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Your Innovation, Our Memory

Your Innovation, Our Memory

Emerging technologies require innovation on a whole new scale. See how we partner closely with our customers to gain unique insights about how we can optimize our memory solutions to enable your innovations—and help you change the world.

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Memory for Automotive

Memory for Automotive

Technology is reshaping the concept of driving. Automakers are developing countless new driver-assistance features and systems. See how Micron’s memory solutions are helping to enable these new supercomputing capabilities.

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About Micron

Where there's memory, there's Micron

Engineered for Innovation

For more than 30 years Micron has redefined innovation by designing, developing, and manufacturing some of the world’s most advanced technologies.

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Elpida is Now Micron

Elpida Is Now Micron

With the combined strength of our products, technology, and team members—our customers now have access to the broadest portfolio of best-in-class technology.

About the acquisition

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Create an account to access these benefits:

  • Save part pages
  • Save Data Sheets and other files
  • Create folders to organize your projects
  • Share folders with colleagues
  • Organize secure documents for easy access
  • "Follow" parts to see alerts and updates

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Your workspace is your area to organize and save part pages, data sheets, and links for easy access in the future. You can even start by saving some of the pages you've recently accessed below:

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Paving the Way for Advanced NAND Solutions

ClearNAND Flash is Micron’s response to the industry’s demands for a higher capacity solution that also addresses existing and future ECC concerns. While we’ve been aggressively shrinking our technology processes to meet those demands, we also recognize that process shrinks have a direct effect on NAND performance and endurance and make error correction increasingly difficult to manage.

By applying our intellectual property and memory design expertise to this challenge, we were able to develop ClearNAND Flash. ClearNAND technology is an integrated solution that not only improves performance; it also extends the life of raw NAND by enabling future process generations to be easily adopted and designed in to enterprise, consumer, and computing applications. 

ClearNAND devices are like regular NAND—the interface and package types are the same—but they integrate a controller into that package, along with up to eight NAND devices. The internal controller offloads ECC from the host controller, freeing designers from having to adjust their design every time the NAND changes.


Density Width Voltage Package Pin Count Technology


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x8 3.3V LBGA 100-ball Enhanced ClearNAND


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x8 3.3V LBGA 100-ball Enhanced ClearNAND
  • Industry-leading densities
  • Increased speeds for greater user-perceptible performance
  • Standard interface for interoperability and backward compatibility
  • High endurance for intensive program and erase operations and prolonged memory life
  • Industry-standard packaging for easy density migration


Featured Article

Selecting a Flash Storage Solution

Selecting a Flash Storage Solution

The NOR/NAND Flash guide describes the various Flash technologies and provides a systematic way for the system designer to select the optimal nonvolatile memory solution based on key design considerations.

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ClearNAND Flash—Another Reason NAND is the Best Nonvolatile Memory Available

Get the details about what it is, how it works, and why it's advantageous in this whiteboard overview.



