2GB DDR3 SDRAM SODIMM : MT16JSF25664HY-1G1

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Part end of life

Illustration only. See data sheet for product specifications.

Specifications

Technology:
DDR3 SDRAM
Density:
2GB
Part Status:
End of Life
RoHS:
Yes
Comp. Count:
16
Depth:
256Mb
Width:
x64
Pin Count:
204-pin
Op. Temp.:
0C to +95C
Data Rate:
1066 MT/s
Speed:
PC3-8500
CL:
CL = 7
Voltage:
1.5V
Comp. Config:
128 Meg x 8
ECC:
Non ECC
Module Ranks:
Dual Rank
Register:
Non Parity

Description

This part is not recommended for new designs.

 The narrow SODIMM form factor (67.6mm long) is designed for applications where board space is at a premium. 

RoHS-Compliant: This part meets internationally recognized Pb-free standards, including RoHS. 

PDF RoHS Certificate of Compliance
PDF China RoHS Certificate

Orderable Part Part
Status
SPD
Data
MB
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Please note: Distributor inventory is an estimate and may not reflect actual available inventory.

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Product Support

File Title and Description ID Number Last Update
pdf RoHS Certificate of Compliance - Provides EU-RoHS certification information for Micron products Apr 2008
pdf Micron RoHS, Green, and Pb-free Products - Presentation describing Micron's compliance to RoHS and other environmental directives May 2006
pdf CSN-11: Product Marks/Product and Packaging Labels - Explains product part marking, and product and packaging labels CSN-11 Jan 2010
pdf CSN-04: Shipping Quantities and Weights - Provides tables of shipping weight per part quantity CSN-04 Jan 2009
pdf CSN-12: Product Change Notification (PCN) System CSN-12 Oct 2008
pdf CSN-23: Proper Handling Procedures for Micron DRAM Modules - Includes procedures for how to properly handle modules CSN-23 Dec 2007
pdf CSN-16: Micron® Packaging - Explanation of Micron packaging labels and procedures CSN-16 Aug 2007
pdf CSN-17: Packaging Materials - Packaging specifications and materials descriptions CSN-17 Jun 2006
pdf CSN-15: Tape-and-Reel Procedures - Specifications for Micron’s tape-and-reel offerings CSN-15 Mar 2006
pdf CSN-06: Electronic Data Interchange - EDI transmission sets, protocol, and contacts CSN-06 Sep 2004
pdf CSN-07: Returned Material Authorization (RMA) Procedures - Outlines standard returned material authorization (RMA) procedures, as well as the differences associated with bare die RMAs CSN-07 Aug 2004
pdf CSN-21: Pin 1 Orientation for Tray, Tube, and Tape-and-Reel Packaging CSN-21 May 2004
pdf CSN-08: ISO System Management Standards CSN-08 Apr 2004
pdf Accelerate Design Cycles with SIM Models TN-00-09 Feb 2010
pdf Moisture Absorption in Plastic Packages - Describes the shipping procedures that ensure Micron’s customers receive memory devices that do not exhibit the popcorn effect TN-00-01 Feb 2010
pdf Understanding Signal Integrity - Describes how memory design, test, and verification tools can be used to the greatest advantage, from conception of a new product through end of life TN-00-20 Dec 2009
pdf Bypass Capacitor Selection for High-Speed Designs TN-00-06 Dec 2009
pdf IBIS Behavioral Models TN-00-07 Nov 2009
pdf Understanding the Quality and Reliability Requirements for Bare Die Applications TN-00-14 Oct 2009
pdf DRAM Module Form Factors - Compares the most common DRAM module form factors TN-04-55 Sep 2009
pdf Uprating of Semiconductors for High-Temperature Applications - Describes the issues associated with temperature uprating and the risks involved in using components and/or systems outside the manufacturer’s environmental specifications TN-00-18 May 2008
pdf Thermal Applications - Defines a general method and criteria for measuring and ensuring that Micron components and modules do not exceed the maximum allowable temperature. TN-00-08 May 2008
pdf Recommended Soldering Parameters TN-00-15 Mar 2007

Product Selection

File Title and Description ID Number Last Update
html Module/Motherboard Testing - Micron qualification test results for various OEM motherboards Jun 2008
pdf DDR3/DDR2/DDR/SDR SDRAM Module Part Numbering Guide - Part numbering chart for Micron memory modules  Sep 2009