SoC, SiP, PoP, MCP? Choose the Right Die-Stacking Solution
No one die-stacking technology suits every application. Each offers different benefits in terms of four key design elements: board space, height, performance, and cost. Micron senior applications engineer Chris Pages explains the advantages and disadvantages of four popular stacking solutions—SoC, SiP, PoP, and MCP—in this 20-minute online presentation. Let Micron’s expertise help you pick the best technology for your application. Click the "View Now" link below to begin the presentation.
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This presentation is available to Micron.com users; if you’re not yet registered, you’ll be guided through a simple sign-on process.
Package Illustrations
Click the play button on the animations below to view the basic packaging differences between Micron MCPs and PoPs.
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