Multichip Packages

mcp

Getting More From Your MCP

Whether you’re trying to minimize power consumption, maximize board space, increase speed, or do everything at once, Micron’s MCPs can drive your design no matter the application. Our fully tested, stackable MCPs and PoPs are the small form factors your mobile designs need.

puzzle piecesThe Perfect Match for Matchless Performance

Raising the Bar on Features and Functionality

Form factor, speed, power—your mobile customers want all three. With Micron's MCPs you can respond to customers' ever-increasing demands without compromising leading-edge performance. And you can do it with memory solutions from a manufacturer whose primary focus is semiconductors. And because we manufacture all the memory elements of our MCPs—from the NAND Flash to the Mobile LPDRAM—we can offer MCP/PoP solutions with a variety of packages and technology options; please contact us for inquiries and more information.

Multichip Package Part Catalog and Documentation


Tech Support Throughout Your Design Cycle
Want to simplify NAND integration? Our suite of engineering software and services for MCPs and PoPs makes it easy. We’ve anticipated your technical challenges and collaborated with chipset vendors and OS engineers to solve them. Learn how to optimize your mobile design and ease your development process with our NANDcode™ Software, processor-optimization tech notes, and system compatibility reports. It’s all available to our customers on our Mobile Engineering Secure Site.

  • Processor optimization tech notes detailing chipset memory subsystem register settings
  • Sign up for access to our Mobile Services Site
  • System compatibility reports for various chipsets and operating systems
  • NANDcode™ Software downloads for NAND Flash optimization

Powerful, High-Density NAND Flash
With industry-standard densities, configurations, and interfaces, our NAND Flash enables drop-in compatibility and easy integration. Enable ever-smaller and ever-sleeker product designs with small footprints and low heights, and get the mass storage you need for sequential data, such as pictures, movies, and music. Design with confidence knowing that we've anticipated the technical challenges and collaborated with chipset vendors and operation system engineers to solve them. Streamline time-to-market with experienced, market-specialized design support, and take your designs in new and different directions knowing that we have you covered for everything mobile.

Learn more about NAND Flash

High-Performance Mobile LPDRAM
Our Mobile LPDDR delivers a 1.8V power supply to reduce power consumption, and the 1.2V I/O option available on some devices improves signaling for high-speed, high-bandwidth operation. You can also achieve data transfer rates of 400 Mb/s with parts that deliver clock speeds up to 200 MHz. And with a myriad of package options and a full range of densities, you have the design flexibility and migration path to provide your customers with all the high-performance features and functionality that their mobile needs require.

Learn more about Mobile LPDRAM

Other Key Benefits

Technical Support
Streamline time-to-market with our design expertise, systems understanding, and familiarity with the overall NAND market.

Custom Software Support
Design with confidence knowing that we've anticipated the technical challenges and collaborated with chipset vendors and operation system engineers to solve them.

Micron Engineering Services
NANDcode™ Software
Simplify NAND integration with downloads for NAND Flash optimization.

Compact Footprint
Enable ever-smaller and sleeker product designs with small footprints and low heights.

SoC, SiP, PoP, MCP? Choose the Right Die-Stacking Solution

No one die-stacking technology suits every application. Each offers different benefits in terms of four key design elements: board space, height, performance, and cost. In the 20-minute online presentation titled "Multi-Die Stacking: Choosing the Right Solution," learn the advantages and disadvantages of four popular stacking solutions—SoC, SiP, PoP, and MCP. Let Micron’s experts help you pick the best technology for your application.

