2GB DDR2 SDRAM FBDIMM : MT18HTF25672FDY-80E

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FBDIMM

Illustration only. See data sheet for product specifications.

Specifications

Technology:
DDR2 SDRAM
Density:
2GB
Part Status:
EOL Pending
RoHS:
Yes
Comp. Count:
18
Depth:
256Mb
Width:
x72
Pin Count:
240-pin
Op. Temp.:
0C to +95C
Data Rate:
800 MT/s
Speed:
PC2-6400
CL:
CL = 5
Voltage:
1.8V
Comp. Config:
128 Meg x 8
ECC:
ECC
Module Ranks:
Dual Rank
Register:
Non Parity

Description

FBDIMMs use an advanced memory buffer (AMB) to maintain signal integrity and improve error detection. This high-performance memory module is well suited to server applications because it virtually eliminates traditional stub-bus density/speed limitations. ECC error handling and correction increases data reliability. 

RoHS-Compliant: This part meets internationally recognized Pb-free standards, including RoHS. 

PDF RoHS Certificate of Compliance
PDF China RoHS Certificate

Orderable Part Part
Status
SPD
Data
MB
Qual
Buy
Samples
Distributor
Stock
MT18HTF25672FDY-80EG1D6 EOL Pending View View Contact Rep Contact Rep
Micron recommends MT18HTF25672FDZ-80EH1D6 .
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MT18HTF25672FDY-80EG1N8 EOL Pending View View Contact Rep Contact Rep
Micron recommends MT18HTF25672FDZ-80EH1N8 .
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Please note: Distributor inventory is an estimate and may not reflect actual available inventory.

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Product Support

File Title and Description ID Number Last Update
pdf RoHS Certificate of Compliance - Provides EU-RoHS certification information for Micron products Apr 2008
pdf Micron RoHS, Green, and Pb-free Products - Presentation describing Micron's compliance to RoHS and other environmental directives May 2006
pdf CSN-11: Product Marks/Product and Packaging Labels - Explains product part marking, and product and packaging labels CSN-11 Jan 2010
pdf CSN-04: Shipping Quantities and Weights - Provides tables of shipping weight per part quantity CSN-04 Jan 2009
pdf CSN-12: Product Change Notification (PCN) System CSN-12 Oct 2008
pdf CSN-23: Proper Handling Procedures for Micron DRAM Modules - Includes procedures for how to properly handle modules CSN-23 Dec 2007
pdf CSN-16: Micron® Packaging - Explanation of Micron packaging labels and procedures CSN-16 Aug 2007
pdf CSN-17: Packaging Materials - Packaging specifications and materials descriptions CSN-17 Jun 2006
pdf CSN-15: Tape-and-Reel Procedures - Specifications for Micron’s tape-and-reel offerings CSN-15 Mar 2006
pdf CSN-06: Electronic Data Interchange - EDI transmission sets, protocol, and contacts CSN-06 Sep 2004
pdf CSN-07: Returned Material Authorization (RMA) Procedures - Outlines standard returned material authorization (RMA) procedures, as well as the differences associated with bare die RMAs CSN-07 Aug 2004
pdf CSN-21: Pin 1 Orientation for Tray, Tube, and Tape-and-Reel Packaging CSN-21 May 2004
pdf CSN-08: ISO System Management Standards CSN-08 Apr 2004
xls DDR2 SDRAM System-Power Calculator - Calculates the power consumed by a DDR2 SDRAM based on system use parameters and the device data sheet Mar 2007
pdf Accelerate Design Cycles with SIM Models TN-00-09 Feb 2010
pdf Module Pinout Decoder - Provides sorted pin assignment tables and pin location figures for use in DDR2 DIMM signal identification, tracing, and troubleshooting TN-47-03 Jan 2010
pdf FBDIMM – Channel Utilization (Bandwidth and Power) - Newly introduced FBDIMMs offer virtually unlimited scalability of density, a significantly reduced number of routed motherboard signals, and high bandwidth solutions, all with an extremely reliable channel protocol. TN-47-21 Jan 2010
pdf Design Guide for Two-DIMM, Unbuffered Systems - DDR2-533 memory design guide for two-DIMM, unbuffered systems TN-47-01 Dec 2009
pdf Understanding Signal Integrity - Describes how memory design, test, and verification tools can be used to the greatest advantage, from conception of a new product through end of life TN-00-20 Dec 2009
pdf Bypass Capacitor Selection for High-Speed Designs TN-00-06 Dec 2009
pdf IBIS Behavioral Models TN-00-07 Nov 2009
pdf Understanding the Quality and Reliability Requirements for Bare Die Applications TN-00-14 Oct 2009
pdf DRAM Module Form Factors - Compares the most common DRAM module form factors TN-04-55 Sep 2009
pdf Memory Module Serial Presence-Detect - Describes how SDP is essential in helping to standardize the configuration, timing, and manufacturing information of memory modules TN-04-42 Oct 2008
pdf Designing for 1.5V, Low-Power FBDIMMs - Discusses memory power trends and identifies new low-voltage solutions for high-density DDR2 memory designs TN-47-22 Sep 2008
pdf Uprating of Semiconductors for High-Temperature Applications - Describes the issues associated with temperature uprating and the risks involved in using components and/or systems outside the manufacturer’s environmental specifications TN-00-18 May 2008
pdf Thermal Applications - Defines a general method and criteria for measuring and ensuring that Micron components and modules do not exceed the maximum allowable temperature. TN-00-08 May 2008
pdf Recommended Soldering Parameters TN-00-15 Mar 2007
pdf Moisture Absorption in Plastic Packages - Describes the shipping procedures that ensure Micron’s customers receive memory devices that do not exhibit the popcorn effect TN-00-01 Mar 2007
pdf DDR2 SODIMM Optimized Address/Command Nets - Provides the system-level designer with an overview of the DDR2 SODIMM family and offers insight into termination techniques utilized on the commands and addresses for these modules TN-47-17 May 2005
pdf DDR2 tCKE Power-Down Requirement - Describes the tCKE timing parameter of DDR2 SDRAM TN-47-14 Dec 2004
pdf DDR2 Simulation Support - Covers DDR2 simulation, adding to Micron's extensive array of design support tools for system designers TN-47-07 Aug 2004

Product Information

File Title and Description ID Number Last Update
pdf Micron’s Aspen Memory® Technology Flyer - Describes the power-saving solutions of Aspen Memory technology May 2008
pdf DDR Motherboard Design Jan 2000
video DDR2 Power Calculator - Introduction to Micron’s DDR2 system power calculator. Provides insight into how DDR2 SDRAM consumes power and enables system designers to more accurately estimate power consumption in a system. Apr 2004
pdf The Power Demands of Data Centers Require Memory Innovations Apr 2007

Product Selection

File Title and Description ID Number Last Update
html Module/Motherboard Testing - Micron qualification test results for various OEM motherboards Jun 2008
pdf DDR3/DDR2/DDR/SDR SDRAM Module Part Numbering Guide - Part numbering chart for Micron memory modules  Sep 2009