A Low-Cost Embedded Storage Option
Our eUSBs are a lot smaller, more durable, and easier to design in than HDDs. They combine flexibility, performance, and fast time-to-market, and they cost less than traditional HDDs. With those features, eUSBs are a great example of a better, faster, and less expensive NAND solution that offers distinct competitive advantages for your embedded designs.
And with no moving parts, the reliability of our RealSSD eUSBs far surpass many of the best-in-class, rugged HDDs. They can sustain 500G shocks and operate within extended and industrial temperature ranges.
- Costs less to implement than even the least expensive HDDs.
- Smaller than a 1.8-inch HDD, an embedded USB lets you pack more features into less space.
- Withstands extreme shock and vibrations and has a wider operating temperature range than competing technologies, ensuring higher reliability in demanding environments.
- Draws less than 330mW of power when actively reading or writing data.
- Enables faster boot-up (access time) than many HDDs, and the USB interface is already defined in most boot sequencers.
Featured Article
eUSB Tech Note
The Micron embedded USB SSD provides commands that enable the host controller to determine the useful life remaining on the device and to retrieve Flash ID information.
Download Tech Note
Micron Memory in the Cloud
Justin Sykes, General Manager of Client SSDs at Micron Technology discusses memory in the Cloud and storage for personal devices.
For Embedded USB (5)
For Managed NAND (0)
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For Products and Support (15)
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Product Marks/Product and Packaging Labels: (PDF 1.15 MB)Explains product part marking, and product and packaging labels.
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CSN-11
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05/2013
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Customer Service Note |
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Shipping Quantities: (PDF 1.31 MB)Provides tables of part quantity.
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CSN-04
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05/2013
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Customer Service Note |
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Thermal Applications: (PDF 253.94 KB)Describes some considerations in thermal applications for Micron memory devices
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TN-00-08
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04/2013
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Technical Note |
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Moisture Absorption in Plastic Packages: (PDF 97.08 KB)Describes shipping procedures for preventing memory devices from absorbing moisture and recommendations for baking devices exposed to excessive moisture
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TN-00-01
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02/2013
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Technical Note |
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Micron Component and Module Packaging: (PDF 1.41 MB)Explanation of Micron packaging labels and procedures.
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CSN-16
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01/2013
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Customer Service Note |
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Micron BGA Manufacturer's User Guide: (PDF 388.76 KB)Provides information to enable customers to easily integrate both leading-edge and legacy Micron's ball grid array (BGA) packages into their manufacturing processes. It is intended as a set of high-level guidelines and a reference manual describing typical package-related and manufacturing process-flow practices.
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CSN-33
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12/2012
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Customer Service Note |
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Electronic Data Interchange: (PDF 52.45 KB)Describes EDI transmission sets, protocol, and contacts.
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CSN-06
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11/2012
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Customer Service Note |
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Wafer Packaging and Packaging Materials: (PDF 591.29 KB)Provides complete shipping and recycling information about each of the materials used for shipping Micron's products.
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CSN-20
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10/2012
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Customer Service Note |
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PCN/EOL Systems: (PDF 79.21 KB)Explains Micron's product change notification and end-of-life systems.
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CSN-12
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04/2012
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Customer Service Note |
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Lead Frame Package User Guidelines: (PDF 245.66 KB)Discusses Micron's lead-frame package options
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CSN-30
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05/2011
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Customer Service Note |
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RMA Procedures for Packaged Product and Bare Die Devices: (PDF 82.64 KB)Outlines standard returned material authorization (RMA) procedures, as well as the differences associated with bare die RMAs.
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CSN-07
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10/2010
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Customer Service Note |
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ESD Precautions for Die/Wafer Handling and Assembly: (PDF 119.08 KB)Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs.
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CSN-24
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08/2010
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Customer Service Note |
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Micron KGD Definitions: (PDF 65.52 KB)Describes the testing specifications and parameters for Micron's KGD-C1 and KGD-C2 DRAM die.
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CSN-22
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07/2009
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Customer Service Note |
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Bare Die SiPs and MCMs: (PDF 151.06 KB)Describes design considerations for bare die SiPs and MCMs.
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CSN-18
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04/2009
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Customer Service Note |
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ISO System Management Standards: (PDF 39.18 KB)Describes ISO system management standards.
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CSN-08
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04/2004
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Customer Service Note |
Please Note: To view Secure Documents (
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Can I use the eUSB as a boot device?
Yes, Micron’s eUSB can be used as the Operating System boot and main storage device. The application’s BIOS must support this feature. This isn’t a concern for most systems that have been manufactured in the last five years and support USB 2.0. In either the main storage or boot mode, the eUSB is recognized as a fixed hard drive in the system.
Does Micron offer the eUSB with a 3.3V option?
Yes. Please check the part catalog for Micron’s offering.
Does Micron provide a way for me to retrieve Flash ID information to determine the useful life remaining on the device?
Yes, there is a tech note available upon request to
Micron Sales and Support. This document provides commands that enable the host controller to retrieve Flash ID information with regards to bad block count, spare block count, erase count, and FlashIDBuf data. This data can be used to help determine the useful life of the eUSB.
How does the eUSB attach to my system board?
The eUSB device has a 10-pin (2x5) USB female connector compatible with the industry standard 10-pin connector found on most motherboards today. A mounting hole is also provided on the PCB to provide for a stable connection to the system board.
Is it possible for me to secure the data on Micron’s eUSB product?
No, Micron’s RealSSD eUSB does not support any security features.
Who do I contact if I have questions about my buymicron.com order?
If you have any questions about your order, contact
buymicron.com.
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