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Type Secure Title & Description ID# Updated Size
IBIS Behavioral Models:  Micron has been a member of the IBIS Open Forum for many years and fully supports the IBIS specification. IBIS models for most Micron products are available for download from the Micron Web site. TN-00-07 11/2009 163.98 KB
Thermal Applications:  Defines a general method and criteria for measuring and ensuring that Micron components and modules do not exceed the maximum allowable temperature TN-00-08 05/2010 252.18 KB
Recommended Soldering Parameters:  Defines the recommended soldering techniques and parameters for Micron Technology, Inc., products. TN-00-15 03/2007 69.09 KB
Uprating of Semiconductors for High-Temperature Applications:  Describes the issues associated with temperature uprating and the risks involved in using components and/or systems outside the manufacturer's environmental specifications TN-00-18 05/2010 428.33 KB
Understanding Signal Integrity:  Describes how memory design, test, and verification tools can be used to the greatest advantage, from conception of a new product through end of life TN-00-20 12/2009 1.52 MB
Micron Small Form Factor PoP Helps Gumstix:  Micron's PoP NAND Flash/LPDRAM solution provides performance in small form factor for Gumstix' Linux-based, single-board computers. Case Study 12/2009 171.59 KB
MCP/PoP Part Numbering System:  Part numbering guide for Micron MCP/PoP products. 03/2012 29.42 KB
PCN/EOL Systems:  Explains Micron's product change notification and end-of-life systems. CSN-12 04/2012 79.21 KB
Wafer Packaging and Packaging Materials:  Provides complete shipping and recycling information about each of the materials used for shipping Micron's products. CSN-20 09/2011 776.24 KB
Bare Die SiPs and MCMs:  Describes design considerations for bare die SiPs and MCMs. CSN-18 04/2009 151.06 KB
Shipping Quantities:  Provides tables of part quantity. CSN-04 04/2012 472.27 KB
Micron KGD Definitions:  Describes the testing specifications and parameters for Micron's KGD-C1 and KGD-C2 DRAM die. CSN-22 07/2009 65.52 KB
Micron Component and Module Packaging:  Explanation of Micron packaging labels and procedures. CSN-16 02/2012 887.13 KB
ESD Precautions for Die/Wafer Handling and Assembly:  Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs. CSN-24 08/2010 119.08 KB
Electronic Data Interchange:  Describes EDI transmission sets, protocol, and contacts. CSN-06 09/2005 53.5 KB
RMA Procedures for Packaged Product and Bare Die Devices:  Outlines standard returned material authorization (RMA) procedures, as well as the differences associated with bare die RMAs. CSN-07 10/2010 82.64 KB
ISO System Management Standards:  Describes ISO system management standards. CSN-08 04/2004 39.18 KB
Moisture Absorption in Plastic Packages:  Describes shipping procedures for preventing memory devices from absorbing moisture and recommendations for baking devices exposed to excessive moisture TN-00-01 02/2010 87.26 KB
Accelerate Design Cycles with Simulation Models:  Micron supplies the tools and guidelines necessary to verify new designs prior to layout. This technical note discusses software model support, signal integrity optimization, and logic circuit design. TN-00-09 02/2010 206.91 KB
Micron Wire-Bonding Techniques:  This technical note provides guidance on wire bonding techniques for both nickel-palladium (NiPd) and aluminum (Al) bond pads on Micron products. TN-00-22 11/2010 66.13 KB
TN-10-21: Qualcomm QSC6695 Validation Report:  Rev. 1.0 12/2011 336.51 KB
TN-10-21: Qualcomm QSC6695 Register Settings:  Rev. 1.0 12/2011 482.14 KB
PoP User Guide:  Provides several well-established guidelines for package-on-package (PoP) semiconductor package design and assembly, which requires unique considerations in both the up-front design and the manufacturing process. CSN-34 08/2011 846.18 KB
Micron BGA Manufacturer's User Guide:  Provides information to enable customers to easily integrate both leading-edge and legacy Micron's ball grid array (BGA) packages into their manufacturing processes. It is intended as a set of high-level guidelines and a reference manual describing typical package-related and manufacturing process-flow practices. CSN-33 07/2011 353.32 KB
Product Marks/Product and Packaging Labels:  Explains product part marking, and product and packaging labels. CSN-11 04/2012 724.89 KB
Micron e-MMC Embedded Memory:  Micron's e·MMC embedded memory combines our high-quality,low-cost NAND Flash memory with a high-speed MultiMediaCard (MMC) controller in a low-profile BGA package. Product Flyer 02/2012 163.15 KB
MCP Product Flyer:  An overview of how Micron's MCPs deliver the right combination of form factor, speed, and power. Product Flyer 03/2012 155.96 KB
Bypass Capacitor Selection for High-Speed Designs:  Describes bypass capacitor selection for high-speed designs. TN-00-06 03/2011 481.9 KB

Please Note: To view Secure Documents (Secure Lock) please log in or click on a secured document to request access.

