-Point Systems	TN-46-06	Sep 2001
General DDR SDRAM Functionality	TN-46-05	Jul 2001

File	Title and Description	ID Number	Last Update

	S-Parameters Tutorial - An introduction to a new frequency domain technique that will meet the needs of the future’s ever-increasing frequencies		Apr 2004

File	Title and Description	ID Number	Last Update

	Module/Motherboard Testing - Micron qualification test results for various OEM motherboards		Jun 2008
	FBGA Part Marking Decoder - Conversion tool for FBGA part markings		Jun 2008
	DRAM Component Part Numbering Guide - Part numbering chart for DDR2/DDR/SDR SDRAM, Mobile DRAM, and RLDRAM components		Aug 2009
	FBGA Date Codes - Date codes for FBGA-packaged components		Jan 2005

256Mb: x4, x8, x16 DDR SDRAM
Date:01/09
Size:3632Kb
Type:Data Sheet (PDF)

Verilog
Date:06/07
Size:19Kb
Version:6.00
IBIS
Date:03/07
Size:275Kb
Version:2.1 (die rev. F)
HSpice
Date:06/07
Size:321Kb
Version:2.2 (die rev. F)
Denali
Date:02/01
Size:50Kb

About Micron Models:
By downloading any Micron model from this site, you must agree to the terms of Micron's Simulation Models License Agreement. If you do not agree to terms, you do not have permission to use the site or download material from it.

About Non-Micron Models:
For your convenience, Micron links to third-party simulation models. Note that Micron does not guarantee functionality or accuracy of these models.