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e·MMC Memory for the Embedded World


The Challenges of Scaling Nonvolatile Memory in Embedded Systems

Download the white paper

Our e·MMC embedded memory combines a high-capacity NAND Flash memory device with a high-speed, MultiMediaCard (MMC) controller in a single BGA package. This single-package solution is a great choice for designers who are looking for MMC-like, application-to-application interoperability in a wide range of consumer, networking, industrial, and automotive applications. And because we manufacture the NAND components, we can offer e·MMC memory solutions in a variety of densities and options.

Automotive-Qualified e·MMC Memory

Our industrial temperature e·MMC memory is built with world-class quality and reliability to achieve ISO/TS certification. It’s a fully managed solution with a built-in controller and an industry-standard interface, which simplifies hardware and software integration and streamlines the development and qualification process.

Automotive-qualified e·MMC memory is ideal for navigation and infotainment applications, such as detailed 3D maps, traffic monitoring, meteorological information, car radio, satellite radio, E-call, voice recognition, and multimedia.

Topics Relating to e·MMC™ Memory
Automotive Solutions

Automotive Solutions

Get a long-term partner with a complete portfolio of stable and reliable automotive solutions and the technical expertise to help optimize your design.

   Learn more about Automotive Solutions

  • Compact footprint
  • Stringently tested for quality and reliability
  • Available in a wide range of configurations and densities
  • Powerful, high-density NAND Flash that enables drop-in compatibility
  • Provides a seamless transition from SLC NAND to MLC NAND
  • Streamlines the development and qualification process
  • Easy-to-use FBGA package
  • High-performance controller
  • JEDEC-standard 4.41 e·MMC interface
  • Standard and extended temperature ranges
  • Flexible configuration to meet key automotive requirements related to performance, reliability, and data protection

Easy to Design In
Our e·MMC embedded memory essentially transforms a program/erase/read device like NAND Flash into a simple write/read memory. This managed interface addresses potential NAND design concerns internally, using error correction code (ECC), wear leveling, and bad block management technology. Handling errors internally takes the burden off the host controller and increases speed, providing higher system performance.

Comparing NAND Flash and eMMC

Streamlined Development and Qualification
e·MMC embedded memory also simplifies hardware and software integration by providing a standard interface specification that minimizes the need for host software to accommodate process node migrations and vendor-specific NAND Flash characteristics. It’s a consistent, technology-independent solution that streamlines the development and qualification process and alleviates complexities of designing in current and future NAND devices.

Package JEDEC-standard BGA153/169-balls and BGA100-balls
Eases the design and validation process

JEDEC-standard, compliant with the e.MMC 4.41 specification


3.3 VCC (3.3V/1.8V VCCQ) Standard operating and I/O voltages
Densities 2GB–64GB Wide density range
Speed Up to 52 MB/s Provides high system performance
Temperature Ranges
25°C to +85°C Extended temperature range is ideal for rugged  environments and industrial applications
-40C to +85C
Internal Error Correction
ECC covering MLC technology inside Increases speed by taking the burden off the host controller
Enhanced mode Pseudo SLC (pSLC) partitions
Top reliability for code and system data
Power-failure protection Enabled by customer Data integrity