What are your PoP/MCP offerings for x8 NAND and/or x16 Mobile LPDDR?
Our standard offerings are x16 NAND and x32 Mobile LPDDR. We also have x8 NAND and x16 Mobile LPDDR. For the most current information, contact your local Micron support.
We designed in discrete parts, but now we are using PoP parts. They appear to be limited in what speeds we can achieve. What is the problem?
When moving from testing with discrete parts to PoP, care should be taken that no stubs are left from the design containing the discrete components. If needed, a 0 Ohm resistor could isolate the memory from the traces used for the discrete part.
Our contract manufacturer has little experience with PoP. Why should we try something new?
The market is driving the requirement for the smaller PoP form factor, and several contract manufacturers have already enabled this technology. PoP can help save in routing costs and improve signal integrity. Given those cost and performance advantages, Micron recommends that you work very closely with your CM to ensure a good transition to this technology. Micron worked closely with Texas Instruments (TI) on the technical notes PCB Design Guidelines Part I and PCB Assembly Guidelines Part II. These can also help provide guidelines to help you work with your CM for the best success on your conversion to PoP.
What is an MCP? What is a PoP? What is the difference between the two devices?
MCP is multichip package that contains multiple die and can be used by any controller. PoP is a form of an MCP made specifically to stack on top of a processor that has pads on the top side that mate to the ballout of the PoP. Because the PoP package stacks right on top of the processor, it eliminates the need to have traces routed on the PCB and provides better signal integrity. A variety of PoP packages are designed for various processors. PoP and MCP devices give designers the ability to take advantage of z space and to provide the flexibility to offer different logic in one package (for example, NAND + Mobile LPDDR or e-MMC™ + NAND + Mobile LPDDR). We have a wide selection of offerings to meet our customer’s needs.
What PoP/MCP parts have been validated with the OMAP35x?
Micron works closely with Texas Instruments (TI) to validate and optimize our parts for the OMAP35x processors. As we work with the OMAP35x team, the list of validated memory devices expands frequently. For the most current information, contact your local Micron support, or contact Micron Product Technical Support. Be sure to select MCP for the quickest response time.
What parts have been validated for TI OMAP processors?
Micron works closely with Texas Instruments (TI) to validate and optimize our parts for the OMAP35x processors. As we work with the OMAP35x team, the list of validated memory devices expands frequently. For the most current information, contact your local Micron support, or send an e-mail to mcpsupport@micron.com.
What is the maximum amount of memory that Micron can support on the OMAP35x processors?
Micron works closely with Texas Instruments (TI) to validate and optimize our parts for the OMAP35x processors. As we work with the OMAP35x team, the list of validated memory devices expands frequently. For the most current information, contact your local Micron support, or send an e-mail to mcpsupport@micron.com.
Do you have any reliability data on the PoP?
Yes. We do have reliability data on the PoP. Contact Micron for more information.
Do I use only Mobile LPDDR with the OMAP35x, or can I use a standard SDR/DDR/DDR2/DDR3 part?
The OMAP35x is only compatible with Mobile LPDRAM. Standard SDR/DDR/DDR2/DDR3 is not supported.
Can I use a discrete package with the OMAP35x?
The PoP versions of the OMAP35x (package designations, CBC and CBB) are specifically designed to take advantage of the PoP interface for the NAND and Mobile LPDDR signals through the top of the OMAP package. However, you can route the NAND and Mobile LPDDR signals out of the bottom of the OMAP to a discrete package. The nonPoP OMAP35x package (package designation CUS) is specifically designed to use discrete memory packages.
For a PoP/MCP, does the qualification testing at the factory differ from testing on the discrete components?
No. the PoP/MCP parts undergo the same qualification testing as the discrete components.
I’ve heard that opting for a PoP/MCP solution is more expensive than using discretes, so why should I use it?
From a system-solution perspective, because the PoP mates directly onto the processor, it eliminates the need to have traces routed on the PCB. This saves costs for the customer, as well as provides better signal integrity.
I am using the Logic Zoom OMAP35x kit. What is the Micron part number for the part used on this platform?
The Logic Zoom OMAP35x kit uses our NAND + Mobile LPDDR PoP combination parts, and the densities vary depending on which Logic Zoom OMAP35x kit that you have. Type the second 5-digit alphanumeric code on the physical part into our FBGA Decoder, which will provide you with the corresponding Micron part number.
How do I know the Micron part number for the part on the Beagle Board?
The Beagle Board uses our NAND + Mobile LPDDR PoP combination parts, and the densities vary depending on which version of the Beagle Board you have. Type the second 5-digit alphanumeric code on the physical part into our FBGA Decoder, which will provide you with the corresponding Micron part number.

Multichip Packages

Related Information