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Micron Products

Short-Reach HMC

Our short-reach (SR) Hybrid Memory Cube (HMC) SERDES PHY form factor provides data throughput unlike any other memory device on the market today. It’s designed for systems that use standard FBGA packaging and is an ideal point-to-point memory solution for ASIC, CPU, and ASSP devices.

Our SR HMC is available in two package sizes. The 31mm x 31mm package provides full 160 GB/s bandwidth. The 16mm x 19.5mm package is available for designs requiring a smaller form factor and is optimal for systems using less-than-full bandwidth.

By Density

View Full Short-Reach HMC Catalog
Density Interface Voltage Package Op. Temp.
4GB 15G SR 1.2V BGA, FBGA 0C to +95C
2GB 15G SR 1.2V BGA, FBGA 0C to +95C

By Application

Performance

Performance

Memory and storage solutions that meet peak performance requirements.

Power Efficiency

Power Efficiency

Optimized energy efficiency that is key for next-generation supercomputers.

Resiliance

Resilience

Highly reliable, rigorously tested devices that meet the demand for efficiency and resiliency.

Big Bandwidth

Bandwidth

Delivers revolutionary results for networking applications.

Resources

Featured Power Calculator

HMC System Power Calculator

Updated: 11/2014

Title & Description Updated Type
Micron Component and Module Packaging (pdf) Explanation of Micron packaging labels and procedures.
(CSN-16)
11/2014 Customer Service Note Add Email
HMC System Power Calculator (xlsm) 11/2014 Power Calculator Add Email
HMC High-Performance Memory Brochure (pdf) Overview of Micron’s Hybrid Memory Cube (HMC), including key benefits, applications, and specifications. 11/2014 Product Flyer Add Email
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On-Package Memory

Intel's Xeon PhiTM Performance Unleashed by Micron's On-Package Memory

Knights Landing, Intel’s next-generation Xeon Phi™ CPU architecture, leverages the fundamental DRAM and stacking technologies found in our Hybrid Memory Cube (HMC) products. This high-performance, on-package memory enables Knights Landing to provide industry-leading performance, energy efficiency, and the reliability, availability, and serviceability (RAS) capabilities essential to the success of high-performance computing (HPC) systems.

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