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Memory for Automotive

Memory for Automotive

Technology is reshaping the concept of driving. Automakers are developing countless new driver-assistance features and systems. See how Micron’s memory solutions are helping to enable these new supercomputing capabilities.

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Overview

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Memory for Automotive

Memory for Automotive

Technology is reshaping the concept of driving. Automakers are developing countless new driver-assistance features and systems. See how Micron’s memory solutions are helping to enable these new supercomputing capabilities.

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micron innovations

Micron's Power in Progress

We engineer the innovations that make computing faster, travel safer, healthcare more effective, energy greener and much more.

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About Micron

Where there's memory, there's Micron

Engineered for Innovation

For more than 30 years Micron has redefined innovation by designing, developing, and manufacturing some of the world’s most advanced technologies.

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Micron Chip Camp

Micron Chip Camp

See how the Micron Foundation and volunteers team up for a science and engineering camp for junior high students.

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Paving the Way for Advanced NAND Solutions

ClearNAND Flash is Micron’s response to the industry’s demands for a higher capacity solution that also addresses existing and future ECC concerns. While we’ve been aggressively shrinking our technology processes to meet those demands, we also recognize that process shrinks have a direct effect on NAND performance and endurance and make error correction increasingly difficult to manage.

By applying our intellectual property and memory design expertise to this challenge, we were able to develop ClearNAND Flash. ClearNAND technology is an integrated solution that not only improves performance; it also extends the life of raw NAND by enabling future process generations to be easily adopted and designed in to enterprise, consumer, and computing applications. 

ClearNAND devices are like regular NAND—the interface and package types are the same—but they integrate a controller into that package, along with up to eight NAND devices. The internal controller offloads ECC from the host controller, freeing designers from having to adjust their design every time the NAND changes.

 

  • Industry-leading densities
  • Increased speeds for greater user-perceptible performance
  • Standard interface for interoperability and backward compatibility
  • High endurance for intensive program and erase operations and prolonged memory life
  • Industry-standard packaging for easy density migration

 

Featured Article

Selecting a Flash Storage Solution

Selecting a Flash Storage Solution

This guide describes the various Flash technologies and provides a systematic way for the system designer to select the optimal nonvolatile memory solution based on key design considerations.

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ClearNAND Flash—Another Reason NAND is the Best Nonvolatile Memory Available

Get the details about what it is, how it works, and why it's advantageous in this whiteboard overview.

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For ClearNAND (3)
Title & Description Secure ID# Updated Type
ClearNAND Flash Memory Flyer: (PDF 245.68 KB)ClearNAND Flash memory reduces ECC complexity, provides better system performance, and is easy to integrate. 09/2012 Product Flyer
Data Design Case Study: (PDF 446.92 KB) 01/2012 Case Study
How ClearNAND Flash Simplifies and Enhances System Designs: (PDF 814.8 KB)Discusses NAND Flash trends and complexities; NAND interface choices; and how Micron's Enhanced ClearNAND Flash helps eliminate the impact of NAND's ever-increasing ECC requirements. 07/2011 White Paper
For Managed NAND (0)
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For Products and Support (14)
Title & Description Secure ID# Updated Type
Product Marks/Product and Packaging Labels: (PDF 1.15 MB)Explains product part marking, and product and packaging labels. CSN-11 05/2013 Customer Service Note
Shipping Quantities: (PDF 1.31 MB)Provides tables of part quantity. CSN-04 05/2013 Customer Service Note
Thermal Applications: (PDF 253.94 KB)Describes some considerations in thermal applications for Micron memory devices TN-00-08 04/2013 Technical Note
Moisture Absorption in Plastic Packages: (PDF 97.08 KB)Describes shipping procedures for preventing memory devices from absorbing moisture and recommendations for baking devices exposed to excessive moisture TN-00-01 02/2013 Technical Note
Micron Component and Module Packaging: (PDF 1.41 MB)Explanation of Micron packaging labels and procedures. CSN-16 01/2013 Customer Service Note
Micron BGA Manufacturer's User Guide: (PDF 388.76 KB)Provides information to enable customers to easily integrate both leading-edge and legacy Micron's ball grid array (BGA) packages into their manufacturing processes. It is intended as a set of high-level guidelines and a reference manual describing typical package-related and manufacturing process-flow practices. CSN-33 12/2012 Customer Service Note
Electronic Data Interchange: (PDF 52.45 KB)Describes EDI transmission sets, protocol, and contacts. CSN-06 11/2012 Customer Service Note
Wafer Packaging and Packaging Materials: (PDF 591.29 KB)Provides complete shipping and recycling information about each of the materials used for shipping Micron's products. CSN-20 10/2012 Customer Service Note
PCN/EOL Systems: (PDF 79.21 KB)Explains Micron's product change notification and end-of-life systems. CSN-12 04/2012 Customer Service Note
Lead Frame Package User Guidelines: (PDF 245.66 KB)Discusses Micron's lead-frame package options CSN-30 05/2011 Customer Service Note
RMA Procedures for Packaged Product and Bare Die Devices: (PDF 82.64 KB)Outlines standard returned material authorization (RMA) procedures, as well as the differences associated with bare die RMAs. CSN-07 10/2010 Customer Service Note
ESD Precautions for Die/Wafer Handling and Assembly: (PDF 119.08 KB)Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs. CSN-24 08/2010 Customer Service Note
Micron KGD Definitions: (PDF 65.52 KB)Describes the testing specifications and parameters for Micron's KGD-C1 and KGD-C2 DRAM die. CSN-22 07/2009 Customer Service Note
Bare Die SiPs and MCMs: (PDF 151.06 KB)Describes design considerations for bare die SiPs and MCMs. CSN-18 04/2009 Customer Service Note

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If you have any questions about your order, contact buymicron.com.

Tame the Boot Storm

May 14, 2013 by Janene Ellefson

Minimize the Impact of Boot Storms

If you manage a network of virtual machines, you’ve probably experienced the negative effects of a boot storm too many times. These virtual storms can occur when a large number of users log in to a virtual desktop infrastructure (VDI) system simultaneously. If the VDI system employs traditional storage, like hard disk drives (HDDs), bandwidth gets overwhelmed quickly. Slow boot times and reduced productivity ensue, often resulting in frustrated and less-efficient users. Our ultra-high band...Read More

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Why Latency Matters

April 30, 2013 by Janene Ellefson

When you think about system performance, you have to think latency. In an IT environment, latency affects everything—from efficiency and throughput, to customer satisfaction and operating costs....Read More

Contemplating the Future of Computing

April 30, 2013 by Richard Murphy

I spoke Friday at the IEEE Workshop on Microelectronics and Electron Devices (WMED) in Boise about a memory-centric vision for the future of computing. This was my first time at this workshop, and I w...Read More