For ClearNAND (3)
Title & Description Secure ID# Updated Type
ClearNAND Flash Memory Flyer: (PDF 245.68 KB)ClearNAND Flash memory reduces ECC complexity, provides better system performance, and is easy to integrate. 09/2012 Product Flyer
Data Design Case Study: (PDF 446.92 KB) 01/2012 Case Study
How ClearNAND Flash Simplifies and Enhances System Designs: (PDF 814.8 KB)Discusses NAND Flash trends and complexities; NAND interface choices; and how Micron's Enhanced ClearNAND Flash helps eliminate the impact of NAND's ever-increasing ECC requirements. 07/2011 White Paper
For Managed NAND (2)
Title & Description Secure ID# Updated Type
Nonvolatile Memory for Multiple Markets : (PDF 177.33 KB)Describes why Micron NVM is the best fit for your applications 01/2014 Product Flyer
FBGA Decoder: Micron's FBGA Part Marking Decoder makes it easier to understand part marking. Tool
For Products and Support (14)
Title & Description Secure ID# Updated Type
Shipping Quantities: (PDF 1.22 MB)Provides standard part quantities for shipping. CSN-04 03/2014 Customer Service Note
RMA Procedures for Packaged Product and Bare Die Devices: (PDF 76.22 KB)Outlines standard returned material authorization (RMA) procedures, as well as the differences associated with bare die RMAs. CSN-07 01/2014 Customer Service Note
Product Marks/Product and Packaging Labels: (PDF 1.39 MB)Explains product part marking, and product and packaging labels. CSN-11 01/2014 Customer Service Note
Wafer Packaging and Packaging Materials: (PDF 591.42 KB)Provides complete shipping and recycling information about each of the materials used for shipping Micron's products. CSN-20 11/2013 Customer Service Note
Thermal Applications: (PDF 246.79 KB)Describes some considerations in thermal applications for Micron memory devices TN-00-08 07/2013 Technical Note
Moisture Absorption in Plastic Packages: (PDF 97.08 KB)Describes shipping procedures for preventing memory devices from absorbing moisture and recommendations for baking devices exposed to excessive moisture TN-00-01 02/2013 Technical Note
Micron Component and Module Packaging: (PDF 1.41 MB)Explanation of Micron packaging labels and procedures. CSN-16 01/2013 Customer Service Note
Micron BGA Manufacturer's User Guide: (PDF 388.76 KB)Provides information to enable customers to easily integrate both leading-edge and legacy Micron's ball grid array (BGA) packages into their manufacturing processes. It is intended as a set of high-level guidelines and a reference manual describing typical package-related and manufacturing process-flow practices. CSN-33 12/2012 Customer Service Note
Electronic Data Interchange: (PDF 52.45 KB)Describes EDI transmission sets, protocol, and contacts. CSN-06 11/2012 Customer Service Note
PCN/EOL Systems: (PDF 79.21 KB)Explains Micron's product change notification and end-of-life systems. CSN-12 04/2012 Customer Service Note
Lead Frame Package User Guidelines: (PDF 245.66 KB)Discusses Micron's lead-frame package options CSN-30 05/2011 Customer Service Note
ESD Precautions for Die/Wafer Handling and Assembly: (PDF 120.81 KB)Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs. CSN-24 08/2010 Customer Service Note
Micron KGD Definitions: (PDF 65.52 KB)Describes the testing specifications and parameters for Micron's KGD-C1 and KGD-C2 DRAM die. CSN-22 07/2009 Customer Service Note
Bare Die SiPs and MCMs: (PDF 151.06 KB)Describes design considerations for bare die SiPs and MCMs. CSN-18 04/2009 Customer Service Note

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If you have any questions about your order, contact buymicron.com.

Not All SSDs Are Created Equal: Optimizing Performance Through Flash Management

July 9, 2013 by Doug Rollins

To get the most out of solid state storage, you must be privy to a little secret: not all solid state drives (SSDs) are created equal. Optimal SSD performance and reliability rely heavily on all of the drive’s parts—the controller, the firmware, and the NAND Flash itself—working and playing nicely together. Well-thought-out and strategic Flash management helps this kindergarten lesson become a storage reality.  As George Crump, lead analyst for Storage Switzerland, d...Read More

See all posts on SSD, NAND, PCIe, Performance, Enterprise, Reliability

Latest Blog Posts

Freescale Forum Attendees Score Free Micron TWRPI Modules

April 21, 2014 by Jim Cooke

Earlier this month, I attended the Freescale Technology Forum (FTF) at the Gaylord Conference Center in Dallas, TX. FTF is a unique networking and learning opportunity for embedded designers. ...Read More

Accelerating System Bandwidth with Serial Memory Solutions Using Hybrid Memory Cube Technology

January 29, 2014 by

For over 4 years, Micron and Altera have been collaborating on HMC technologies. This ongoing work led to the industry’s first demonstration of a working HMC controller, announced last September...Read More