All-in-One MCPs Are Stacked with Advantages
Sophisticated operating systems, data-intensive applications, and increased multimedia functionality are the heart and soul of high-end mobile handset designs. For handset designers who’ve been feeling the pressure to produce smaller-sized products with more speed and power than ever before, we’re offering a cutting-edge memory-stacking solution—the industry’s first 16GB all-in-one MCP.
Our all-in-one MCPs help increase the capacity, functionality, and performance of high-end mobile handsets by providing the most compact multistacked die package on the market. And they simplify system designs by combining SLC NAND, Mobile LPDDR, and e-MMC™ embedded memory in one package, eliminating the need for an external memory device.
A Closer Look at the Industry’s Highest-Density MCP
Our all-in-one MCP combines eight die in a single package—reducing board space by as much as 40 percent and delivering an unprecedented 16GB of onboard storage. Here’s how it breaks out:
- 16GB e-MMC Embedded Memory
- 2Gb Mobile LPDDR
- 2Gb SLC NAND
To learn more about our all-in-one MCP announcement, read the press release.
Reduce Your Memory Footprint and Save Board Space
Our high-density all-in-one MCP delivers all of your mobile design's memory needs in a single, compact package. As the illustration below shows, a single device requires significantly less board space—reducing the memory footprint by up to 40% in some designs.
High-density, onboard storage is a critical design element for next-generation handsets. Our 16GB all-in-one MCPs deliver superior onboard storage—enabling you to increase storage capacity without sacrificing form factor or performance. As you look for ways to integrate increasingly powerful features and applications into your mobile designs—know that we have all-in-one MCPs that can help make it happen in new and innovative ways.
Our all-in-one MCP solutions reduce board space and decrease the number of parts and vendors involved. They’re simplified, streamlined solutions that can provide the increased storage capacity and computing power needed to enable more features and applications in next-generation, slim form factor handsets.