For e-MMC (19)
Title & Description Secure ID# Updated Type
Micron e·MMC: Simplified Solutions for Automotive, Industrial, and Consumer Applications: (PDF 469.67 KB) Our e·MMC offers quick system integration for automotive, industrial, and consumer applications. 10/2014 Product Flyer
Industrial and Multimarket Application Memory Flyer: (PDF 398.61 KB) Our extensive and stable portfolio of IMM-focused memory solutions empower technology developments in automotive, industrial, medical, manufacturing, and other multimarket segments. 09/2014 Product Flyer
TN-FC-37: Embedded eMMC v4.51 HEALTH STATUS Command Set: (PDF 192.72 KB)This technical note discusses how the HEALTH STATUS command set can be used to help monitor device media usage and length of time device can still be cycled. TN-FC-37 09/2014 Technical Note
TN-FC-35: e·MMC PCB Design Guide: (PDF 246.57 KB)A guide for PCB designers using Micron e·MMC devices TN-FC-35 08/2014 Technical Note
TN-FC-32: e·MMC Memory Device Health Report: (PDF 227.8 KB)This technical note describes the Device Health Report procedure for Micron e·MMC memory devices. TN-FC-32 07/2014 Technical Note
TN-FC-19: eMMC HEALTH STATUS Command Set: (PDF 218.23 KB)This technical note discusses the HEALTH STATUS command set provided for Micron e·MMC devices TN-FC-19 07/2014 Technical Note
TN-FC-34: e·MMC Data Integrity during Power Off: (PDF 199.81 KB)Describes how to ensure the integrity of internal system data and user data in the Micron e·MMC device during power off TN-FC-34 07/2014 Technical Note
Micron e·MMC Embedded Memory for Mobile Applications: (PDF 214.64 KB) Micron's e·MMC embedded memory, which combines our high-quality,low-cost NAND Flash memory with a high-speed MultiMediaCard (MMC) controller in a low-profile BGA package, is an ideal mass storage solution for mobile applications. 05/2014 Product Flyer
TN-FC-25: Understanding Linux Driver Support for e•MMC: (PDF 517.72 KB)This technical note provides a basic understanding of Linux driver support for block devices where e·MMC™ embedded memory is used. Example code: emmc_test.c TN-FC-25 04/2014 Technical Note
TN-FC-27: e·MMC Power Loss Data Integrity: (PDF 308.03 KB)Describes how to ensure the integrity of internal system data and user data in the Micron e·MMC device during power loss TN-FC-27 12/2013 Technical Note
The Challenges of Scaling Nonvolatile Memory in Embedded Systems: (PDF 386.41 KB) This paper discusses how e•MMC embedded memory simplifies high-capacity storage by providing all the necessary NAND functions in an easy-to-use BGA package and saving significant resources that would otherwise be allocated to hardware and software development. It also introduces JEDEC 4.51 key features that will be supported in future Micron e•MMC products. 07/2013 White Paper
Networking Solutions Guide: (PDF 240.27 KB)This guide outlines Micron’s various solutions—from DRAM components and modules to NOR and NAND Flash to solid state drives (SSDs)—available for networking applications. 06/2013 Product Flyer
TN-FC-06 Booting from eMMC – JEDEC v. 4.41: (PDF 210.15 KB)This technical note describes the features of booting a system from an embedded MultiMediaCard (eMMC) device. It discusses the boot capabilities introduced in the 4.41 version of the JEDEC eMMC specification and explains how to configure an eMMC device to have the required booting features, program and verify boot code on an eMMC device, and perform a boot operation to send boot data to the host. TN-FC-06 04/2013 Technical Note
TN-52-05: e·MMC Linux Enablement: (PDF 301.57 KB)This technical note describes supported and unsupported e·MMC features and how to enable them in Linux. It includes a discussion of the e·MMC standard (4.41) introduced in March 2010. TN-52-05 04/2013 Technical Note
TN-FC-16: e•MMC BUFFER BLOCKS REFRESH Command: (PDF 114.5 KB)Micron Technical Note: e•MMC BUFFER BLOCKS REFRESH Command TN-FC-16 09/2012 Technical Note
TN-FC-13: How to Connect e•MMC 4.41 to Host Interface: (PDF 99.9 KB)The schematic parameters and values be considered when connecting Micron’s e•MMC 4.41 to a host interface. TN-FC-13 09/2012 Technical Note
TN-FC-08: Migrating from e·MMC Version 4.4 to 4.41: (PDF 190.93 KB)Describes the changes to the JEDEC e•MMC specification from version 4.4 to version 4.41 TN-FC-08 08/2012 Technical Note
Micron Introduces 100-Ball BGA, 1.0mm Ball Pitch Package Interface: (PDF 140.82 KB)Micron's 100-ball BGA, 1.0mm pitch package interface for e·MMC embedded memory specifically addresses the needs of the embedded market. 07/2012 Technical Marketing Brief
TN-52-07 eMMC Partitioning: (PDF 206.47 KB)This technical note is a guide for partitioning an eMMC device according to the 4.41 version of the JEDEC specification. It discusses how to set a physical partition configuration, how to set a general or enhanced partition, and how to access a partition, as well as a detailed explanation of the registers used in partitioning. TN-52-07 05/2012 Technical Note
For Managed NAND (1)
Title & Description Secure ID# Updated Type
Nonvolatile Memory for Multiple Markets : (PDF 177.33 KB)Describes why Micron NVM is the best fit for your applications 01/2014 Product Flyer
For Products and Support (14)
Title & Description Secure ID# Updated Type
Micron Component and Module Packaging: (PDF 1.35 MB)Explanation of Micron packaging labels and procedures. CSN-16 11/2014 Customer Service Note
Product Marks/Product and Packaging Labels: (PDF 1.58 MB)Explains product part marking, and product and packaging labels. CSN-11 10/2014 Customer Service Note
Shipping Quantities: (PDF 1.22 MB)Provides standard part quantities for shipping. CSN-04 03/2014 Customer Service Note
RMA Procedures for Packaged Product and Bare Die Devices: (PDF 76.22 KB)Outlines standard returned material authorization (RMA) procedures, as well as the differences associated with bare die RMAs. CSN-07 01/2014 Customer Service Note
Wafer Packaging and Packaging Materials: (PDF 591.42 KB)Provides complete shipping and recycling information about each of the materials used for shipping Micron's products. CSN-20 11/2013 Customer Service Note
Thermal Applications: (PDF 246.79 KB)Describes some considerations in thermal applications for Micron memory devices TN-00-08 07/2013 Technical Note
Moisture Absorption in Plastic Packages: (PDF 97.08 KB)Describes shipping procedures for preventing memory devices from absorbing moisture and recommendations for baking devices exposed to excessive moisture TN-00-01 02/2013 Technical Note
Micron BGA Manufacturer's User Guide: (PDF 388.76 KB)Provides information to enable customers to easily integrate both leading-edge and legacy Micron's ball grid array (BGA) packages into their manufacturing processes. It is intended as a set of high-level guidelines and a reference manual describing typical package-related and manufacturing process-flow practices. CSN-33 12/2012 Customer Service Note
Electronic Data Interchange: (PDF 52.45 KB)Describes EDI transmission sets, protocol, and contacts. CSN-06 11/2012 Customer Service Note
PCN/EOL Systems: (PDF 79.21 KB)Explains Micron's product change notification and end-of-life systems. CSN-12 04/2012 Customer Service Note
Lead Frame Package User Guidelines: (PDF 245.66 KB)Discusses Micron's lead-frame package options CSN-30 05/2011 Customer Service Note
ESD Precautions for Die/Wafer Handling and Assembly: (PDF 120.81 KB)Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs. CSN-24 08/2010 Customer Service Note
Micron KGD Definitions: (PDF 65.52 KB)Describes the testing specifications and parameters for Micron's KGD-C1 and KGD-C2 DRAM die. CSN-22 07/2009 Customer Service Note
Bare Die SiPs and MCMs: (PDF 151.06 KB)Describes design considerations for bare die SiPs and MCMs. CSN-18 04/2009 Customer Service Note

