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Your Innovation, Our Memory

Your Innovation, Our Memory

Emerging technologies require innovation on a whole new scale. See how we partner closely with our customers to gain unique insights about how we can optimize our memory solutions to enable your innovations—and help you change the world.

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Memory for Automotive

Memory for Automotive

Technology is reshaping the concept of driving. Automakers are developing countless new driver-assistance features and systems. See how Micron’s memory solutions are helping to enable these new supercomputing capabilities.

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About Micron

Where there's memory, there's Micron

Engineered for Innovation

For more than 30 years Micron has redefined innovation by designing, developing, and manufacturing some of the world’s most advanced technologies.

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Elpida is Now Micron

Elpida Is Now Micron

With the combined strength of our products, technology, and team members—our customers now have access to the broadest portfolio of best-in-class technology.

About the acquisition

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  • Save part pages
  • Save Data Sheets and other files
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Paving the Way for Advanced NAND Solutions

ClearNAND Flash is Micron’s response to the industry’s demands for a higher capacity solution that also addresses existing and future ECC concerns. While we’ve been aggressively shrinking our technology processes to meet those demands, we also recognize that process shrinks have a direct effect on NAND performance and endurance and make error correction increasingly difficult to manage.

By applying our intellectual property and memory design expertise to this challenge, we were able to develop ClearNAND Flash. ClearNAND technology is an integrated solution that not only improves performance; it also extends the life of raw NAND by enabling future process generations to be easily adopted and designed in to enterprise, consumer, and computing applications. 

ClearNAND devices are like regular NAND—the interface and package types are the same—but they integrate a controller into that package, along with up to eight NAND devices. The internal controller offloads ECC from the host controller, freeing designers from having to adjust their design every time the NAND changes.

 

Density Width Voltage Package Pin Count Technology

64GB

See 1 Products
x8 3.3V LBGA 100-ball Enhanced ClearNAND
  • Industry-leading densities
  • Increased speeds for greater user-perceptible performance
  • Standard interface for interoperability and backward compatibility
  • High endurance for intensive program and erase operations and prolonged memory life
  • Industry-standard packaging for easy density migration

 

Featured Article

Selecting a Flash Storage Solution

Selecting a Flash Storage Solution

The NOR/NAND Flash guide describes the various Flash technologies and provides a systematic way for the system designer to select the optimal nonvolatile memory solution based on key design considerations.

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ClearNAND Flash—Another Reason NAND is the Best Nonvolatile Memory Available

Get the details about what it is, how it works, and why it's advantageous in this whiteboard overview.

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For ClearNAND (3)
Title & Description Secure ID# Updated Type
ClearNAND Flash Memory Flyer: (PDF 245.68 KB)ClearNAND Flash memory reduces ECC complexity, provides better system performance, and is easy to integrate. 09/2012 Product Flyer
Data Design Case Study: (PDF 446.92 KB) 01/2012 Case Study
How ClearNAND Flash Simplifies and Enhances System Designs: (PDF 814.8 KB)Discusses NAND Flash trends and complexities; NAND interface choices; and how Micron's Enhanced ClearNAND Flash helps eliminate the impact of NAND's ever-increasing ECC requirements. 07/2011 White Paper
For Managed NAND (2)
Title & Description Secure ID# Updated Type
Nonvolatile Memory for Multiple Markets : (PDF 177.33 KB)Describes why Micron NVM is the best fit for your applications 01/2014 Product Flyer
FBGA Decoder: Micron's FBGA Part Marking Decoder makes it easier to understand part marking. Tool
For Products and Support (14)
Title & Description Secure ID# Updated Type
Product Marks/Product and Packaging Labels: (PDF 1.46 MB)Explains product part marking, and product and packaging labels. CSN-11 07/2014 Customer Service Note
Shipping Quantities: (PDF 1.22 MB)Provides standard part quantities for shipping. CSN-04 03/2014 Customer Service Note
RMA Procedures for Packaged Product and Bare Die Devices: (PDF 76.22 KB)Outlines standard returned material authorization (RMA) procedures, as well as the differences associated with bare die RMAs. CSN-07 01/2014 Customer Service Note
Wafer Packaging and Packaging Materials: (PDF 591.42 KB)Provides complete shipping and recycling information about each of the materials used for shipping Micron's products. CSN-20 11/2013 Customer Service Note
Thermal Applications: (PDF 246.79 KB)Describes some considerations in thermal applications for Micron memory devices TN-00-08 07/2013 Technical Note
Moisture Absorption in Plastic Packages: (PDF 97.08 KB)Describes shipping procedures for preventing memory devices from absorbing moisture and recommendations for baking devices exposed to excessive moisture TN-00-01 02/2013 Technical Note
Micron Component and Module Packaging: (PDF 1.41 MB)Explanation of Micron packaging labels and procedures. CSN-16 01/2013 Customer Service Note
Micron BGA Manufacturer's User Guide: (PDF 388.76 KB)Provides information to enable customers to easily integrate both leading-edge and legacy Micron's ball grid array (BGA) packages into their manufacturing processes. It is intended as a set of high-level guidelines and a reference manual describing typical package-related and manufacturing process-flow practices. CSN-33 12/2012 Customer Service Note
Electronic Data Interchange: (PDF 52.45 KB)Describes EDI transmission sets, protocol, and contacts. CSN-06 11/2012 Customer Service Note
PCN/EOL Systems: (PDF 79.21 KB)Explains Micron's product change notification and end-of-life systems. CSN-12 04/2012 Customer Service Note
Lead Frame Package User Guidelines: (PDF 245.66 KB)Discusses Micron's lead-frame package options CSN-30 05/2011 Customer Service Note
ESD Precautions for Die/Wafer Handling and Assembly: (PDF 120.81 KB)Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs. CSN-24 08/2010 Customer Service Note
Micron KGD Definitions: (PDF 65.52 KB)Describes the testing specifications and parameters for Micron's KGD-C1 and KGD-C2 DRAM die. CSN-22 07/2009 Customer Service Note
Bare Die SiPs and MCMs: (PDF 151.06 KB)Describes design considerations for bare die SiPs and MCMs. CSN-18 04/2009 Customer Service Note

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For ClearNAND (0)
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For Managed NAND (0)
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For Products and Support (0)
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Products and Support FAQs (1)

Who do I contact if I have questions about my buymicron.com order?
If you have any questions about your order, contact buymicron.com.

Micron 16nm NAND Awarded Semiconductor of the Year

July 31, 2014 by Naga Chandrasekaran

Last week, Ramin Ghodsi and I had the honor of accepting TechInsights Semiconductor of the Year award on behalf of our process and product development teams. It’s the second time in a row our NAND process technology has won this award, and marks an important third-party recognition of our cell designs. TechInsights does an exceedingly thorough analysis of the semiconductor design—down to the cellular level—and chooses winners based on the innovation in the design and its impac...Read More

Latest Blog Posts

Why Arira Platforms Built an HMC Evaluation Board

August 1, 2014 by Dan Williams

Dan Williams, Vice President Sales & Marketing / Arira Platforms The Origins Tools and resources for customer testing and evaluation are key to the success of any emerging technology.  ...Read More


Q&A: Three Keys to Choosing the Right Server Flash

June 20, 2014 by Corporate Communication

If your data center applications are struggling to keep pace with user demand, you may be looking to SSDs to close the gap.  While SSDs will generally offer a host of performance advantages over ...Read More