VLP RDIMMs Designed for Servers and Networking
Our very low profile RDIMMs (VLP RDIMMs) make server designs more compact, freeing up as much as 67% of the space usually allotted to memory. VLP RDIMMs deliver all of the performance you need for networking or server applications while improving airflow and slashing thermal power consumption. The low profile of these industry-standard VLP RDIMMs allow the modules to be placed vertically on the board, significantly reducing the amount of space required for memory compared to standard DIMMs.
VLP RDIMM Part Catalog and Documentation
Tech Support for your VLP RDIMM
We aim to provide you with the best technical support in the memory-making business. To that end, we offer detailed technical notes, the best data sheets in the industry, simulation models, calculators, development tools, and expert application and field engineers. We provide all these resources to ensure that you have the tools you need to easily design in our high–quality memory.
Visit our Design Support section.
Data centers are becoming increasingly more expensive, so fitting more servers into less space is vitally important. Our VLP RDIMMs take up less room on a board. Certainly, memory isn't the only component that contributes to a server's size, but designing in VLP RDIMMs helps save valuable space and money.
According to a study from the U.S. Environmental Protection Agency, keeping servers cool requires about 30 billion kWh annually in the United States alone. Improved airflow in servers could reduce cooling costs, saving data centers tens of millions of dollars, euros, pounds, and yen each year. Our VLP RDIMMs fit vertically on the board, which facilitates better airflow and increases reliability in heat-sensitive systems.
Improve Airflow with Vertically-Mounted Modules
Click the play button below to view how VLP memory modules save board space and improve airflow.
VLP RDIMM Features and Benefits
| Features | Benefits |
| High Density |
Offers high–densities (512MB-8GB) in a small form factor, ideal for server and low-profile applications |
| Flexible Configuration |
Available with parity and ECC support. Register support for control, command, and address signals. Single-, dual-, or quad-rank support. |
| Low voltage |
2.5V or 1.8V offer options for reduced power consumption. |
| Wide temperature range |
Supports operating ranges up to –40°C to +95°C for reliability in tough environments. |
| PLL |
Provides better signal integrity to each component on the module. |
| Buffered clock, command, and address signals |
Reduces the load on memory controller, which ensures signal integrity and enables the system to accommodate the maximum number of modules |
| Simulation Models |
Our convenient thermal and electrical simulation models are available online for easy download |
Get More with VLP RDIMMs
Reliability and Compatibility
We use stringent quality and reliability tests, and we work with chipset vendors to validate our modules ensuring that you get high-quality parts.
Extended Temperature Range
What if your application has to survive a rugged environment? We offer our modules in a range of temperature options so you get great performance and reliability in nearly all conditions.
Why Buy Micron?
- Technology Leader
Micron's manufacturing efficiencies, cutting-edge innovations, and leading patent portfolio lead the industry in technological excellence.
- Product Breadth
With a full line of DRAM components, modules, and NAND Flash products, we have the right device for your design.
- Technical Support
Micron's engineering and technical assistance can provide the competitive advantage you need to get your designs to market faster.
- Quality Products
Stringent quality and reliability testing makes our devices stand out as some of the highest-quality parts in the industry.
- Customer Commitment
We work closely with other vendors, manufacturers, and enablers to help you deliver a complete, proven solution.
- Environmental Certification
All devices are available in Pb-free versions, and many offer the added environmental protection of "green" packaging.