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e-MMC FAQs (17)

What is e.MMC?

Embedded MultiMediaCard (e.MMC) is a NAND Flash-based memory solution defined by JEDEC that comes in a small BGA package. JEDEC defines both the hardware and software, enabling easy customer design-in and the ability to multisource.

What are the benefits of e.MMC?

e•MMC is a fully managed solution (all media management and ECC are handled internally), making NAND technology transitions invisible to the host and providing customers with the ability to reduce their time-to-market and to sustain products longer and more easily.

What does the term "broad market" signify?

Our embedded market e.MMC products are divided into two families: automotive and broad market. This is due to the unique requirements that are required in the automotive market; thus, there is a separate product line supported by Micron’s automotive team. Broad market covers all other market segments such as consumer, gaming, server, networking, industrial, medical, military, etc. Broad market e.MMC includes two sub-families: WT with commercial temperature grade and IT with an extended temperature range.

How can I order samples?

You can order samples through the Micron Sample Center.

Is it necessary to refer to the JEDEC specification as well as to Micron’s data sheet?

Yes, the JEDEC specification has to be read in conjunction with the data sheet. Micron e•MMC complies with the JEDEC standard; hence, Micron's data sheets provide information that is specific only to Micron’s e•MMC devices.

The JEDEC specification (Standard No. 84-A441) is available at: www.jedec.org/sites/default/files/docs/JESD84-A441.pdf

Are simulation models available?

Yes, IBIS models are available for WT and IT products (JEDEC 153-/169-ball and 100-ball); functional models (such as Verilog) are under evaluation.

What is the e.MMC offering for industrial applications?
Micron is offering an extensive number of solutions for industrial customers, such as five densities and JEDEC-standard BGA 153-/169-ball and custom 100-ball packaging. All of these products will operate in the extended temperature range of -40° to 85°C.
What are the advantages of 100-ball IT e.MMC?

Micron’s 100-ball e•MMC BGA package features a 1.0mm ball pitch for board routing simplification (saving PCB costs) and improved board-level reliability (temp cycling). This solution is particularly attractive to automotive, industrial, and networking market segments. See the following table for additional benefits.

