Mobile DRAM/NAND Flash multichip packages (MCPs) meet the mobile market's increasing demand for high density, small form factor, and low power. Micron's MCPs combine some of the highest-performing mobile memory devices available with advanced known good die (KGD) testing and assembly technologies. Our low-power MCPs deliver the perfect mixture of features and functionality to optimize your applications.
- Small Form Factor: Small footprints and low heights enable ever-smaller and sleeker product designs.
- High Speed: Delivers peak performance for the increasing functionality and advanced features of mobile applications.
With minimized power consumption, maximized board space, and increased speed, mobile applications excel with Micron MCPs.
MCP Part Information
Choose the Right Die-Stacking Solution–Online Presentation
Every die-stacking technology has different strengths among the key design elements of height, footprint, performance, and cost. No one technology suits every application. So how do you choose the right one? Let Micron’s expertise help you pick the best solution for your design. Micron senior applications engineer Chris Pages explains the advantages and disadvantages of four popular stacking solutions in a 20-minute online presentation. Make an informed choice; read more about packaging solutions and view the presentation.
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Mobile DRAM – Ultra Low Power, Specialized Mobile Features
The powerful functionality of Mobile DRAM makes it a key component in our MCP designs. Mobile DRAM delivers an inherently low self refresh current and a myriad of special mobile features that can dramatically reduce power consumption. This leading-edge product line also features a combination of unique design methodologies to deliver low power, high quality, high reliability, and overall robustness to your designs.
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Micron NAND Flash – Standardized Compatibility, High Performance
Micron's tradition of superior quality, innovation, and technological excellence is an integral part of our high-density NAND Flash road map. We use an industry-standard interface for drop-in capability and easy integration into most existing designs. Micron Flash memory also offers high-performance features, including a READ CACHE function that streams more than 30MB per second. Micron offers NAND Flash in densities from 1Gb to 8Gb today, and is actively pursuing plans for densities of 16Gb and greater.
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The platform-independent storage module (PISMO™) specifications provide a standard for creating convenient, interchangeable memory test boards. PISMO boards significantly improve design efficiencies, providing a huge benefit for the short development cycles of consumer products.
Visit the PISMO Support Page to learn how Micron PISMO boards can simplify your memory selection process and shorten design cycles.