Features of 100-ball eMMC


Large 1.0mm ball pitch

  • Allows for low-cost PCB trace/space designs
  • Simplifies PCB routing
  • Enables a reduction in the number of PCB layers
  • Reduces costs via a lower drill size
  • Lower DAR (drill aspect ratio) for better PCB yields
  • Allows for wider traces for better thermal dissipation

Large 0.45mm nominal ball diameter

  • Provides high PCB board-level reliability
  • Improves surface-mount yields (vs. smaller ball packages)
  • Provides better thermal dissipation

Low ball count (compared to 153-ball e.MMC JEDEC-standard)

  • Allows for easier, low-cost PCB routing
  • Reduces package and PCB costs

100-ball pattern contains 12 mechanical support balls (3 in each corner)

  • Provides excellent PCB board-level reliability
  • Allows for flexible “large package size” variations

Flexible ball-out design

  • Allows for future e.MMC feature upgrades and next-generation technology
Is Micron the only provider of 100-ball IT e.MMC?
Greenliant Systems offers pin-compatible 100-ball IT e.MMC for those customers requiring a second source. The NANDrive GLS85VM e.MMC product family supports the JEDEC 4.4 standard and operates at full industrial temperature of -40°C to +85°C. The product line is targeted for industrial and the broad market. For further information and support contact: www.Greenliant.com.
Does Micron's e.MMC support SPI mode?

Micron’s e.MMC 4.41 products are compliant to the JEDEC standard. JEDEC removed this feature when introducing the e.MMC 4.3 specification; therefore, SPI mode is not supported. 

Is v. 4.41 e.MMC functionality backward-compatible to v. 4.3?
Yes, v. 4.41 functionality is backward-compatible with v. 4.3; a v. 4.41 e.MMC device will work with a v. 4.3 or v. 4.4 MMC host. The v. 4.41 devices support additional features such as boot and RPMB partitions, high-priority interrupt, background operation, write reliability, and enhanced reliable write.
How can I migrate from Micron e.MMC 4.4 to 4.41?

Micron has EOL’d its e.MMC 4.4 offering. Refer to your AE for support. A dedicated technical note “TN-FC-08: Migrating from Micron v. 4.4 e.MMC to 4.41 e.MMC” is available for review.

Is it possible to perform a system boot from e.MMC?

Yes, e•MMC provides two boot partitions to provide fast access to boot code for improved system boot time. Booting from boot partitions can provide access to stored data in ~50ms, whereas booting from the user area can take hundreds of milliseconds. However, in order to utilize the boot partitions, the chipset must be able to support booting from the boot partition. Check with your chipset vendor to understand if booting from the e•MMC boot partitions is supported.

For more information, refer to “TN-FC-06: Booting from Embedded MMC - JEDEC 4.41.”

Does Micron e.MMC support power-loss protection?

Yes, ESG e.MMC devices support static data protection. Devices are shipped from Micron factories as COMBO with a configuration optimized for best write performance. Customers can reconfigure the devices to protect static (previously written) data if there is power loss during a write operation.

What are the enhanced technology features mentioned in JEDEC specification, and what are the benefits?

A part or all of the MLC user space can be configured as pseudo-SLC. The partition offers better reliability, endurance, and performance compared to MLC NAND.

Can I set up partitions within e.MMC to suit different usage models?

The e•MMC specification allows customers to configure the user data area into a maximum of four separate partitions that can each be configured as MLC (default) or enhanced mode (pSLC). Enhanced mode provides better reliability in exchange for twice the space as MLC.

For more information refer to “TN-52-07: e.MMC Partitioning.”

What is the required software support for e.MMC?

e.MMC drivers are generally available on the market due to the fact that it is an industry-standard product.

The e.MMC v. 4.41 standard provides performance, security, and reliability features such as high-priority interrupt and secure erase. These features, such as secure erase and secure trim, require software support from the file system beyond the driver, without which the application call will not reach the storage media via the file system.

Linux supports e.MMC and allows the integration within its subsystems and the Android file system. The advanced features introduced by the JEDEC specification have been supported by patches initially and have only very recently been included in the kernel. See Micron technical note TN-52-05 for details about e.MMC Linux enablement for new features by JEDEC 4.4–4.41.

Proprietary software solutions are available on the market as well.

Products and Support FAQs (1)

Who do I contact if I have questions about my buymicron.com order?
If you have any questions about your order, contact buymicron.com.

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